Component mounter
View Patent ↗A board held by a board holding plate is heated by a heater, and after performing mounting processing of components in a region of the mounting regions of the board, a pressing process of using a pressing head to apply pressure to all the components mounted in the region at once while heating the board is performed, and a next mounting process of mounting components in a next region is performed while performing the pressing process. By performing the pressing process and the mounting process in parallel, waiting time for each process in the cycle of the mounting process and the pressing process is reduced, such that overall work time is reduced.
1. A component mounter for mounting components on a board, the component mounter comprising:
a holding member configured to hold the board at a holding surface;
a heater configured to heat an entire surface of the board;
a mounting head configured to mount the components on the board held by the holding member;
a pressing head configured to apply pressure to the component mounted on the board at a specified region that is narrower than a mounting region of the board; and
a control means configured to, after using the mounting head to perform a mounting process of mounting a component in the specified region within the mounting region of the board held by the holding member, use the pressing head to perform a pressing process of applying pressure to the component in the specified region mounted on the board while the heater heats the entire surface of the board, and use the mounting head to perform a next mounting process of mounting a component in the next specified region of the board while the pressing process is being performed.
2. The component mounter according to claim 1 , wherein
the heater is provided on the holding member so as to be capable of heating the entire surface of the board via the holding surface.
3. The component mounter according to claim 2 , further comprising:
a feeding mechanism configured to feed the holding member in a specified direction,
wherein
the control means is configured to, after performing the mounting process, perform the pressing process after heating the board with the heater and feeding the holding member a specified amount using the feeding mechanism in a state with the holding member holding the board, and perform the next mounting process while performing the pressing process, such that the pressing process and the mounting process are performed repeatedly while shifting the specified region by the specified amount each time.
4. The component mounter according to claim 3 , wherein
the pressing head is configured to apply pressure to the component at, as the specified region, a perpendicular region that is along a perpendicular direction that is perpendicular with respect to the feeding direction of the board, and
the control means is configured to, after performing the mounting process of mounting the component in the perpendicular region of the board using the mounting head, perform the pressing process after feeding the holding member the specified amount using the feeding mechanism, and use the mounting head to perform the next mounting process of mounting a component in the next perpendicular region while performing the pressing process.