LED fabrication using high-refractive-index adhesives
Silicone-containing adhesive layer formed by cyclic ring-opening polymerization and comprising amounts of an organic base and bonding a wavelength converting layer to a thickness of sapphire in a light-emitting diode (LED) apparatus. Methods enabling its uninhibited curing so as to achieve contaminant-free and debris-free adhesion between surfaces. LED apparatus designed and manufactured such that surfaces to be bonded together are prepared in a manner that facilitates use of high-refractive-index adhesives. A multi-step process involving two different concentrations of a catalyst is performed so as to fabricate highly-reliable, non-browning, and non-cracking high-refractive-index adhesives for light-emitting diode component fabrication.
1. An apparatus comprising:
a sapphire substrate having a first surface and an oppositely positioned second surface;
an epitaxial layer disposed on the first surface of the sapphire substrate, the epitaxial layer
forming an active region of a light-emitting diode that emits visible blue light in a wavelength range of about 450 to about 470 nm;
a wavelength converting member disposed adjacent the second surface of the sapphire substrate; and
a silicone-containing adhesive layer disposed between the second surface of the sapphire substrate and the wavelength-converting member, in direct contact with the second surface of the sapphire substrate, in direct contact with the wavelength converting member, formed by a cyclic ring-opening polymerization of the silicone, comprising amounts of at least one organic base, and exhibiting a crosslink density gradient between the second surface of the sapphire substrate and the wavelength converting member.
2. The apparatus of claim 1 , wherein the crosslink density gradient exhibits a relatively higher crosslink concentration in a first region of the silicone-containing adhesive layer near the wavelength-converting member and a relatively lower crosslink concentration in a second region of the silicone-containing adhesive layer near the second surface of the sapphire substrate.
3. The apparatus of claim 1 , wherein the wavelength-converting member comprises a ceramic.
4. The apparatus of claim 1 , wherein the sapphire substrate has an index of refraction of about 1.75 to about 1.8.
5. The apparatus of claim 1 , wherein the silicone-containing adhesive layer has an index of refraction of about 1.5 to about 1.7.
6. The apparatus of claim 1 , wherein the wavelength-converting member has an index of refraction of about 1.7 to about 2.0.
7. The apparatus of claim 1 , wherein the organic base comprises at least one of, guanidines, amidines, phophazenes, quaternary phosphonium or ammonium hydroxides, or combinations thereof.
8. The apparatus of claim 7 , wherein the organic base comprises at least one of tetramethylguanidine, 1,5-Diazabicyclo[4.3.0]non-5-ene, or 1,8-diazabicyclo[5.4.0]undec-7-ene, or 1,5,7-triazabicyclo[4.4.0]dec-5-ene, or combinations thereof.
9. The apparatus of claim 1 , wherein the crosslink density gradient exhibits a relatively higher crosslink concentration in a first region of the silicon-containing adhesive layer near the second surface of the sapphire substrate and a relatively lower crosslink concentration in a second region of the silicon-containing adhesive layer near the wavelength converter.
10. The apparatus of claim 1 , wherein:
the sapphire substrate has an index of refraction of about 1.75 to about 1.8;
the silicone-containing adhesive layer has an index of refraction of about 1.5 to about 1.7; and
the wavelength-converting member has an index of refraction of about 1.7 to about 2.0.
11. The apparatus of claim 10 , wherein the wavelength-converting member comprises a ceramic.
12. The apparatus of claim 11 , wherein the crosslink density gradient exhibits a relatively higher crosslink concentration in a first region of the silicon-containing adhesive layer near the wavelength-converting member and a relatively lower crosslink concentration in a second region of the silicone-containing adhesive layer near the second surface of the sapphire substrate.
13. The apparatus of claim 11 , wherein the crosslink density gradient exhibits a relatively higher crosslink concentration in a first region of the silicone-containing adhesive layer near the second surface of the sapphire substrate and a relatively lower crosslink concentration in a second region of the silicon-containing adhesive layer near the wavelength converter.
14. A method comprising:
providing an epitaxial layer on a first surface of a sapphire substrate to form an active region of a light-emitting diode that emits visible blue light in a wavelength range of about 450 to about 470 nm; and
attaching a wavelength converting member to a second surface of the sapphire substrate, opposite from the first surface, with a silicon-containing adhesive layer disposed in direct contact with the second surface of the sapphire substrate and in direct contact with the wavelength-converting member, formed by a cyclic ring-opening polymerization of the silicone, comprising amounts of at lest one organic base, and exhibiting a crosslink density gradient between the second surface of the sapphire substrate and the wavelength converting member.
15. The method of claim 14 , wherein the crosslink density gradient exhibits a relatively higher crosslink concentration in a first region of the silicone-containing adhesive layer near the wavelength converting member and a relatively lower crosslink concentration in a second region of the silicone-containing adhesive layer near the second surface of the sapphire substrate.
16. The method of claim 14 , wherein the wavelength-converting member comprises a ceramic.
17. The method of claim 14 , wherein attaching the wavelength converter to the sapphire substrate comprises applying pressure to the wavelength-converting member to press into the silicon-containing adhesive layer.
18. The method of claim 14 , wherein the crosslink density gradient exhibits a relatively higher crosslink concentration in a first region of the silicone-containing adhesive layer near the second surface of the sapphire substrate and a relatively lower crosslink concentration in a second region of the silicone-containing adhesive layer near the wavelength converter.