MAGNETRON SPUTTERING APPARATUS AND FILM FORMATION METHOD USING MAGNETRON SPUTTERING APPARATUS
According to one embodiment, a film formation method using a magnetron sputtering apparatus including first and second magnets provided on first and second target holders, includes forming an insulating film on a wafer placed on a main surface of a wafer stage by sputtering first and second insulating targets set on the first and second target holders, wherein the wafer includes an effective area to be used for a product and an ineffective area outside the effective area, and when viewed from a direction perpendicular to the main surface of the wafer stage, at least a part of the first magnet overlaps the effective area of the wafer placed on the main surface of the wafer stage, and the entire second magnet does not overlap the effective area of the wafer placed on the main surface of the wafer stage.
1 . A film formation method using a magnetron sputtering apparatus comprising a wafer stage, first and second target holders provided separately from each other above the wafer stage, and first and second magnets provided respectively on the first and second target holders, the method comprising:
forming an insulating film on a wafer placed on a main surface of the wafer stage by sputtering first and second insulating targets set respectively on the first and second target holders, wherein
the wafer includes an effective area to be used for a product and an ineffective area outside the effective area, and when viewed from a direction perpendicular to the main surface of the wafer stage, at least a part of the first magnet overlaps the effective area of the wafer placed on the main surface of the wafer stage, and the entire second magnet does not overlap the effective area of the wafer placed on the main surface of the wafer stage.
2 . The method of claim 1 , wherein when viewed from the direction perpendicular to the main surface of the wafer stage, at least a part of the second magnet overlaps the ineffective area of the wafer placed on the main surface of the wafer stage.
3 . The method of claim 1 , wherein assuming that the wafer placed on the main surface of the wafer stage, and the first and second insulating targets set respectively on the first and second target holders are projected on a plane parallel to the main surface of the wafer stage, a distance between a center of the projected wafer and a center of the projected second insulating target is greater than a distance between the center of the projected wafer and a center of the projected first insulating target.
4 . The method of claim 1 , wherein assuming that the wafer placed on the main surface of the wafer stage, and the first and second insulating targets set respectively on the first and second target holders are projected on a plane parallel to the main surface of the wafer stage, a center of the projected wafer is located on a straight line connecting a center of the projected first insulating target and a center of the projected second insulating target.
5 . The method of claim 1 , wherein assuming that the wafer placed on the main surface of the wafer stage, the first and second insulating targets set respectively on the first and second target holders, and the first and second magnets are projected on a plane parallel to the main surface of the wafer stage, and that a straight line connecting a center of the projected wafer and a center of the projected first insulating target is a first straight line, and a straight line connecting a center of the projected wafer and a center of the projected second insulating target is a second straight line, a distance between an edge of the projected second insulating target and an edge of the projected second magnet on the second straight line is greater than a distance between an edge of the projected first insulating target and an edge of the projected first magnet on the first straight line.
6 . The method of claim 1 , wherein the insulating film is formed on the wafer while the wafer stage is rotated.
7 . The method of claim 1 , wherein the insulating film is formed of either an oxide or a fluoride.
8 . The method of claim 1 , wherein the insulating film is used in a magnetoresistive element including a first magnetic layer having a variable magnetization direction, a second magnetic layer having a fixed magnetization direction, and a nonmagnetic layer between the first magnetic layer and the second magnetic layer, as the nonmagnetic layer.
9 . A film formation method using a magnetron sputtering apparatus comprising a wafer stage, first and second target holders provided separately from each other above the wafer stage, and first and second magnets provided respectively on the first and second target holders, the method comprising:
forming an insulating film on a wafer placed on a main surface of the wafer stage by sputtering first and second insulating targets set respectively on the first and second target holders, wherein
assuming that the wafer placed on the main surface of the wafer stage, the first and second insulating targets set respectively on the first and second target holders, and the first and second magnets are projected on a plane parallel to the main surface of the wafer stage, and that a straight line connecting a center of the projected wafer and a center of the projected first insulating target is a first straight line, and a straight line connecting the center of the projected wafer and a center of the projected second insulating target is a second straight line, a distance between an edge of the projected second insulating target and an edge of the projected second magnet on the second straight line is greater than a distance between an edge of the projected first insulating target and an edge of the projected first magnet on the first straight line.
10 . The method of claim 9 , wherein a distance between the center of the projected wafer and the center of the projected second insulating target is greater than a distance between the center of the projected wafer and the center of the projected first insulating target.
11 . The method of claim 9 , wherein the center of the projected wafer is located on a straight line connecting the center of the projected first insulating target and the center of the projected second insulating target.
12 . The method of claim 9 , wherein the insulating film is formed on the wafer while the wafer stage is rotated.
13 . The method of claim 9 , wherein the insulating film is formed of either an oxide or a fluoride.
14 . The method of claim 9 , wherein the insulating film is used in a magnetoresistive element including a first magnetic layer having a variable magnetization direction, a second magnetic layer having a fixed magnetization direction, and a nonmagnetic layer between the first magnetic layer and the second magnetic layer, as the nonmagnetic layer.
15 . A magnetron sputtering apparatus comprising:
a wafer stage;
first and second target holders provided separately from each other above the wafer stage; and
first and second magnets provided respectively on the first and second target holders, wherein
assuming that a wafer placed on a main surface of the wafer stage, first and second insulating targets set respectively on the first and second target holders, and the first and second magnets are projected on a plane parallel to the main surface of the wafer stage, and that a straight line connecting a center of the projected wafer and a center of the projected first insulating target is a first straight line, and a straight line connecting the center of the projected wafer and a center of the projected second insulating target is a second straight line, a distance between an edge of the projected second insulating target and an edge of the projected second magnet on the second straight line is greater than a distance between an edge of the projected first insulating target and an edge of the projected first magnet on the first straight line.
16 . The apparatus of claim 15 , wherein a distance between the center of the projected wafer and the center of the projected second insulating target is greater than a distance between the center of the projected wafer and the center of the projected first insulating target.
17 . The apparatus of claim 15 , wherein the center of the projected wafer is located on a straight line connecting the center of the projected first insulating target and the center of the projected second insulating target.
18 . The apparatus of claim 15 , wherein the wafer includes an effective area to be used for a product and an ineffective area outside the effective area, and when viewed from a direction perpendicular to the main surface of the wafer stage, at least a part of the first magnet overlaps the effective area of the wafer placed on the main surface of the wafer stage, and the entire second magnet does not overlap the effective area of the wafer placed on the main surface of the wafer stage.
19 . The apparatus of claim 18 , wherein when viewed from the direction perpendicular to the main surface of the wafer stage, at least a part of the second magnet overlaps the ineffective area of the wafer placed on the main surface of the wafer stage.
20 . The apparatus of claim 15 , further comprising a rotation system for rotating the wafer stage.