IP Library Granted Patent US 10,271,455
Granted Patent B2
US 10,271,455 · App. 15/709,060 · Granted Apr 23, 2019

Airflow management in an information handling system (IHS) chassis

Inventors: Shih-Huai Cho (New Taipei, TW); Benson Lee (Taipei, TW)
Assignee: Dell Products, L.P.
H05K7/20145G06F1/182G06F1/183G06F1/20H05K7/20727
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Quick Facts
Patent No.
US 10,271,455
App. No.
15/709,060
Granted
Apr 23, 2019
Kind
B2
Abstract

Systems and methods for airflow management in an Information Handling System (IHS) chassis are described. In some embodiments, an air shroud may include a frame configured to be coupled to a rear portion of a sled insertable into a chassis of an IHS, a first flapper coupled to the frame via a first spring. and a second flapper coupled to the frame via a second spring.

Claims (32)

1. An air shroud, comprising:

a frame configured to be coupled to a rear portion of a sled insertable into a chassis of an Information Handling System (IHS), wherein the sled includes an extensible rail, and wherein a Printed Circuit Board (PCB) coupled to a backplane within the chassis is removable from the sled by extending the extensible rail while the sled remains static with respect to the chassis;

a first flapper coupled to the frame via a first spring, wherein the first spring is configured to apply a first closing force to the first flapper; and

a second flapper coupled to the frame via a second spring, wherein the second spring is configured to apply a second closing force to the second flapper.

2. The air shroud of claim 1 , wherein each of the first and second flappers includes one or more orifices.

3. The air shroud of claim 2 , wherein the one or more orifices of each flapper are square-shaped orifices disposed in a 2×14 perforation matrix.

4. The air shroud of claim 1 , wherein the sled is configured to hold a component, wherein the component is mounted on the PCB via a connector, and wherein the connector is coupled to another connector of the backplane when the PCB is inserted into the sled.

5. The air shroud of claim 4 , wherein the PCB includes a plurality of storage devices coupled thereto.

6. The air shroud of claim 4 , wherein the PCB includes a bracket configured to:

oppose the first and second closing forces of the first and second springs; and

open the first and second flappers when the PCB is inserted into the sled by retracting the extensible rail.

7. An Information Handling System (IHS) chassis, comprising:

a body having a slot; and

a sled inserted in the slot, wherein the sled includes a rear end coupled to an air shroud that faces a back portion of the IHS chassis, wherein the sled includes an extensible rail, and wherein a Printed Circuit Board (PCB) coupled to a backplane within the IHS chassis is removable from the sled by extending the extensible rail while the sled remains static with respect to the chassis, the air shroud further comprising:

a frame configured to be coupled to the rear end;

a first flapper coupled to the frame via a first spring, wherein the first spring is configured to apply a first closing force to the first flapper; and

a second flapper coupled to the frame via a second spring, wherein the second spring is configured to apply a second closing force to the second flapper.

8. The IHS chassis of claim 7 , wherein each of the first and second flappers includes one or more orifices.

9. The IHS chassis of claim 7 , wherein the one or more orifices of each flapper are square-shaped orifices disposed in a 2×14 perforation matrix.

10. The IHS chassis of claim 7 , wherein the PCB further comprises an IHS component mounted thereto.

11. The IHS chassis of claim 7 , wherein the PCB comprises a bracket configured to:

oppose the first and second closing forces of the first and second springs; and

open the first and second flappers as the component is inserted into the sled in response to a user retracting the extensible rail.

12. An Information Handling System (IHS), comprising:

a chassis;

a backplane coupled to the chassis;

a sled insertable into a slot in the chassis, wherein the sled includes an extensible rail, and wherein a Printed Circuit Board (PCB) coupled to the backplane is removable from the sled by extending the extensible rail while the sled remains static with respect to the chassis, and wherein the sled is coupled to an air shroud, the air shroud further comprising:

a frame configured to be coupled to the rear end;

a first flapper coupled to the frame via a first spring, wherein the first spring is configured to apply a first closing force to the first flapper; and

a second flapper coupled to the frame via a second spring, wherein the second spring is configured to apply a second closing force to the second flapper.

13. The IHS of claim 12 , wherein the PCB is coupled to a bracket configured to oppose the first and second closing forces of the first and second springs upon contact with the first and second flappers when the PCB is inserted into the sled.

14. The IHS of claim 13 , wherein the bracket is configured to control an amount of an opening between the first and second flappers as the PCB is partially inserted or removed from the sled.

Assignments (10)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (053546/0001) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC IP HOLDING COMPANY LLC
Reel/Frame 071642/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (050724/0466) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO WYSE TECHNOLOGY L.L.C.)
Reel/Frame 060753/0486 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (044535/0109) Recorded May 20, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO WYSE TECHNOLOGY L.L.C.)
Reel/Frame 060753/0414 →
RELEASE OF SECURITY INTEREST AT REEL 044535 FRAME 0001 Recorded Nov 2, 2021
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; WYSE TECHNOLOGY L.L.C.
Reel/Frame 058298/0475 →
SECURITY AGREEMENT Recorded Apr 22, 2020
From: CREDANT TECHNOLOGIES INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 053546/0001 →
PATENT SECURITY AGREEMENT (NOTES) Recorded Oct 15, 2019
From: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; WYSE TECHNOLOGY L.L.C.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 050724/0466 →
SECURITY AGREEMENT Recorded Mar 21, 2019
From: CREDANT TECHNOLOGIES, INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 049452/0223 →
PATENT SECURITY AGREEMENT (CREDIT) Recorded Nov 29, 2017
From: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; WYSE TECHNOLOGY L.L.C.
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS COLLATERAL AGENT
Reel/Frame 044535/0001 →
PATENT SECURITY AGREEMENT (NOTES) Recorded Nov 29, 2017
From: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; WYSE TECHNOLOGY L.L.C.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 044535/0109 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 19, 2017
From: CHO, SHIH-HUAI; LEE, BENSON
To: DELL PRODUCTS, L.P.
Reel/Frame 043630/0989 →
Continuity (1)
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