IP Library Granted Patent US 10,147,569
Granted Patent B1
US 10,147,569 · App. 15/701,169 · Granted Dec 4, 2018

Keyboard backlight module

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Quick Facts
Patent No.
US 10,147,569
App. No.
15/701,169
Granted
Dec 4, 2018
Kind
B1
Abstract

Systems and methods for a keyboard backlight module are described. In some embodiments, a keyboard backlight module may include: a Light Guide Plate (LGP), a reflector coupled to the LGP, and a light bar at least partially sandwiched between the LGP and the reflector.

Claims (19)

1. A keyboard backlight module, comprising:

a Light Guide Plate (LGP);

a reflector coupled to the LGP; and

a light bar at least partially sandwiched between the LGP and the reflector, wherein the light bar includes light emitting diodes (LEDs) mounted on a flexible printed circuit (FPC), wherein a longitudinal edge of the FPC is disposed between the reflector and the LGP, wherein a thickness of a portion of the FPC nearest the longitudinal edge of the FPC is smaller than a thickness of another portion of the FPC under an LED, wherein a thickness of a portion of the reflector nearest a longitudinal edge of the reflector is smaller than a thickness of another portion of the reflector under the LGP, and wherein the longitudinal edge of the FPC extends beyond the longitudinal edge of the reflector such that the FPC overlaps with the reflector and blocks light emitted by the LEDs from entering the longitudinal edge of the reflector.

2. The keyboard backlight module of claim 1 , wherein the LGP includes a substrate forming one or more paths through which visible light travels.

3. The keyboard backlight module of claim 1 , wherein the LGP includes holes disposed in a pattern selected to receive a respective light emitting diode on the light bar.

4. The keyboard backlight module of claim 1 , wherein the reflector includes a layer of white and non-transparent material.

5. A backlit keyboard, comprising:

a plurality of keys; and

a backlight module optically coupled to the plurality of keys, wherein the backlight module further comprises:

a Light Guide Plate (LGP), wherein the LGP includes a substrate having one or more light paths;

a reflector coupled to the LGP; and

a light bar at least partially sandwiched between the LGP and the reflector, wherein the light bar includes light emitting diodes (LEDs) mounted on a flexible printed circuit (FPC), wherein a longitudinal edge of the FPC is disposed between the reflector and the LGP, wherein the longitudinal edge of the FPC extends beyond a longitudinal edge of the reflector such that a portion of the FPC bends over the reflector, wherein a thickness of a portion of the reflector nearest the longitudinal edge of the FPC is smaller than a thickness of another portion of the reflector under the LGP, and wherein the portion of the FPC that bends over the reflector blocks light emitted by the LEDs from entering the longitudinal edge of the reflector.

6. A method for assembling a keyboard backlight module, the method comprising:

coupling a Light Guide Plate (LGP) to a masking layer;

coupling a light bar to the LGP, wherein the light bar includes light emitting diodes (LEDs) mounted on a flexible printed circuit (FPC); and

coupling a reflector layer to the LGP, wherein a longitudinal edge of the FPC is disposed between the reflector and the LGP, wherein a thickness of a portion of the FPC nearest the longitudinal edge of the FPC is smaller than a thickness of another portion of the FPC under an LED, and wherein a thickness of a portion of the reflector layer nearest the longitudinal edge of the FPC is smaller than a thickness of another portion of the reflector layer under the LGP.

7. The method of claim 6 , wherein the other portion of the reflector layer is positioned vertically higher than the other portion of the FPC in the keyboard backlight module.

8. The method of claim 6 , wherein the longitudinal edge of the FPC extends beyond a longitudinal edge of the reflector such that the FPC overlaps with the reflector.

Assignments (8)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (053546/0001) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC IP HOLDING COMPANY LLC
Reel/Frame 071642/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (044535/0109) Recorded May 20, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO WYSE TECHNOLOGY L.L.C.)
Reel/Frame 060753/0414 →
RELEASE OF SECURITY INTEREST AT REEL 044535 FRAME 0001 Recorded Nov 2, 2021
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; WYSE TECHNOLOGY L.L.C.
Reel/Frame 058298/0475 →
SECURITY AGREEMENT Recorded Apr 22, 2020
From: CREDANT TECHNOLOGIES INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 053546/0001 →
SECURITY AGREEMENT Recorded Mar 21, 2019
From: CREDANT TECHNOLOGIES, INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 049452/0223 →
PATENT SECURITY AGREEMENT (NOTES) Recorded Nov 29, 2017
From: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; WYSE TECHNOLOGY L.L.C.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 044535/0109 →
PATENT SECURITY AGREEMENT (CREDIT) Recorded Nov 29, 2017
From: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; WYSE TECHNOLOGY L.L.C.
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS COLLATERAL AGENT
Reel/Frame 044535/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 11, 2017
From: HUANG, WEN-PIN; CHANG, ERH-CHIEH; CHEN, CHIH-HAO
To: DELL PRODUCTS, L.P.
Reel/Frame 043548/0779 →