Insertion component positioning inspection method and insertion component mounting method, and insertion component positioning inspection device and insertion component mounting device

1. An insertion component positioning inspection method for determining whether an insertion component provided with a positioning-use protruding section and a surface-mounting-use electrode section can be inserted into a circuit board provided with a positioning hole into which the positioning-use protruding section is inserted and a land for connecting to the surface-mounting-use electrode section, the insertion component positioning inspection method comprising:

capturing an image of the positioning-use protruding section and the surface-mounting-use electrode section of the insertion component either separately or simultaneously using a component imaging camera;

processing the captured image to recognize positions of the positioning-use protruding section and the surface-mounting-use electrode section;

calculating a position deviation amount between the surface-mounting-use electrode section of the insertion component and the land of the circuit board based on the recognized positions of the positioning-use protruding section and the surface-mounting-use electrode section at an assumed condition in which the positioning-use protruding section of the insertion component is inserted into the positioning hole of the circuit board such that a center of the positioning-use protruding section of the insertion component is aligned with a center of the positioning hole of the circuit board; and

determining whether the insertion component can be mounted on the circuit board by determining whether the position deviation amount is within a tolerance range.

2. The insertion component positioning inspection method according to claim 1 , wherein

when calculating the position deviation amount, specification data provided by a manufacturer of the circuit board is used as data of the position of the positioning hole and the position of the land of the circuit board.

3. The insertion component positioning inspection method according to claim 1 , wherein

the position of the positioning hole and the position of the land used when calculating the position deviation amount are recognized by processing the image captured by the board imaging camera either separately or simultaneously of the positioning hole and the land of the circuit board.

4. The insertion component positioning inspection method according to claim 3 , wherein

an external diameter of the positioning-use protruding section is recognized by processing the image captured by the component imaging camera including the positioning-use protruding section,

an internal diameter of the positioning hole is recognized by processing the image captured by the board imaging camera including the positioning hole, and,

based on the recognition results of the external diameter of the positioning-use protruding section and the internal diameter of the positioning hole, based on an assumption that the positioning-use protruding section of the insertion component is inserted into the positioning hole of the circuit board, the following actions are performed: searching for a minimum value of the position deviation amount between the surface-mounting-use electrode section and the land of the circuit board by shifting the positioning-use protruding section within a range of a distance between the positioning-use protruding section and the positioning hole, determining whether the insertion component can be mounted on the circuit board by determining whether the minimum value of the position deviation amount is within a tolerance range, and in a case of determining that mounting is possible, calculating a position correction amount of the insertion component for which the position deviation amount is the minimum value.

5. An insertion component mounting method comprising:

in a state with an insertion component being held by a mounting head of a component mounter, determining whether the insertion component can be mounted on a circuit board using the insertion component positioning inspection method according to claim 1 ;

discarding the insertion component for which mounting is determined to be impossible to a specified discard location or collection location; and

mounting the insertion component for which mounting is determined to be possible on the circuit board.

6. An insertion component mounting method comprising:

in a state with an insertion component being held by a mounting head of a component mounter, determining whether the insertion component can be mounted on a circuit board using the insertion component positioning inspection method according to claim 4 ;

discarding the insertion component for which mounting is determined to be impossible to a specified discard location or collection location; and

mounting the insertion component for which mounting is determined to be possible on the circuit board after correcting a mounting position of the component by the position correction amount.

7. An insertion component positioning inspection device for determining whether an insertion component provided with a positioning-use protruding section and a surface-mounting-use electrode section can be inserted into a circuit board provided with a positioning hole into which the positioning-use protruding section is inserted and a land for connecting to the surface-mounting-use electrode section, the insertion component positioning inspection device comprising:

a component imaging camera configured to capture an image of the positioning-use protruding section and the surface-mounting-use electrode section of the insertion component either separately or simultaneously;

an image processing means configured to process the captured image to recognize positions of the positioning-use protruding section and the surface-mounting-use electrode section;

a position deviation amount calculating means configured to calculate a position deviation amount between the surface-mounting-use electrode section of the insertion component and the land of the circuit board based on a processing result of the image processing means at an assumed condition in which the positioning-use protruding section of the insertion component is inserted into the positioning hole of the circuit board such that a center of the positioning-use protruding section of the insertion component is aligned with a center of the positioning hole of the circuit board; and

a determining means configured to determine whether the insertion component can be mounted on the circuit board by determining whether the position deviation amount calculated by the position deviation calculating means is within a tolerance range.

8. An insertion component mounting device comprising:

an insertion component positioning inspection device according to claim 7 , wherein

the insertion component mounting device, in a state with an insertion component being held by a mounting head of a component mounter, determines whether the insertion component can be mounted on a circuit board using the insertion component positioning inspection device, discards the insertion component for which mounting is determined to be impossible to a specified discard location or collection location; and mounts the insertion component for which mounting is determined to be possible on the circuit board.

9. An insertion component positioning inspection device for determining whether an insertion component provided with a positioning-use protruding section and a surface-mounting-use electrode section can be inserted into a circuit board provided with a positioning hole into which the positioning-use protruding section is inserted and a land for connecting to the surface-mounting-use electrode section, the insertion component positioning inspection device comprising:

a component imaging camera configured to capture an image of the positioning-use protruding section and the surface-mounting-use electrode section of the insertion component either separately or simultaneously; and

circuitry configured to

process the captured image to recognize positions of the positioning-use protruding section and the surface-mounting-use electrode section;

calculate a position deviation amount between the surface-mounting-use electrode section of the insertion component and the land of the circuit board based on a processing result of the image processing means at an assumed condition in which the positioning-use protruding section of the insertion component is inserted into the positioning hole of the circuit board such that a center of the positioning-use protruding section of the insertion component is aligned with a center of the positioning hole of the circuit board; and

determine whether the insertion component can be mounted on the circuit board by determining whether the position deviation amount calculated by the position deviation calculating means is within a tolerance range.