Wafer alignment with restricted visual access
Wafer alignment with restricted visual access has been disclosed. In an example, a method of processing a substrate for fabricating a solar cell involves supporting the substrate over a stage. The method involves forming a substantially opaque layer over the substrate. The substantially opaque layer at least partially covers edges of the substrate. The method involves performing fit-up of the substantially opaque layer to the substrate. The method involves illuminating the covered edges of the substrate with light transmitted through the stage, and capturing a first image of the covered edges of the substrate based on the light transmitted through the stage. The method further includes determining a first position of the substrate relative to the stage based on the first image of the covered edges. The substrate may be further processed based on the determined first position of the substrate under the substantially opaque layer.
1. A system for processing a substrate for fabrication of a solar cell, the system comprising:
a stage configured to support the substrate;
a layer formation station configured to form a substantially opaque layer over the substrate and to fit-up the substantially opaque layer to the substrate, wherein the substantially opaque layer fully covers one or more edges of the substrate;
a light source configured to illuminate the fully covered one or more edges of the substrate through the stage;
an image sensor configured to capture a first image of the fully covered one or more edges of the substrate based on the light transmitted through the stage;
a computing device configured to determine a first position of the substrate relative to the stage based on the first image of the fully covered one or more edges; and
a processing station configured to process the substrate based on the determined first position of the substrate under the substantially opaque layer.
2. The system of claim 1 , wherein:
the layer formation station is configured to:
place a metal sheet over the substrate, and
apply pressure to the metal sheet.
3. The system of claim 2 , wherein the processing station comprises a laser to process at least the metal sheet or a metal layer of the substrate.
4. The system of claim 3 , further comprising a half-silvered mirror or a shutter disposed between the stage and the image sensor to protect the image sensor from the laser when processing the substrate.
5. A system for processing a substrate for fabrication of a solar cell, the system comprising:
a stage configured to support the substrate;
a layer formation station configured to form a substantially opaque layer over the substrate and to fit-up the substantially opaque layer to the substrate, wherein the substantially opaque layer fully covers one or more edges of the substrate;
a light source configured to illuminate the fully covered one or more edges of the substrate through the stage;
an image sensor configured to capture a first image of the fully covered one or more edges of the substrate based on the light transmitted through the stage; and
a computing device configured to determine a first position of the substrate relative to the stage based on the first image of the fully covered one or more edges.
6. The system of claim 5 , wherein:
the layer formation station is configured to:
place a metal sheet over the substrate, and
apply pressure to the metal sheet.
7. The system of claim 6 , further comprising a half-silvered mirror disposed between the stage and the image sensor to protect the image sensor from the laser.
8. The system of claim 6 , further comprising a shutter disposed between the stage and the image sensor to protect the image sensor from the laser.