Smartcard comprising a fingerprint sensor and method for manufacturing the smartcard

1. Method for manufacturing a smartcard comprising a fingerprint sensor, the method comprising:

arranging a fingerprint sensor module in an opening of a carrier layer of a smartcard body;

arranging a plurality of layers on a first side of the carrier layer to cover the sensing surface of the fingerprint sensor module;

forming a cavity in the smartcard in an area corresponding to a sensing area of the fingerprint sensor module, wherein the cavity is formed in the outermost layer of the plurality of layers covering the sensing surface of the fingerprint sensor module;

forming a plurality of surface structures in the cavity of the smartcard; and

depositing a liquid hydrophobic material in the cavity to at least partially cover the surface structures.

2. The method according to claim 1 , wherein the smartcard comprises a thermoplastic material and wherein the cavity is formed using a thermal pressing tool comprising a pressing plate comprising a surface structure configured to form the cavity and the surface structures.

3. The method according to claim 2 , wherein the surface structures are formed in the same step as the formation of the cavity.

4. The method according to claim 1 , wherein depositing the hydrophobic material comprises dispensing a liquid hydrophobic material in the cavity and curing the hydrophobic material.

5. The method according to claim 1 , wherein depositing the hydrophobic material comprises spray coating the liquid hydrophobic material in the cavity and curing the hydrophobic material.

6. The method according to claim 1 , wherein depositing a hydrophobic material in the cavity comprises fully covering the surface structures.

7. The method according to claim 1 , wherein the surface structures have a maximum cross section size in the plane of the smart card surface in the range of 5-100 μm.

8. The method according to claim 1 , wherein the surface structures have a height in the range of 5-50 μm.

9. The method according to claim 1 , wherein the hydrophobic material is a fluorinated carbon polymer.

10. The method according to claim 1 , wherein the smartcard comprises a plurality of layers arranged on a second side of the carrier layer, opposite the first side of the carrier layer, to cover the backside of the fingerprint sensor module.

11. A smartcard comprising:

a carrier layer comprising a fingerprint sensor module arranged in an opening of the carrier layer, the fingerprint sensor module having a front side comprising a sensing surface and a backside opposite the front side;

a plurality of layers arranged on a first side of the carrier layer to cover the sensing surface of the fingerprint sensor module;

a plurality of layers arranged on a second side of the carrier layer, opposite the first side of the carrier layer, to cover the backside of the fingerprint sensor module;

wherein the outermost layer of the plurality of layers covering the sensing surface of the fingerprint sensor module comprises a cavity in an area corresponding to the sensing surface of the fingerprint sensor module, the cavity comprising a plurality of surface structures and a hydrophobic material located in the cavity and at least partially covering the surface structures.

12. The smartcard according to claim 11 , wherein the surface structures have a largest cross section size in the plane of the smart card surface in the range of 5-100 μm.

13. The smartcard according to claim 11 , wherein the surface structures have a height in the range of 5-50 μm.

14. The smartcard according to claim 11 , wherein the hydrophobic material is a fluorinated carbon polymer.

15. The smartcard according to claim 11 , wherein the cavity has a depth in the range of 10-50 μm.