Printed circuit board (PCB) mount for headphone earcup

1. A headphone system comprising:

an earcup comprising:

an outer portion including a capacitive touch interface; and

an inner portion opposing the outer portion and including a capacitive touch surface corresponding with the capacitive touch interface;

a mount coupled to the earcup, the mount comprising:

a plate contacting at least a portion of the capacitive touch surface, the plate including at least one printed circuit board (PCB) mount; and

a coupling element extending from the plate and including at least one coupler engaging the inner portion of the earcup; and

a PCB coupled with the at least one PCB mount and electrically connected with the capacitive touch surface,

wherein the at least one PCB mount extends away from the capacitive touch interface to physically separate the PCB from the capacitive touch surface.

2. The headphone system of claim 1 , wherein the inner portion of the earcup comprises a spine extending therethrough, and wherein the coupling element is sized to matingly engage the spine.

3. The headphone system of claim 2 , wherein the spine comprises an arcuate surface along the inner portion of the earcup, and wherein the coupling element comprises an arcuate coupler sized to matingly engage the spine.

4. The headphone system of claim 2 , wherein the coupling element comprises a cable slot sized to accommodate at least one cable extending into the spine of the earcup.

5. The headphone system of claim 2 , further comprising a continuous headband spring at least partially received by the spine of the earcup.

6. The headphone system of claim 1 , wherein the plate comprises:

a first surface from which the at least one PCB mount extends; and

a second surface opposing the first surface, the second surface having a substantially planar interface contacting the capacitive touch surface.

7. The headphone system of claim 6 , wherein the plate further comprises a retention feature extending from the first surface of the plate.

8. The headphone system of claim 1 , wherein the at least one PCB mount comprises at least one boss, and wherein the system further comprises a boss coupler joining the PCB and the PCB mount.

9. The headphone system of claim 1 , wherein the plate further comprises at least one of:

a cable management feature sized to engage at least one cable extending from the PCB,

at least one alignment pin for aligning the PCB relative to the plate, or

a cable guide having an overhang for preventing contact between at least one cable and the PCB.

10. The headphone system of claim 1 , further comprising:

an additional earcup; and

a headband connecting the earcup and the additional earcup.

11. The headphone system of claim 1 , wherein the plate is located between the PCB and the capacitive touch surface.

12. A headphone system comprising:

an earcup comprising:

an outer portion including a capacitive touch interface; and

an inner portion opposing the outer portion and including a capacitive touch surface corresponding with the capacitive touch interface;

a mount coupled to the earcup, the mount comprising:

a plate directly contacting at least a portion of the capacitive touch surface, the plate including at least one printed circuit board (PCB) mount; and

a coupling element extending from the plate and including at least one coupler engaging the inner portion of the earcup; and

a PCB coupled with the at least one PCB mount and electrically connected with the capacitive touch surface.

13. The headphone system of claim 12 , wherein the inner portion of the earcup comprises a spine extending therethrough, and wherein the coupling element is sized to matingly engage the spine.

14. The headphone system of claim 13 , further comprising a continuous headband spring at least partially received by the spine of the earcup.

15. The headphone system of claim 14 , further comprising:

an additional earcup; and

a headband connecting the earcup and the additional earcup, wherein the headband includes the continuous headband spring.

16. A headphone system comprising:

an earcup comprising:

an outer portion including a capacitive touch interface; and

an inner portion opposing the outer portion and including a capacitive touch surface corresponding with the capacitive touch interface,

wherein the inner portion of the earcup comprises a spine extending therethrough;

a mount coupled to the earcup, the mount comprising:

a plate contacting at least a portion of the capacitive touch surface, the plate including at least one printed circuit board (PCB) mount; and

a coupling element extending from the plate and including at least one coupler engaging the inner portion of the earcup,

wherein the coupling element is sized to matingly engage the spine;

a PCB coupled with the at least one PCB mount and electrically connected with the capacitive touch surface; and

a continuous headband spring at least partially received by the spine of the earcup.

17. The headphone system of claim 16 , wherein the spine permits movement of the earcup along the continuous headband spring.

18. The headphone system of claim 17 , wherein the earcup is movable along the continuous headband spring without modifying a length of the continuous headband spring.

19. The headband system of claim 16 , wherein the spine extends at least partially through the earcup.

20. The headband system of claim 16 , wherein the spine comprises an arcuate surface along the inner portion of the earcup, wherein the coupling element comprises an arcuate coupler sized to matingly engage the spine, and wherein the capacitive touch surface does not extend to the arcuate surface corresponding with the spine.