Display panel with a metal wire array disposed on the bending region of a flexible substrate
The present disclosure provides a display panel. The display panel has a display region and a packaging region disposed outside the display region, and includes an array substrate including a glass substrate, a flexible substrate disposed on the glass substrate, and a scanning line and a data lines disposed on the flexible substrate, a bending region extending outside the packaging region is disposed outside the packaging region at at least one side of the flexible substrate, a metal wire array used for connecting the scanning line and the data line of the array substrate to row driving and column driving chips is disposed in the bending region on the flexible substrate, and the bending region is bent toward a side surface of the flexible substrate deviating from the scanning line.
1. A display panel having a display region and a packaging region disposed outside the display region, comprising:
an array substrate including a glass substrate having top and bottom surfaces and at least a side surface, a flexible substrate disposed on the top surface of the glass substrate, and a scanning line and a data line disposed on the flexible substrate, wherein a bending region extending outside the packaging region is disposed outside the packaging region at at least one side of the flexible substrate, a metal wire array for connecting the scanning line and the data line of the array substrate with row driving and column driving chips is disposed in the bending region on the flexible substrate, and the bending region is bent toward the side surface of the glass substrate and bonded to the side surface of the glass substrate,
wherein the glass substrate is selectively cut by laser cutting between the bending region and the packaging region, and a part of the glass substrate in the bending region is stripped off the flexible substrate after being cut by the laser cutting, so that the bending region is bent toward the side surface of the glass substrate and is bonded to the side surface of the glass substrate.
2. The display panel of claim 1 , wherein: the metal wire array comprises row metal wires connecting the scanning line of the array substrate to the row driving chip and column metal wires connecting the data line of the array substrate to the column driving chip.
3. The display panel of claim 2 , wherein: the bending region extending outside the packaging region is further disposed outside the packaging region at a lower side of the flexible substrate.
4. The display panel of claim 2 , wherein: the bending region extending outside the packaging region is further disposed outside left and right sides and the lower side of the packaging region of the flexible substrate, the metal wire array connects the scanning line of the array substrate with the row driving chip on the bending region at the left and right sides of the flexible substrate, and connects the data line of the array substrate with the column driving chip on the bending region at the lower side of the flexible substrate.
5. The display panel of claim 1 , wherein: the array substrate further comprises a flexible buffer layer disposed on the flexible substrate and covering the metal wires, and the scanning line and the data line are disposed on the flexible buffer layer.
6. The display panel of claim 5 , wherein: the row metal wires and the column metal wires are disposed on a same layer.
7. The display panel of claim 6 , wherein: the bending region extending outside the packaging region is further disposed outside the packaging region at a lower side of the flexible substrate.
8. The display panel of claim 6 , wherein: the bending region extending outside the packaging region is further disposed outside left and right sides and the lower side of the packaging region of the flexible substrate, the metal wire array connects the scanning line of the array substrate with the row driving chip on the bending region at the left and right sides of the flexible substrate, and connects the data line of the array substrate with the column driving chip on the bending region at the lower side of the flexible substrate.
9. The display panel of claim 5 , wherein: the bending region extending outside the packaging region is further disposed outside the packaging region at a lower side of the flexible substrate.
10. The display panel of claim 5 , wherein: the bending region extending outside the packaging region is further disposed outside left and right sides and the lower side of the packaging region of the flexible substrate, the metal wire array connects the scanning line of the array substrate with the row driving chip on the bending region at the left and right sides of the flexible substrate, and connects the data line of the array substrate with the column driving chip on the bending region at the lower side of the flexible substrate.
11. The display panel of claim 1 , wherein: the bending region extending outside the packaging region is further disposed outside the packaging region at a lower side of the flexible substrate.
12. The display panel of claim 1 , wherein: the bending region extending outside the packaging region is further disposed outside left and right sides and the lower side of the packaging region of the flexible substrate, the metal wire array connects the scanning line of the array substrate with the row driving chip on the bending region at the left and right sides of the flexible substrate, and connects the data line of the array substrate with the column driving chip on the bending region at the lower side of the flexible substrate.
13. The display panel of claim 1 , further comprising a color filter substrate disposed opposite to the array substrate.
14. A display panel having a display region and a packaging region disposed outside the display region, comprising:
an array substrate including a glass substrate having top and bottom surfaces and at least a side surface, a flexible substrate disposed on the top surface of the glass substrate, and a scanning line and a data line disposed on the flexible substrate, wherein a bending region extending outside the packaging region is disposed outside the packaging region at at least one side of the flexible substrate, a metal wire array for connecting the scanning line and the data line of the array substrate with row driving and column driving chips is disposed in the bending region on the flexible substrate, and the bending region is bent toward the side surface of the glass substrate and bonded to the side surface of the glass substrate,
wherein the glass substrate is completely stripped off the flexible substrate by laser stripping, so that the bending region is bent toward the side surface of the glass substrate and is bonded to the side surface of the glass substrate.
15. The display panel of claim 14 , wherein the metal wire array comprises row metal wires connecting the scanning line of the array substrate to the row driving chip and column metal wires connecting the data line of the array substrate to the column driving chip.
16. The display panel of claim 14 , wherein the array substrate further comprises a flexible buffer layer disposed on the flexible substrate and covering the metal wires, and the scanning line and the data line are disposed on the flexible buffer layer.
17. The display panel of claim 16 , wherein the row metal wires and the column metal wires are disposed on a same layer.
18. The display panel of claim 14 , wherein the bending region extending outside the packaging region is further disposed outside the packaging region at a lower side of the flexible substrate.
19. The display panel of claim 14 , wherein the bending region extending outside the packaging region is further disposed outside left and right sides and the lower side of the packaging region of the flexible substrate, the metal wire array connects the scanning line of the array substrate with the row driving chip on the bending region at the left and right sides of the flexible substrate, and connects the data line of the array substrate with the column driving chip on the bending region at the lower side of the flexible substrate.
20. The display panel of claim 14 , further comprising a color filter substrate disposed opposite to the array substrate.