Ultrasound probe
Disclosed is an ultrasound probe wherein a backing having built-in lead arrays is disposed on the rear surface side of a transducer array, and backing terminal arrays connected to the lead arrays are provided on the lower surface of the backing. A relay substrate is provided between the backing and an electronic substrate. The relay substrate is provided with electrode section arrays corresponding to the backing terminal arrays. An electrode section includes: a substrate terminal connected to a backing terminal; a via for substrate internal wiring, said via being formed at a position shifted from the substrate terminal; and a conducting path that connects the substrate terminal and the via to each other. The electrode section arrays include a transmission electrode section array, and a reception electrode section array. The shift direction of the transmission electrode section array and that of the reception electrode section array are different from each other.
1. An ultrasound probe comprising:
a transducer array;
a backing comprising
a backing body which absorbs ultrasound waves emitted from the transducer array;
a lead array disposed inside the backing the lead array electrically connected to the transducer array, and
a backing terminal array disposed on a surface of the backing body, the backing terminal array electrically connected to the lead array;
an electronic circuit which processes at least, one of transmission signals supplied to the transducer array and reception signals output from the transducer array; and
a relay board disposed between the backing and the electronic the relay board comprising an electrode array including two or more electrodes,
wherein the electrode array comprises
a first electrode array disposed on one side of a boundary, and
a second electrode at-ray disposed on the other side of the boundary, the first electrode array comprises
a first board terminal sub-array in contact with a first backing terminal sub-array in the backing terminal array,
a first via sub-array for substrate internal wiring, the first via sub-array having a two-dimensional arrangement corresponding to a two-dimensional arrangement of the first board terminal sub-array shifted in parallel in a first direction, and
a first conductive channel sub-array connecting the board terminal sub-array and the first via sub-array,
the second electrode array comprises
a second board terminal sub-array in contact with a second backing terminal sub-array in the backing terminal array,
a second via sub-array for substrate internal wiring, the second via sub-array having a two-dimensional arrangement corresponding to a two-dimensional arrangement of the second board terminal sub-array shifted in in a second direction, and
a second conductive channel sub-array connecting the second board terminal sub-array and the second via sub-array,
wherein the first direction is a direction away from the boundary on one side and is oblique to a direction orthogonal to the boundary, and the second direction is a direction away from the boundary the other side and is oblique to the direction orthogonal to the boundary.
2. The ultrasound probe according to claim 1 , wherein
a ground terminal column is disposed at the boundary.
3. The ultrasound probe according to claim 1 , wherein
an acoustic separation groove is formed at the boundary.
4. The ultrasound probe according to claim 3 , wherein
the acoustic separation groove is filled with an acoustic separation material.
5. An ultrasound probe comprising:
a transducer array;
a backing comprising
a backing body which absorbs ultrasound waves emitted from the transducer array;
a lead array disposed inside the backing the lead array electrically connected to the transducer array, and
a backing terminal array disposed on a surface of the backing body, the backing terminal array electrically connected to the lead array;
an electronic circuit which processes at least, one of transmission signals supplied to the transducer array and reception signals output from the transducer array; and
a relay board disposed between the backing and the electronic the relay board comprising an electrode array including two or more electrodes,
wherein the electrode array comprises
a first electrode array disposed on one side of a boundary, and
a second electrode at-ray disposed on the other side of the boundary, the first electrode array comprises
a first board terminal sub-array in contact with a first backing terminal sub-array in the backing terminal array,
a first via sub-array for substrate internal wiring, the first via sub-array having a two-dimensional arrangement corresponding to a two-dimensional arrangement of the first board terminal sub-array shifted in parallel in a first direction, and
a first conductive channel sub-array connecting the board terminal sub-array and the first via sub-array,
the second electrode array comprises
a second board terminal sub-array in contact with a second backing terminal sub-array in the backing terminal array,
a second via sub-array for substrate internal wiring, the second via sub-array having a two-dimensional arrangement corresponding to a two-dimensional arrangement of the second board terminal sub-array shifted in in a second direction, and
a second conductive channel sub-array connecting the second board terminal sub-array and the second via sub-array,
wherein the first direction is a direction away from the boundary on one side and the second direction is a direction away from the boundary the other side,
wherein the lead array comprises
a first lead sub-array electrically connected to the first backing terminal sub-array, and
a second lead sub-array electrically connected to the second backing terminal sub-array, and
wherein the first lead sub-array and the second lead sub-array are arranged away from each other.