Antenna array suitable for 5G mobile terminal devices
A new antenna array of the invention which has simple structure, small volume and can adopt a variety of realization forms, it can be easily integrated in the PCB of the mobile terminal using surface mount technology (SMT) or multi-layer PCB integration and other forms of technology. The antenna array is compact and can be configured with different number of antenna elements to meet the gain requirements. The antenna array is small in size and has a wide antenna bandwidth that can cover multiple 5G millimeter-wave bands while maintaining a directional high antenna gain and a stable radiation pattern. The antenna array can satisfy the millimeter-wave 5G communication requirements such as high gain, beam forming characteristics, beam scanning characteristics, and can be easily integrated into a portable mobile terminal.
1. An antenna array apparatus for a 5G mobile terminal, comprising:
a plurality of magneto-electric dipole antenna elements, wherein each magneto-electric dipole antenna element comprises an electric dipole and a magnetic dipole, wherein the electric dipole and the magnetic dipole are perpendicularly intersected, and wherein a midpoint of the intersection is a feed point, wherein the electric dipole comprises a first rectangular metal block and a second rectangular metal block, wherein the magnetic dipole comprises a first rectangular copper layer and a second rectangular copper layer, the first rectangular metal block being connected to the first rectangular copper layer through surface mounting technology (SMT), the second rectangular metal block being connected to the second rectangular copper layer through surface mounting technology (SMT); and
a radio frequency (RF) frontend module, wherein the plurality of magneto-electric dipole antenna elements are connected to the RF frontend module respectively.
2. An antenna array apparatus of claim 1 , wherein magneto-electric dipole antenna elements are of the same or a similar structure, wherein a space between the magneto-electric dipole antenna elements is determined according to an antenna array radiation pattern or an antenna array scanning angle.
3. The antenna array apparatus of claim 2 , wherein a space between each of the magneto-electric dipole antenna elements is ranging from a half-wavelength to one wavelength.
4. The antenna array apparatus of claim 1 , wherein each of the magneto-electric dipole antenna elements is excited by a multi-band or a broadband RF frontend module, and wherein the RF frontend module is connected to a feeder line of the magneto-electric dipole antenna elements.
5. The antenna array apparatus of claim 4 , wherein the RF frontend module is connected to the magneto-electric dipole antenna elements by the surface mounting technology (SMT).
6. The antenna array apparatus of claim 1 , wherein a bandwidth of the RF frontend module covers a plurality of millimeter-wavebands, and wherein beam forming and beam scanning of the antenna array apparatus are performed by controlling a phase difference of the magneto-electric dipole antenna elements connected to the RF frontend module.
7. The antenna array apparatus of claim 1 , wherein the antenna array apparatus is located at a top, a bottom, a left, or a right side of a handheld mobile terminal.
8. The antenna array apparatus of claim 1 , wherein the RF frontend module comprises:
a switch;
a receiving module;
a transmitting module; and
a local oscillation signal generating module for generating four quadrature local oscillation signals supplied to the transmitting module and the receiving module, wherein the receiving module and the transmitting module are respectively connected with the switch, and wherein the switch is connected with the magneto-electric dipole antenna elements.
9. The antenna array apparatus of claim 1 , wherein the electric dipole can be a metal block, wrapped copper, or metal vias along a thickness direction of a printed circuit board (PCB), wherein the magnetic dipole comprises a pair of copper layers on an upper side and a lower side of the PCB and a group of metal vias, and wherein the PCB is formed by laminating different layers of a dielectric substrate.