Method for manufacturing light emitting device
A method for manufacturing a light emitting device includes: preparing an intermediate body including a plurality of light emitting elements spaced apart from each other, each of the light emitting elements having a pair of electrodes disposed on the same side, and a covering member covering side surfaces of the light emitting elements while a part of a surface of each of the electrodes is exposed from the covering member, the covering member having a recess between adjacent ones of the light emitting elements; forming a metal layer that continuously covers the surface of each of the electrodes of the light emitting elements and an inner surface of the recess of the covering member; and cutting the metal layer and the covering member at the inner surface of the recess.
1. A method for manufacturing a light emitting device comprising:
preparing an intermediate body including
a plurality of light emitting elements spaced apart from each other, each of the light emitting elements having a pair of electrodes disposed on the same side, and
a covering member covering side surfaces of the light emitting elements while a part of a surface of each of the electrodes is exposed from the covering member, the covering member having a recess between adjacent ones of the light emitting elements;
forming a metal layer that continuously covers the surface of each of the electrodes of the light emitting elements and an inner surface of the recess of the covering member; and
cutting the metal layer and the covering member at the inner surface of the recess.
2. The method for manufacturing a light emitting device according to claim 1 , wherein
the recess is formed by removing a part of the covering member.
3. The method for manufacturing a light emitting device according to claim 1 , wherein
the forming of the metal layer is performed by ALD, CVD, sputtering, or vapor deposition.
4. The method for manufacturing a light emitting device according to claim 1 , further comprising
removing a part of the metal layer after the forming of the metal layer.
5. The method for manufacturing a light emitting device according to claim 4 , wherein
the removing of the metal layer is performed by irradiating the metal layer with a laser.
6. The method for manufacturing a light emitting device according to claim 1 , wherein
the metal layer includes Ru.
7. The method for manufacturing a light emitting device according to claim 1 , wherein
the forming of the metal layer includes forming the metal layer having a laminated structure of Ni/Ru/Au.
8. The method for manufacturing a light emitting device according to claim 1 , wherein
the preparing of the intermediate body includes preparing the intermediate body including the covering member having a plurality of recesses including the recess between the adjacent ones of the light emitting elements.
9. The method for manufacturing a light emitting device according to claim 1 , wherein
the forming of the metal layer includes forming the metal layer to continuously cover inner surfaces of the recesses of the covering member.