LED package structure and LED light-emitting device
View Patent ↗The present disclosure provides a LED package structure and a LED light-emitting device. The LED package structure comprises a LED chip and a wavelength converting layer covering the LED chip. The wavelength converting layer contains red phosphor, which has lower amount in edge portion than in center portion. It is possible to avoid direct or indirect excitation for generating red light in edge portion of the LED chip by adjusting the amount of red phosphor in edge portion to be lower, so that the color temperature in edge portion may be adjusted toward to high color temperature, and thus the phenomenon of yellow halo may be alleviated.
1. A LED package structure, comprising:
a LED chip;
a first wavelength converting sub-layer surrounding said LED chip; and
a second wavelength converting sub-layer above said LED chip and covering said LED chip;
wherein amount of red phosphor in the second wavelength converting sub-layer decreases from a central portion of the LED chip to an edge portion of the LED chip,
wherein the first wavelength converting sub-layer has a first red phosphor mixture ratio, the second wavelength converting sub-layer has a second red phosphor mixture ratio, and said first red phosphor mixture ratio is lower than said second red phosphor mixture ratio.
2. The LED package structure according to claim 1 , wherein
the amount of red phosphor in the second wavelength converting layer decreases as absolute value of emitting angle increases from the central portion to the edge portion of the LED chip.
3. The LED package structure according to claim 2 , wherein the amount of red phosphor is determined by a density of red phosphor and a volume of the second wavelength converting layer.
4. A LED light-emitting device, comprising:
a LED package structure comprising:
a LED chip;
a first wavelength converting sub-layer surrounding said LED chip; and
a second wavelength converting sub-layer above said LED chip and covering said LED chip;
wherein amount of red phosphor in the second wavelength converting sub-layer decreases from a central portion of the LED chip to an edge portion of the LED chip; and
wherein a dominant wavelength of the LED light-emitting device maintaining stable at each emitting angle,
wherein the first wavelength converting sub-layer has a first red phosphor mixture ratio, the second wavelength converting sub-layer has a second red phosphor mixture ratio, and said first red phosphor mixture ratio is lower than said second red phosphor mixture ratio.
5. The LED light-emitting device according to claim 4 , wherein the distribution of phosphor in the second wavelength converting layer is non-uniform.
6. The LED light-emitting device according to claim 5 , wherein a difference between a first dominant wavelength at an emitting angle of 0° and a second dominant wavelength at an emitting angle of 80° is less than 7%.
7. A LED light-emitting device, comprising:
a LED package structure comprising:
a LED chip;
a first wavelength converting sub-layer surrounding said LED chip; and
a second wavelength converting sub-layer above said LED chip and covering said LED chip;
wherein amount of red phosphor in the second wavelength converting sub-layer decreases from a central portion of the LED chip to an edge portion of the LED chip; and
wherein color temperature of the LED light-emitting device maintaining stable at each emitting angle,
wherein the first wavelength converting sub-layer has a first red phosphor mixture ratio, the second wavelength converting sub-layer has a second red phosphor mixture ratio, and said first red phosphor mixture ratio is lower than said second red phosphor mixture ratio.
8. The LED light-emitting device according to claim 7 , wherein the distribution of phosphor in the second wavelength converting layer is non-uniform.
9. The LED light-emitting device according to claim 8 , wherein a difference between a first color temperature at an emitting angle of 0° and a second color temperature at an emitting angle of 80° is less than 7%.
10. The LED package structure according to claim 1 , wherein said second wavelength converting sub-layer is above and covering said first wavelength converting sub-layer.
11. The LED package structure according to claim 1 , wherein said second wavelength converting sub-layer has a convex top surface.
12. The LED package structure according to claim 1 , further comprises a transparent adhesive layer above said second wavelength converting sub-layer.
13. The LED package structure according to claim 1 , wherein said transparent adhesive layer has a concave top surface, convex top surface, or a flat top surface.