Variable band for thermoelectric modules
A system comprises a thermoelectric device, and a baseplate coupled to a first side of the thermoelectric device. The system also comprises a band coupled to the baseplate and a container. The band may be adjustable in a circumference and configured to thermally couple the baseplate and the container.
1. A system for use on an object in a surrounding environment, the object having an external surface, the system comprising:
a coupler being thermally conductive and having an inside surface and an outside surface, the inside surface configured to place in thermal contact with the external surface of the object, the outside surface facing away from the external surface of the object;
a plurality of stacked plates, each of the plurality of stacked plates being made of a same thermally conductive material and disposed in a stacked arrangement adjacent one another, a central portion of the stacked plates disposed in thermal contact with the outside surface of the coupler, wing portions of the stacked plates configured to place in thermal contact with portions of the external surface of the object;
a band being thermally conductive and disposed about the object, the band configured to hold the stacked plates and the coupler in compression against the external surface;
a baseplate being thermally conductive and disposed in thermal contact to the coupler, the band, and the stacked plates; and
a thermoelectric device having a first side and a second side, the first side disposed in thermal contact with the baseplate, the thermoelectric device being configured to thermoelectrically transfer energy between the first and second sides thereof.
2. The system of claim 1 , wherein the band comprises:
a continuous piece of material being adjustable in a circumference through a series of holes spaced about the circumference; and
a fastener coupled to the band.
3. The system of claim 1 , further comprising a thermal interface material disposed between adjacent ones of the stacked plates and being configured to facilitate transfer of thermal energy.
4. The system of claim 3 , wherein the thermal interface material comprises graphite thermal pads.
5. The system of claim 1 , further comprising a sink coupled to the second side of the thermoelectric device, the sink configured to exchange thermal energy between the thermoelectric device and the surrounding environment.
6. The system of claim 1 , further comprising a gasket coupled to the baseplate and configured to protect the thermoelectric device.
7. The system of claim 1 , further comprising a thermal interface material coupled to the baseplate and the stacked plates and being configured to facilitate transfer of thermal energy.
8. The system of claim 1 , further comprising a controller coupled to the thermoelectric device and configured to transfer electrical energy to or from the thermoelectric device.
9. The system of claim 8 , wherein the controller is configured to send signals to the thermoelectric modules that cause the baseplate to change temperature.
10. The system of claim 1 , wherein the stacked plates are stacked in a leaf spring arrangement; wherein the stacked plates are clamped together between the coupler and the band; and/or wherein the stacked plates are clamped to one another at the central portion between the coupler and the band.
11. The system of claim 1 , wherein to thermoelectrically transfer energy between the first and second sides, the thermoelectric device is configured to: transfer thermal energy from the first side to the second side in response to input of electrical energy, transfer thermal energy from the second side to the first side in response to input of electrical energy, or generate electrical energy in response to the transfer of thermal energy between the first and second sides.
12. The system of claim 1 , the external surface being circumferential, wherein the inside surface of the coupler defines a concave surface configured to place against the circumferential surface of the object; and wherein the outside surface of the coupler defines a convex surface, the stacked plates and the band being configured to conform to the convex surface.
13. A method for use on an object in a surrounding environment, the object having an external surface, the method comprising, not necessarily in sequence:
placing a first side of a thermoelectric device in thermal contact with a baseplate, the thermoelectric device having a second side;
placing central portions of conductive plates in a stacked arrangement against an outside surface of a coupler, each of the conductive plates being made of a same thermally conductive material;
placing a portion of a band against the conductive plates;
coupling the coupler to the baseplate with the central portions of the conductive plates and the portion of the band positioned therebetween;
attaching the coupler, the conductive plates, the band, and the baseplate to the object by: placing an inside surface of the coupler in thermal contact with the external surface of the object, placing wing portions of the stacked plates in thermal contact with the external surface of the object, and affixing the band around the external surface of the object; and
thermoelectrically transferring energy between the first and second sides of the thermoelectric device.
14. The method of claim 13 , further comprising placing a thermal interface material between adjacent conductive plates, the thermal interface material being configured to facilitate transfer of thermal energy.
15. The method of claim 13 , further comprising placing a sink in thermal contact with the second side of the thermoelectric device; and exchanging thermal energy between the thermoelectric device and the surrounding environment using the sink.
16. The method of claim 13 , further comprising protecting the thermoelectric device by coupling a gasket to the baseplate.
17. The method of claim 13 , further comprising placing a thermal interface material between adjacent ones of the conductive plates, the thermal interface material being configured to facilitate transfer of thermal energy.
18. The method of claim 13 , wherein thermoelectrically transferring the energy between the first and second sides of the thermoelectric device comprises transferring electrical energy to or from the thermoelectric device using a controller.
19. The method of claim 13 , wherein thermoelectrically transferring the energy between the first and second sides of the thermoelectric device comprises: transferring thermal energy from the first side to the second side in response to input of electrical energy, transferring thermal energy from the second side to the first side in response to input of electrical energy, or generating electrical energy in response to the transfer of thermal energy between the first and second sides.
20. The method of claim 13 , the external surface being circumferential, wherein placing the inside surface of the coupler in thermal contact with the external surface of the object comprises placing a concave surface of the coupler against the circumferential surface of the object; and wherein placing the central portions of the conductive plates in the stacked arrangement against the outside surface of the coupler comprises placing the central portions against a convex surface of the coupler.
21. The system of claim 1 , wherein the coupler comprises:
a central portion, the outside surface of the central portion having a generally convex curvature configured to conformance fit an inner surface of the stacked arrangement of the plurality of stacked plates; and
two elongated strips on opposing sides of the central portion, the two elongated having lengths longer than the length of the central portion and outside surfaces configured to couple with the baseplate.