IP Library Granted Patent US 10,859,444
Granted Patent B2
US 10,859,444 · App. 15/701,694 · Granted Dec 8, 2020

Determining temperature inside a high pressure cell by evaluating solid solution composition

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,859,444
App. No.
15/701,694
Granted
Dec 8, 2020
Kind
B2
Abstract

A method for the measurement of temperature in high temperature and high pressure processes includes the steps of providing at least a first material compound and at least a second material compound. The at least first and second compounds are mixed to form a material sample. The material sample is loaded into a device and the device and material sample are subjected to a high pressure of up to about 10 GPa and a high temperature of up to about 1700° C. to form the material sample into a solid crystalline solution. The material sample is recovered for analysis and the composition of the crystalline solid solution is measured to determine the temperature.

Claims (14)

1. A method of measuring temperature in a high pressure high temperature (HPHT) process, comprising:

subjecting a quantity of a sensor material to an HPHT process having a pressure of up to about 10 GPa and a temperature of up to about 1700° C. to modify a solid solution composition of the sensor material;

recovering the sensor material from the HPHT process; and

determining the temperature in the HPHT process by evaluating a crystalline structure of the recovered sensor material to determine the solid solution composition of the sensor material.

2. The method of claim 1 , wherein the sensor material comprises at least two compounds.

3. The method of claim 1 , wherein the sensor material is crystalline prior to subjecting the sensor material to the HPHT process.

4. The method of claim 1 , wherein the sensor material is amorphous prior to subjecting the sensor material to the HPHT process.

5. The method of claim 1 , wherein the sensor material comprises TiO 2 and GeO 2 .

6. The method of claim 5 , wherein TiO 2 and GeO 2 are provided in a molar ratio from about 30:70 to about 70:30.

7. The method of claim 5 , wherein TiO 2 and GeO 2 are provided in a molar ratio from about 40:60 to about 60:40.

8. The method of claim 1 , wherein the sensor material exhibits a crystalline lattice structure that corresponds to the solid solution composition.

9. The method of claim 8 , wherein the crystalline lattice structure of the sensor material is evaluated using at least one of electron microprobe, X-ray diffraction, or Raman spectroscopy.

10. The method of claim 8 , further comprising determining a maximum temperature experienced by the sensor material in the HPHT process based on the evaluated crystalline lattice structure of the sensor material.

11. The method of claim 10 , further comprising characterizing a non-uniform maximum temperature experienced by the sensor material in the HPHT process based on a non-uniform crystalline lattice structure of the sensor material.

Assignments (6)
SECURITY INTEREST Recorded Aug 31, 2021
From: DIAMOND INNOVATIONS, INC.
To: UBS AG, STAMFORD BRANCH
Reel/Frame 057388/0971 →
2L PATENT SECURITY RELEASE AGREEMENT Recorded Aug 31, 2021
From: UBS AG, STAMFORD BRANCH
To: DIAMOND INNOVATIONS, INC.
Reel/Frame 057650/0602 →
1L PATENT SECURITY RELEASE AGREEMENT Recorded Aug 31, 2021
From: UBS AG, STAMFORD BRANCH
To: DIAMOND INNOVATIONS, INC.
Reel/Frame 057651/0040 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 17, 2020
From: MAYBERRY, CAMILLE ELLEN; STOYANOV, EMIL TINKOV; LEINENWEBER, KURT DYLAN; MALIK, ABDS-SAMI
To: DIAMOND INNOVATIONS, INC.
Reel/Frame 053512/0957 →
FIRST LIEN PATENT SECURITY AGREEMENT Recorded Sep 4, 2019
From: DIAMOND INNOVATIONS, INC.
To: UBS AG, STAMFORD BRANCH
Reel/Frame 050272/0415 →
SECOND LIEN PATENT SECURITY AGREEMENT Recorded Sep 4, 2019
From: DIAMOND INNOVATIONS, INC.
To: UBS AG, STAMFORD BRANCH
Reel/Frame 050272/0472 →