Methods for laser cutting a polycrystalline diamond structure
Methods of laser cutting polycrystalline diamond tables and polycrystalline diamond compacts are disclosed. Laser cutting of the polycrystalline diamond table provides an alternative to electrical-discharge machining (“EDM”), grinding with a diamond wheel, or lapping with a diamond wheel. Grinding or lapping with a diamond wheel is relatively slow and expensive, as diamond is used to remove a diamond material. EDM cutting of the polycrystalline diamond table is sometimes impractical or even impossible, particularly when the cobalt or other infiltrant or catalyst concentration within the polycrystalline diamond table is very low (e.g., in the case of a leached polycrystalline diamond table). As such, laser cutting provides a valuable alternative machining method that may be employed in various processes such as laser scribing, laser ablation, and laser lapping.
1. A method of forming a polycrystalline diamond compact, the method comprising:
identifying at least one of one or more topographical protrusions or one or more topographical recesses on an initial working surface of a polycrystalline diamond having a leached region extending from the initial working surface;
polishing at least the initial working surface of the leached region of the polycrystalline diamond material effective to remove the at least one of the one or more topographical protrusions or the one or more topographical recesses from the initial working surface and form a continuous working surface that is more smooth than the initial working surface;
wherein the leached region of the polycrystalline diamond material includes a plurality of bonded diamond grains defining a plurality of interstitial regions from which a catalyst material has been at least partially removed.
2. The method of claim 1 , wherein the polycrystalline diamond material defines a polycrystalline diamond table that is bonded to a substrate, the polycrystalline diamond table defined by the polycrystalline diamond material including the continuous working surface positioned generally opposite to the substrate.
3. The method of claim 1 , wherein polishing at least the initial working surface of the leached region of the polycrystalline diamond material includes forming a non-planar working surface.
4. The method of claim 1 , wherein polishing at least the initial working surface of the leached region of the polycrystalline diamond material includes laser polishing at least the initial working surface.
5. The method of claim 1 , wherein polishing at least the initial working surface of the leached region of the polycrystalline diamond material includes laser polishing at least the initial working surface to form a non-planar continuous working surface.
6. The method of claim 1 , wherein polishing at least the initial working surface of the leached region of the polycrystalline diamond material includes forming a non-planar continuous working surface to exhibit a concave geometry.
7. The method of claim 1 , wherein polishing at least the initial working surface of the leached region of the polycrystalline diamond material includes forming a non-planar continuous working surface to exhibit a convex geometry.
8. The method of claim 1 , wherein polishing at least the initial working surface of the leached region of the polycrystalline diamond material includes exposing at least the initial working surface to electromagnetic radiation.
9. The method of claim 1 , wherein polishing at least the initial working surface of the leached region of the polycrystalline diamond material includes exposing at least the initial working surface to laser energy.
10. The method of claim 1 , wherein the continuous working surface includes a non-planar portion that is part of a recess extending inwardly from the continuous working surface.
11. A method of forming a polycrystalline diamond compact, the method comprising:
identifying at least one of one or more topographical protrusions or one or more topographical recesses on an initial working surface of a polycrystalline diamond having a leached region extending from the initial working surface;
polishing at least the initial working surface of the leached region of the polycrystalline diamond material effective to remove the at least one of the one or more topographical protrusions or the one or more topographical recesses from the initial working surface and form a non-planar continuous working surface that is more smooth than the initial working surface;
wherein the leached region of the polycrystalline diamond material includes a plurality of bonded diamond grains defining a plurality of interstitial regions from which a catalyst material has been at least partially removed.
12. The method of claim 11 , wherein the polycrystalline diamond material defines a polycrystalline diamond table that is bonded to a substrate, the polycrystalline diamond table defined by the polycrystalline diamond material including the continuous working surface positioned generally opposite to the substrate.
13. The method of claim 11 , wherein polishing at least the initial working surface of the leached region of the polycrystalline diamond material to form a non-planar continuous working surface into the leached region includes laser polishing at least the initial working surface to form the non-planar continuous working surface.
14. The method of claim 11 , wherein polishing at least the initial working surface of the leached region of the polycrystalline diamond material to form a non-planar continuous working surface includes forming the non-planar continuous working surface to exhibit a concave geometry.
15. The method of claim 11 , wherein polishing at least the initial working surface of the leached region of the polycrystalline diamond material to form a non-planar continuous working surface that extends into the leached region includes forming the non-planar continuous working surface to exhibit a convex geometry.
