Wafer level package and method of manufacture

1. A wafer level package, comprising:

a functional wafer with a first surface;

device structures connected to device pads arranged on the first surface;

a cap wafer having an inner surface and an outer surface, the inner surface being bonded to the first surface of the functional wafer;

a frame structure surrounding the device structures and being arranged between the functional wafer and the cap wafer;

connection posts connecting the device pads on the first surface to inner cap pads on the inner surface;

electrically conducting vias guided through the cap wafer connecting the inner cap pads on the inner surface and package pads on the outer surface of the cap wafer

a bridging line on the inner surface connecting two of the connection posts; and

a conductor line on the first surface, wherein an air gap exists between the bridging line and the conductor line such that the bridging line and the conductor line form a contactless line crossing.

2. The wafer level package of claim 1 , wherein the functional wafer is a substrate wafer with a functional layer on the first surface, and wherein the cap wafer comprises the same material as the substrate wafer.

3. The wafer level package of claim 1 , wherein the functional wafer is a silicon wafer with a piezoelectric layer applied on the first surface, and wherein the device structures are electrodes adapted for exciting acoustic waves in the piezoelectric layer.

4. The wafer level package of claim 1 , wherein the electrically conducting vias are filled with tungsten, and wherein the inner cap pads on the inner surface or the package pads on the outer surface of the cap wafer comprise a structured tungsten layer.

5. The wafer level package of claim 2 , wherein a thickness of the cap wafer is smaller than a thickness of the functional wafer.

6. The wafer level package of claim 3 , wherein the piezoelectric layer is a thin-film piezoelectric layer.