Mounting structure, ultrasonic device, ultrasonic probe, ultrasonic apparatus and electronic apparatus

Inventors: Hironori Suzuki (Chino, JP); Hiroshi Matsuda (Chino, JP); Koji Ohashi (Matsumoto, JP)

Assignee: Seiko Epson Corporation

H05K1/11 B06B1/06 B06B1/0644 H05K1/18

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Quick Facts

Patent No.: US 10,206,280
App. No.: 15/710,094
Granted: Feb 12, 2019
Kind: B2

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Abstract

A mounting structure includes a first substrate on which an elastic core section is provided, a conductive film that is provided over the first substrate from an upper part of the core section, and a second substrate on which a wiring portion connected to the conductive film on the core section is provided, in which the conductive film has a notch that partially exposes an end part of a surface of the core section which is in contact with the first substrate.

Claims (58)

1. A mounting structure comprising:

a first substrate having a first surface;

an elastic core upstanding from the first surface;

a conductive film continuously provided directly on the first surface, crossing over an outer surface of the core, and returning directly onto the first surface, the conductive film having a first side edge including a first notch and a second side edge including a second notch;

a second substrate having a second surface facing the first surface of the first substrate; and

a wiring on the second surface connected to the conductive film opposite the core,

wherein each of the first and second notches of the conductive film symmetrically spans an interfacial boundary of the first surface of the first substrate and the outer surface of the core, and

a line on a shortest distance between the first and second notches is aligned only with the interfacial boundary.

2. The mounting structure according to claim 1 ,

wherein the first and second notches are inwardly depressed from the first and second side edges of the conductive film in a plan view, respectively.

3. The mounting structure according to claim 1 , wherein each of the first and second notches is configured with a first linear edge and a second linear edge, and

wherein the first linear edge and the second linear edge intersect on the interfacial boundary.

4. The mounting structure according to claim 2 , wherein each of the first and second notches has an arc shape.

5. The mounting structure according to claim 1 ,

wherein each of the first and second edges of the conductive film has a bent on the core in a plan view.

6. The mounting structure according to claim 1 ,

wherein each of the first and second side edges of the conductive film has a plurality of the notches.

7. The mounting structure according to claim 1 ,

wherein

a first distance between the first and second side edges of the conductive film in a first direction is shorter than a second distance between both edges of the core in the first direction.

8. The mounting structure according to claim 1 ,

wherein the core has a face at a constant height relative to the first surface, and

the conductive film is provided on the face.

9. The mounting structure according to claim 1 ,

wherein the first and second side edges of the conductive film have third and source notches, respectively, and

the wiring is directly connected to the third and fourth notches of the conductive film on the core.

10. The mounting structure according to claim 9 ,

wherein a cross-section of the core is a trapezpoid that has two opposite sides, the two opposite sides are one of inclined and curved.

11. An electronic apparatus comprising:

the mounting structure according to claim 1 ; and