Light exposure device, image forming apparatus, light reception device, and image reading apparatus
View Patent ↗An LED head includes a base material having one or more wiring pattern formation surfaces and one or more metal wiring patterns formed on the one or more wiring pattern formation surfaces. When the occupancy ratio of the one or more metal wiring patterns in a first region of a substrate is A, and the occupancy ratio of the one or more metal wiring patterns in a second region of the substrate is B, the LED head satisfies 0.75≤A/B≤1 or 0.75≤B/A≤1.
1. A light exposure device comprising:
a substrate being longer in a first direction and including a base material having one or more wiring pattern formation surfaces and one or more metal wiring patterns formed on the one or more wiring pattern formation surfaces; and
a plurality of light emitting elements fixed on the substrate,
wherein the substrate is divided into two regions by a boundary line which is a center line of the wiring pattern formation surface in a second direction orthogonal to the first direction,
one region of the two regions is a first region,
the other region of the two regions is a second region, and
the light exposure device satisfies 0.75≤A/B≤1 or 0.75≤B/A≤1,
where
A is a ratio of a sum of one or more areas of the one or more metal wiring patterns in the first region to a sum of one or more areas of the one or more wiring pattern formation surfaces in the first region, and
B is a ratio of a sum of one or more areas of the one or more metal wiring patterns in the second region to a sum of one or more areas of the one or more wiring pattern formation surfaces in the second region.
2. The light exposure device according to claim 1 , wherein
the substrate is an N-layer substrate including a plurality of layers from a first layer to an N-th layer (N is an integer equal to or greater than 1), and
the light exposure device satisfies 0.75≤An/Bn≤1 or 0.75≤Bn/An≤1,
where
An is a ratio of a sum of the one or more areas of the one or more metal wiring patterns in the first region to a sum of the one or more areas of the one or more wiring pattern formation surfaces in the first region, in the layers from the first layer to the N-th layer, and
Bn is a ratio of a sum of the one or more areas of the one or more metal wiring patterns in the second region to a sum of the one or more areas of the one or more wiring pattern formation surfaces in the second region, in the layers from the first layer to the N-th layer.
3. The light exposure device according to claim 2 , wherein the light exposure device satisfies 0.75≤Aa/Bb≤1 or 0.75≤Bb/Aa≤1,
where
Aa is a ratio of a sum of the one or more areas of the one or more metal wiring patterns in the first region to a sum of the one or more areas of the one or more wiring pattern formation surfaces in the first region, in the first layer, and
Bb is a ratio of a sum of the one or more areas of the one or more metal wiring patterns in the second region to a sum of the one or more areas of the one or more wiring pattern formation surfaces in the second region, in a second layer.
4. The light exposure device according to claim 2 , wherein the light exposure device satisfies 0.75≤Ab/Ba≤1 or 0.75≤Ba/Ab≤1,
where
Ba is a ratio of a sum of the one or more areas of the one or more metal wiring patterns in the second region to a sum of the one or more areas of the one or more wiring pattern formation surfaces in the second region, in the first layer, and
Ab is a ratio of a sum of the one or more areas of the one or more metal wiring patterns in the first region to a sum of the one or more areas of the one or more wiring pattern formation surfaces in the first region, in a second layer.
5. The light exposure device according to claim 2 , wherein in the N-layer substrate, reflectively inverted wiring patterns of the metal wiring patterns in the layers from the first layer to an N/2-th layer are identical with the metal wiring patterns of remaining layers.
6. The light exposure device according to claim 2 , wherein the sum of the one or more areas of the one or more metal wiring patterns in the first region in the layers from the first layer to the N-th layer and the sum of the one or more areas of the one or more metal wiring patterns in the second region in the layers from the first layer to the N-th layer are equal to each other.
7. The light exposure device according to claim 2 , wherein an amount of the one or more metal wiring patterns in the first region in the layers from the first layer to the N-th layer and an amount of the one or more metal wiring patterns in the second region in the layers from the first layer to the N-th layer are equal to each other.
8. The light exposure device according to claim 1 , wherein the one or more metal wiring patterns are formed continuously in the first direction, in at least one of the first region and the second region.
9. The light exposure device according to claim 1 , wherein the one or more metal wiring patterns are formed intermittently in the first direction, in at least one of the first region and the second region.
10. The light exposure device according to claim 1 , wherein the one or more metal wiring patterns include at least one of gold, silver, copper, aluminum, nickel, and palladium.
11. The light exposure device according to claim 1 , further comprising a converging lens configured to converge light radiated from the light emitting elements.
12. The light exposure device according to claim 11 , further comprising a support member configured to support the substrate and the converging lens.
13. An image forming apparatus comprising the light exposure device according to claim 1 .
14. A light reception device comprising light reception elements in place of the light emitting elements according to claim 1 .
15. An image reading apparatus comprising the light reception device according to claim 14 .