Adhesive/sealing material for an electrowetting device
Subject matter disclosed herein relates to improving a contact diameter of an adhesive/sealing material on surfaces of substrates by altering rheological properties of the adhesive/sealing material. An electrowetting display device comprises a first substrate and a second substrate, a first fluid and a second fluid disposed between the first substrate and the second substrate, wherein the first fluid is immiscible with the second fluid. An adhesive/sealing material comprising UV curable epoxy glue is in contact with the second fluid and couples the second substrate to the first substrate. The adhesive/sealing material further comprises silica particles in a range of 1-6% mass fraction of silica that alter rheological properties of the UV curable epoxy glue.
1. A method of sealing an electrowetting device, wherein the electrowetting device comprises a first fluid and a second fluid disposed between a first substrate and a second substrate, the first fluid immiscible with the second fluid, the method comprising:
providing the first substrate;
providing the second substrate;
applying an adhesive/sealing material on a portion of the first substrate or a portion of the second substrate such that the adhesive/sealing material has a first net contact area with the portion, wherein the adhesive/sealing material comprises particles that alter rheological properties of the adhesive/sealing material;
contacting the adhesive/sealing material with the second fluid such that the adhesive/sealing material has a second net contact area with the portion, the second net contact area substantially equal to the first net contact area; and
coupling the first substrate to the second substrate via the adhesive/sealing material.
2. The method of claim 1 , wherein the adhesive/sealing material comprises particles comprising one or more of (i) clay particles in a range of 0-5% mass fraction of clay particles or (ii) ceramic particles in a range of 0-5% mass fraction of ceramic particles.
3. The method of claim 2 , wherein the adhesive/sealing material comprises one or more of (i) clay particles having a size in a range of 6-39 nanometers or (ii) ceramic particles having a size in a range of 6-39 nanometers.
4. The method of claim 1 , wherein the adhesive/sealing material comprises silica particles.
5. The method of claim 4 , wherein the silica particles are hydrophobic silica particles.
6. The method of claim 4 , wherein the silica particles are hydrophilic silica particles.
7. The method of claim 4 , wherein the silica particles have a size in a range of 6-39 nanometers.
8. The method of claim 1 , wherein the adhesive/sealing material comprises silica particles in a range of 0-5% mass fraction silica.
9. A method of sealing first and second substrates of a display device that comprises a fluid between the first and second substrates, the method comprising:
applying an adhesive/sealing material on a portion of the first substrate or a portion of the second substrate such that the adhesive/sealing material has a first net contact area with the portion, wherein the adhesive/sealing material comprises particles affecting rheological properties of the adhesive/sealing material;
contacting the adhesive/sealing material with the fluid such that the adhesive/sealing material has a second net contact area with the portion, the second net contact area substantially equal to the first net contact area, and
joining the first substrate with the second substrate via the adhesive/sealing material.
10. The method of claim 9 , wherein applying the adhesive/sealing material further comprises applying the adhesive/sealing material in a predetermined pattern onto the first substrate or the second substrate.
11. The method of claim 9 , wherein the electrowetting device comprise a display region comprising a plurality of picture elements, and wherein applying the adhesive/sealing material further comprises applying the adhesive/sealing material initially outside the display region and subsequently applying the adhesive/sealing material in a pre-determined pattern onto the first substrate or the second substrate within the display region.
12. The method of claim 9 , wherein applying the adhesive/sealing material further comprises applying the adhesive/sealing material directly on a transparent conductive layer disposed on the first substrate or the second substrate.
13. The method of claim 9 , wherein the adhesive/sealing material comprises one or more of (i) clay particles having a size in a range of 6-39 nanometers or (ii) ceramic particles having a size in a range of 6-39 nanometers.
14. A method comprising:
combining an adhesive/sealing material with particles that affect rheological properties of the adhesive/sealing material to produce a modified adhesive/ sealing material;
applying the modified adhesive/sealing material onto a portion of a first substrate of a display device or a portion of a second substrate of the display device such that the modified adhesive/sealing material has a first net contact area with the portion,
contacting the modified adhesive/sealing material with a fluid disposed on the first substrate or the second substrate such that the adhesive/sealing material has a second net contact area with the portion, the second net contact area substantially equal to the first net contact area; and
joining the first substrate with the second substrate via the modified adhesive/sealing material.
15. The method of claim 14 , wherein the adhesive/sealing material comprises silica particles.
16. The method of claim 14 , wherein the modified adhesive/sealing material has a particular yield stress, and wherein applying the modified adhesive/sealing material further comprises dispensing the modified adhesive/sealing material with a dispensing force that is greater than the particular yield stress.
17. The method of claim 16 , wherein combining the adhesive/sealing material with particles that affect the rheological properties of the adhesive/sealing material further comprises:
increasing an amount of the particles that are combined with the adhesive/sealing material at least until the modified adhesive/sealing material has the particular yield stress.
18. The method of claim 14 , wherein the adhesive/sealing material comprises silica particles in a range of 0-5% mass fraction silica.
19. The method of claim 14 , wherein applying the modified adhesive/sealing material further comprises applying the modified adhesive/sealing material directly on a transparent conductive layer disposed on the first substrate or the second substrate.
20. The method of claim 14 , wherein the modified adhesive/sealing material comprises particles comprising one or more of (i) clay particles in a range of 0-5% mass fraction of clay particles or (ii) ceramic particles in a range of 0-5% mass fraction of ceramic particles.