Test module for a fingerprint sensing device
View Patent ↗There is provided a test module for testing a fingerprint sensing device comprising: an electrically conductive bottom element comprising an exterior surface portion configured to contact a sensing surface of the fingerprint sensing device; an electrically conductive intermediate element, connected to the bottom element on a side opposing the exterior surface, the intermediate element comprising a flexible material enabling the bottom element to change alignment in response to an applied force occurring when the exterior surface is pressed against a surface being tilted with respect to the exterior surface of the bottom element; and a top element configured connect the test module to a test fixture. There is also provided a method for testing a fingerprint sensing device using the described test module.
1. A test module for testing a fingerprint sensing device comprising:
an electrically conductive bottom element comprising an exterior surface portion configured to contact a sensing surface of said fingerprint sensing device;
an electrically conductive intermediate element, connected to the bottom element on a side opposing said exterior surface portion, said intermediate element comprising a flexible material enabling said bottom element to change alignment in response to an applied force occurring when said exterior surface portion is pressed against a surface being tilted with respect to the exterior surface of the bottom element; and
a top element configured connect the test module to a test fixture.
2. The test module according to claim 1 , wherein said electrically conductive bottom element comprises a ground electrode configured to be connected to a corresponding ground electrode of a test fixture.
3. The test module according to claim 1 , wherein said intermediate element is solid.
4. The test module according to claim 3 , wherein said intermediate element consists of a single material.
5. The test module according to claim 1 , wherein said intermediate element is hollow comprising flexible sidewalls.
6. The test module according to claim 5 , wherein said flexible sidewalls are electrically conductive.
7. The test module according to claim 6 , wherein said intermediate element comprises an electrically conductive fluid.
8. The test module according to claim 7 , wherein said fluid is a gel.
9. The test module according to claim 1 , wherein the electrical conductivity of the bottom element and of the intermediate element corresponds to the electrical conductivity of a finger.
10. The test module according to claim 1 , wherein the exterior surface portion of the bottom element comprises a pattern configured to be detected by a fingerprint sensing device.
11. The test module according to claim 1 , wherein the exterior surface portion of the bottom element comprises a pattern replicating a fingerprint.
12. The test module according to claim 1 , wherein the exterior surface portion of the bottom element comprises a plurality of different patterns.
13. The test module according to claim 1 , wherein said intermediate element is flexible in a direction perpendicular to the exterior surface portion of said bottom element.
14. The test module according to claim 1 , wherein said bottom element is flexible having an elastic modulus which is higher than an elastic modulus of said intermediate element.
15. The test module according to claim 1 , wherein the intermediate element comprises conductive rubber.
16. The test module according to claim 1 , wherein the bottom element comprises conductive rubber.
17. The test module according to claim 1 , further comprising an electrically conductive film arranged between the bottom element and the intermediate element, wherein the electrically conductive film is configured to be connected to a ground electrode of a test fixture.
18. A method for testing a fingerprint sensing device using a test module comprising:
an electrically conductive bottom element comprising a substantially flat exterior surface portion configured to contact a sensing surface of said fingerprint sensing device;
an electrically conductive intermediate element, connected to the first portion on a side opposing said exterior surface, said second portion comprising a flexible material enabling said bottom element to change alignment in response to an applied force occurring when said exterior surface is pressed against a surface being tilted with respect to the exterior surface of the bottom element; and
a top element configured connect the test module to a test fixture, the method comprising:
arranging a fingerprint sensing device below said test module;
moving said test module towards said fingerprint sensing device such that said exterior surface portion of said bottom element makes contact with a sensing surface of said sensing device; and
capturing an image using said fingerprint sensing device.
19. The method according to claim 18 , further comprising verifying that the image captured by the fingerprint sensing device corresponds to a surface pattern of the exterior surface portion said bottom element.