Wafer-level integrated antenna array for wireless battery charging
Systems and methods are described for transmitting and receiving wireless power. In some embodiments, a wireless power transmission system comprises an antenna array comprising a plurality of antennas and a transceiver module configured to receive a plurality of beaconing signals via the antenna array from a wireless client during a beacon cycle. The system also comprises a controller configured to measure a phase of each of the plurality of beaconing signals and determine a transmit phase configuration for each of the antennas, and a transceiver module configured to send signals to the antenna array based on the transmit phase configuration for delivery of wireless power to the wireless client.
1. An electronics wafer comprising:
a wafer material having a shape defined by a perimeter;
an electronic component layer formed into the wafer material;
an antenna array layer formed on the electronic component layer, wherein the antenna array layer comprises a plurality of antenna groups and each antenna group includes a plurality of antennas;
a plurality of phase-locked loops, each phase-locked loop corresponding with a respective antenna group of the plurality of antenna groups; and
wherein the plurality of antenna groups covers an entire area of the wafer material within the perimeter.
2. The electronics wafer of claim 1 , wherein the plurality of phase-locked loops is formed within the electronic component layer.
3. The electronics wafer of claim 1 , wherein the electronics wafer further comprises a plurality of transceivers, each transceiver of the plurality of transceivers corresponding with a respective antenna of the plurality of antennas.
4. The electronics wafer of claim 3 , wherein each transceiver of the plurality of transceivers is configured to send a respective signal to a respective phase-locked loop corresponding with the antenna corresponding with the transceiver.
5. The electronics wafer of claim 4 , wherein each antenna of the plurality of antennas is configured to transmit the respective signal at a wavelength in a frequency region corresponding to one of a microwave frequency region and a terahertz frequency region.
6. The electronics wafer of claim 1 , wherein the shape of each antenna group of the plurality of antenna groups is the same.
7. The electronics wafer of claim 6 , wherein the shape of each antenna group is hexagonal.
8. A method of manufacturing an electronics wafer, the method comprising:
providing a wafer material having a shape defined by a perimeter;
forming an electronic component layer onto the wafer material, wherein the electronic component layer includes multiple phase-locked loops;
forming an antenna array layer onto the electronic component layer, the antenna array layer comprising multiple antenna groups, each antenna group including multiple antennas,
wherein each of the multiple phase-locked loops corresponds to a respective antenna group of the multiple antenna groups.
9. The method of claim 8 , wherein the multiple antenna groups cover an entire area of the wafer material within the perimeter.
10. The method of claim 8 , wherein forming the electronic component layer onto the wafer material further comprises:
forming multiple transceivers onto the wafer material, wherein each transceiver corresponds to a respective antenna of the multiple antennas.
11. The method of claim 10 , wherein each transceiver of the multiple transceivers is configured to send a signal to a phase-locked loop associated with the antenna corresponding with the transceiver.
12. The method of claim 11 , wherein each antenna of the multiple antennas is configured to transmit the respective signal at a wavelength in a frequency region corresponding to one of a microwave frequency region and a terahertz frequency region.
13. The method of claim 8 , wherein the shape of each antenna group of the multiple antenna groups is the same.
14. The method of claim 8 , wherein the shape of each antenna group is hexagonal.
15. An electronics wafer comprising:
a wafer material having a shape defined by a perimeter;
an electronic component layer formed into the wafer material, wherein the electronic component layer includes multiple phase-locked loops;
an antenna array layer formed the electronic component layer, wherein the antenna array layer comprises a plurality of antenna groups and each antenna group includes a plurality of antennas;
wherein each of the multiple phase-locked loops corresponds to a respective antenna group of the multiple antenna groups, and the multiple antenna groups collectively cover an entire area of the wafer material within the perimeter.