Thermal ground planes and light-emitting diodes
Methods and systems for thermal management of one or more LEDs are disclosed. One or more LEDs may be coupled with an external layer of a thermal ground plane according to some embodiments described herein. For example, the one or more LEDs may be electrically coupled with a circuit carrier with one or more electrically conductive traces etched therein prior to coupling with the thermal ground plane. The thermal ground plane may be charged with a working fluid and/or hermetically sealed after being coupled with the LED.
1. A method comprising:
coupling an external layer with another external layer to form a portion of a thermal ground plane;
charging the thermal ground plane with a working fluid after one or more heat sources have been coupled with at least the external layer or the other external layer of the thermal ground plane utilizing a soldering process; and
sealing the thermal ground plane after charging the thermal ground plane with the working fluid to contain the working fluid within the thermal ground plane, wherein the thermal ground plane includes a liquid cavity and a vapor cavity.
2. The method of claim 1 , wherein coupling the external layer of the thermal ground plane with the other external layer to form the thermal ground plane occurs before the one or more heat sources have been coupled with the external layer of the thermal ground plane.
3. The method of claim 1 , wherein coupling the external layer of the thermal ground plane with the other external layer to form the thermal ground plane occurs after the one or more heat sources have been coupled with the external layer of the thermal ground plane.
4. The method of claim 1 , wherein the thermal ground plane includes a liquid cavity and a vapor cavity.
5. The method of claim 1 , wherein the one or more heat sources include a diode.
6. The method of claim 1 , further comprising evacuating air from the thermal ground plane before charging the thermal ground plane with the working fluid.
7. The method of claim 1 , further comprising hermetically sealing the thermal ground plane after charging the thermal ground plane with the working fluid.
8. The method of claim 1 , further comprising forming the thermal ground plane using a circuit carrier as the external layer of the thermal ground plane after the one or more heat sources have been coupled with the circuit carrier.
9. The method of claim 8 , further comprising hermetically sealing the thermal ground plane after charging the thermal ground plane with the working fluid and after the one or more heat sources have been coupled with the circuit carrier.
10. The method of claim 1 , wherein charging the thermal ground plane with the working fluid occurs at a pressure less than an ambient pressure.
11. The method of claim 1 , wherein charging the thermal ground plane with the working fluid occurs at a pressure greater than an ambient pressure.
12. The method of claim 4 , wherein the vapor cavity includes a porous structure and the liquid cavity includes one or more wicking layers.
13. The method of claim 12 , wherein the liquid cavity includes a plurality of microchannels etched into the external layer of the thermal ground plane to form at least a portion of the one or more wicking layers.
14. The method of claim 12 , wherein the one or more wicking layers include one or more hydrophilic coatings.
15. The method of claim 12 , wherein the one or more wicking layers are configured to generate a capillary force to draw the working fluid through the one or more wicking layers.
16. The method of claim 12 , wherein at least the porous structure or the one or more wicking layers includes a plurality of pillars.
17. The method of claim 1 , wherein the working fluid includes at least water, mercury, sodium, indium, ammonium, acetone, ammonia, alcohol, or ethanol.
18. The method of claim 4 , wherein at least the liquid cavity or the vapor cavity includes at least a mesh, a foam, a fabric, or a porous material.