Inductively coupled microelectromechanical system resonator
An integrated circuit package includes a first die that has a microelectromechanical system (MEMS) resonator coupled to a coil. A second die includes a coil fabricated on a top surface of the second die, and an electronic circuit with tank circuit terminals fabricated on the second die and coupled to the second coil. The second die is positioned adjacent the first die such that the first coil is operable to electromagnetically couple to the second coil.
1. An integrated circuit (IC) comprising:
a first die having a first coil fabricated on a top surface of the first die, and a microelectromechanical (MEMS) resonator fabricated on the first die and coupled to the first coil;
a second die having a second coil fabricated on a top surface of the second die, and an electronic circuit with tank circuit terminals fabricated on the second die and coupled to the second coil; and
wherein the second die is positioned adjacent the first die such that the first coil is operable to electromagnetically couple to the second coil.
2. The IC of claim 1 , wherein the first coil has m turns, the second coil has n turns, and n is greater than m.
3. The IC of claim 1 , wherein the first coil is a planer coil formed by one or more metal layers on the top surface of the first die, and the second coil is a planer coil formed by one or more metal layers on the top surface of the second die.
4. The IC of claim 1 , wherein the first coil is a planer coil formed by one or more metal layers on the top surface of the first die, wherein the MEMS resonator is surrounded by the first coil.
5. The IC of claim 1 , wherein the first die and the second die together are surrounded by an encapsulation material.
6. The IC of claim 5 , further including:
a die attach pad and lead frame contacts, wherein the second die is attached to the die attach pad; and
a blob of protective material surrounds the first die separating the encapsulation material from the first die.
7. The IC of claim 5 , further including:
a die attach pad and lead frame contacts, wherein the second die is attached to the die attach pad; and
wherein the first die is positioned in a cavity in the die attach pad such that the first die is positioned between the second die and the die attach pad.
8. The IC of claim 1 , wherein the first die is flipped and mounted on the second die such that the top surface of the first die is adjacent to the top surface of the second die.
9. The IC of claim 8 , further comprising a soft die attach material located between the top surface of the first die and the top surface of the second die.
10. The IC of claim 9 , wherein the soft die attach material has a thickness of approximately 20 μm.
11. The IC of claim 1 , further comprising solder bumps placed on the second die to form a flip-chip die.
12. The IC of claim 11 , further comprising a substrate, wherein the first die is attached to the substrate and the solder bumps of the second die are attached to the substrate such the second die is positioned above the first die.
13. The IC of claim 12 , further comprising encapsulation material placed on the substrate to surround the first die and the second die.
14. The IC of claim 1 , wherein the electronic circuit is an oscillator circuit or a filter circuit.
15. A method for operating an oscillator, the method comprising:
using a microelectromechanical (MEMS) resonator as a tank circuit of the oscillator to produce a resonant frequency of operation, wherein the MEMS resonator is on a first substrate and the oscillator is on a second substrate separated from the first substrate; and
inductively coupling the MEMS resonator to the oscillator using a first coil on the first substrate positioned in proximity to a second coil on the second substrate.
16. The method of claim 15 , wherein the first coil has m turns, the second coil has n turns, and n is greater than m.
17. The method of claim 15 , further comprising:
fabricating the oscillator circuit on the first substrate; and
fabricating the second coil as a planar inductor in one or more metallic layers on a surface of the first substrate.
18. The method of claim 15 , further comprising:
fabricating the. MEMS resonator on the second substrate; and
fabricating the transformer as a planar inductor in one or more metallic layers on a surface of the second substrate.
19. A method for operating an oscillator, the method comprising:
placing a first device adjacent to a second device, wherein the first device includes a microelectromechanical (MEMS) resonator connected to a first coil, and the second device includes an oscillator circuit coupled to a second coil;
inductively coupling the MEMS resonator to the oscillator using the first coil on the first device positioned in proximity to the second coil on the second device; and
using MEMS resonator as a tank circuit of the oscillator to produce a resonant frequency of operation.
20. The method of claim 19 , further comprising removing the first device from adjacent the second device to cause the oscillator to cease oscillation.