16. The method of claim 11 , wherein polishing at least the initial working surface of the leached region of the polycrystalline diamond material to form a non-planar continuous working surface includes exposing at least the initial working surface to electromagnetic radiation.
17. The method of claim 11 , wherein polishing at least the initial working surface of the leached region of the polycrystalline diamond material to form a non-planar continuous working surface includes exposing at least the initial working surface to laser energy to form the non-planar continuous working surface.
18. A method of forming a polycrystalline diamond compact, the method comprising:
identifying at least one of one or more topographical protrusions or one or more topographical recesses on an initial working surface of a polycrystalline diamond having a leached region extending from the initial working surface;
laser polishing at least the initial working surface of the leached region of the polycrystalline diamond material effective to remove the at least one of the one or more topographical protrusions or the one or more topographical recesses from the initial working surface and form a smoothly curved non-planar continuous working surface upon the leached region that is more smooth than the initial working surface;
wherein the leached region of the polycrystalline diamond material includes a plurality of bonded diamond grains defining a plurality of interstitial regions from which a catalyst material has been at least partially removed.
19. The method of claim 18 , wherein the polycrystalline diamond material defines a polycrystalline diamond table that is bonded to a substrate, the polycrystalline diamond table defined by the polycrystalline diamond material including the continuous working surface positioned generally opposite to the substrate.
20. The method of claim 18 , wherein laser polishing at least the initial working surface of the leached region of the polycrystalline diamond material to form the smoothly-curved non-planar continuous working surface upon the leached region includes laser polishing at least the initial working surface to form the smoothly curved non-planar continuous working surface exhibiting a concave geometry.
21. The method of claim 18 , wherein laser polishing at least the initial working surface of the leached region of the polycrystalline diamond material to form the smoothly-curved non-planar surface upon the leached region includes laser polishing the non-planar continuous working surface to exhibit a convex geometry.
22. The method of claim 1 , wherein the initial working surface includes the one or more topographical protrusions and polishing at least the initial working surface of the leached region of the polycrystalline diamond material includes:
applying laser energy to the initial working surface of the leached region of the polycrystalline diamond material only where the one or more topographical protrusions are located effective to remove the one or more topographical protrusions from the initial working surface and form the continuous working surface that is more smooth than the initial working surface.
23. The method of claim 11 , wherein:
polishing at least the initial working surface of the leached region of the polycrystalline diamond material includes:
applying multiple passes of laser energy to at least the initial working surface of the leached region of the polycrystalline diamond material to remove the at least one of the one or more topographical protrusions or the one or more topographical recesses from at least the initial working surface and form the non-planar continuous working surface, thereby preventing thermal damage to the polycrystalline diamond material.
24. The method of claim 18 , wherein laser polishing at least the initial working surface of the leached region of the polycrystalline diamond material includes:
applying multiple passes of laser energy to at least the initial working surface of the leached region of the polycrystalline diamond material to remove the at least one of the one or more topographical protrusions or the one or more topographical recesses from the initial working surface and form the smoothly curved non-planar continuous working surface upon the leached region;
wherein a depth of diamond material removal during each of the multiple passes of laser energy is sufficiently low so as to prevent substantial thermal damage to the polycrystalline diamond table.
25. A method of forming a polycrystalline diamond compact, the method comprising:
providing a polycrystalline diamond compact including a polycrystalline diamond table having an upper surface;
applying laser energy to at least a portion of the upper surface of the polycrystalline diamond table to remove diamond material therefrom and form a non-planar continuous working surface on the polycrystalline diamond table that is more smooth than the at least a portion of the upper surface; and
leaching at least a portion of the polycrystalline diamond table.
26. The method of claim 25 , wherein leaching at least a portion of the polycrystalline diamond table includes:
after applying the laser energy to at least the portion of the upper surface of the polycrystalline diamond table, leaching at least the portion of the polycrystalline diamond table.
27. The method of claim 25 , wherein leaching at least a portion of the polycrystalline diamond table includes:
before applying the laser energy to at least the portion of the upper surface of the polycrystalline diamond table, leaching at least the portion of the polycrystalline diamond table.
28. The method of claim 25 , wherein applying laser energy to at least a portion of the upper surface of the polycrystalline diamond table includes:
applying multiple passes of laser energy to the at least one surface of the leached region of the polycrystalline diamond material;
wherein a depth of diamond material removal during each of the multiple passes of laser energy is sufficiently low so as to prevent thermal damage to the polycrystalline diamond table.