Resin molded body
A resin molded body includes a connector unit having a side wall and an inner wall, both of which define a fitting chamber to which a mating connector is fitted and having a terminal penetrating through the inner wall and extending in a fitting direction, a substrate accommodating unit accommodating a circuit substrate to which the terminal is connected, and a device accommodating unit accommodating a device connected to the circuit substrate. The resin molded body is an integral molded product made of resin. A connecting portion has a plate shape extending outwards from the inner wall of the connector unit, and a second thickness thinner than a first thickness of the inner wall. The connecting portion is linked to the device accommodating unit.
1. A resin molded body comprising:
a connector unit having a plurality of side walls and an inner wall, both of which define a fitting chamber to which a mating connector is fitted, and having a terminal penetrating through the inner wall and extending in a fitting direction;
a substrate accommodating unit accommodating a circuit substrate to which the terminal is connected; and
a device accommodating unit accommodating a device connected to the circuit substrate,
wherein the resin molded body is an integral molded product made of resin,
wherein a connecting portion has a plate shape extending outwards from the inner wall of the connector unit, and a second thickness thinner than a first thickness of the inner wall,
wherein the connecting portion is linked to the device accommodating unit,
wherein the inner wall of the connector unit has a thin wall portion disposed at a position between the side walls in a vicinity of a connecting position where the inner wall and the connecting portion are connected to each other, and
wherein the terminal penetrates through the inner wall without penetrating through the thin wall portion.
2. The resin molded body according to claim 1 , further comprising:
a supporting portion having a third thickness which is equal to or thinner than the second thickness of the connecting portion and linking the device accommodating unit and the connecting portion,
wherein the device accommodating unit is opened in the same direction as the connector unit.
3. The resin molded body according to claim 1 ,
wherein the inner wall has a cavity recessed in a thickness direction of the inner wall in a back surface defining an outer side of the fitting chamber, in the thin wall portion.
4. The resin molded body according to claim 1 , wherein the thin wall portion surrounds at least a portion of the terminal penetrating through the inner wall and connected to the circuit substrate.
5. The resin molded body according to claim 1 , wherein the thin wall portion is provided at a position away from the connecting portion.