Simultaneous and selective wide gap partitioning of via structures using plating resist
A multilayer printed circuit board is provided having a first dielectric layer and a first plating resist selectively positioned in the first dielectric layer. A second plating resist may be selectively positioned in the first dielectric layer or a second dielectric layer, the second plating resist separate from the first plating resist. A through hole extends through the first dielectric layer, the first plating resist, and the second plating resist. An interior surface of the through hole is plated with a conductive material except along a length between the first plating resist and the second plating resist. This forms a partitioned plated through hole having a first via segment electrically isolated from a second via segment.
1. A multilayer printed circuit board, comprising:
a plurality of dielectric layers and a plurality of conductive layers;
a first plating resist selectively positioned within or on a first conductive layer of the multilayer printed circuit board;
a second plating resist selectively position in a first dielectric layer and separate from the first plating resist; and
a through hole extending through the plurality of dielectric layers and the plurality of conductive layers, the first plating resist, and the second plating resist, where an interior surface of the through hole is plated with a conductive material except along a length between the first plating resist and the second plating resist to form a partitioned plated through hole having a first via segment electrically isolated from a second via segment.
2. The multilayer printed circuit board of claim 1 , wherein at least one of the first plating resist and second plating resist is located within a first core structure or sub-composite structure, where the first dielectric layer and first conductive layer are part of the first core structure or sub-composite structure.
3. The multilayer printed circuit board of claim 1 , wherein both the first plating resist and second plating resist are located within a first core structure or sub-composite structure, where the first dielectric layer and first conductive layer are part of the first core structure or sub-composite structure.
4. The multilayer printed circuit board of claim 1 , wherein the first plating resist is located within a first core structure or sub-composite structure, and the second plating resist is located within a second core structure or sub-composite structure, where the first conductive layer is part of the first core structure or sub-composite structure and the first dielectric layer is part of the second core structure or sub-composite structure.
5. The multilayer printed circuit board of claim 1 , wherein the first dielectric layer and first conductive layer are both external to a first core or sub-composite structure.
6. The multilayer printed circuit board of claim 1 , wherein the first dielectric layer and first conductive layer are both internal to a first core or sub-composite structure.
7. The multilayer printed circuit board of claim 1 , wherein the first conductive layer is internal to a first core or sub-composite structure and the first dielectric layer is external to the first core or sub-composite structure.
8. The multilayer printed circuit board of claim 1 , wherein the first conductive layer is internal to a first core or sub-composite structure and the first dielectric layer is internal to a second core or sub-composite structure.
9. The multilayer printed circuit board of claim 1 , wherein a first thickness of the first plating resist is approximately the same as a second thickness of the first conductive layer.