Method for producing an electrical component
A method for producing an electrical component is disclosed. In an embodiment the method includes providing a carrier element providing a material having a temperature-dependent resistance, applying the material on a surface of the carrier element for producing a resistance layer on the carrier element and subsequently sintering the resistance layer for linking the resistance layer to the carrier element.
1. A method for producing an electrical component, the method comprising:
providing a carrier element;
providing a material having a temperature-dependent resistance;
applying the material on a surface of the carrier element for producing a resistance layer on the carrier element; and
subsequently sintering the resistance layer for linking the resistance layer to the carrier element,
wherein the material of the resistance layer is provided as a screen-printable ceramic paste before the resistance layer is applied onto the carrier element, and
wherein a structure of the resistance layer is printed onto the carrier element before the resistance layer is sintered by a screen printing method.
2. The method according to claim 1 , further comprising applying electrodes for applying a voltage to the resistance layer, wherein the electrodes are arranged on a surface of the resistance layer.
3. The method according to claim 1 , wherein the carrier element comprises a non-electrically conductive material having a thermal conductivity of at least W/K.
4. The method according to claim 1 , wherein the carrier element comprises a material composed of aluminum oxide, aluminum nitride or combinations thereof.
5. The method according to claim 1 , wherein the material is applied a calcined metal oxide.
6. The method according to claim 1 , wherein the resistance layer comprises a material composed of nickel oxide, manganese oxide, copper oxide, zinc oxide or composed of combinations thereof.
7. The method according to claim 2 , wherein applying the electrodes comprises applying the electrodes by a screen printing or sputtering method onto the surface of the resistance layer.
8. The method according to claim 1 ,
wherein the resistance layer is applied onto a top side of the carrier element, and
wherein an adhesive layer is applied onto an underside of the carrier element in order to adhesively bond the electrical component onto a support.
9. The method according to claim 1 ,
wherein the resistance layer is applied onto a top side of the carrier element,
wherein a silver layer is applied onto an underside of the carrier element in order to solder the electrical component onto a support.
10. The method according to claim 1 , wherein the carrier element has a thickness between 100 μm and 17 mm inclusive, and wherein the resistance layer has a layer thickness of between 5 μm and 15 μm inclusive.
11. The method according to claim 1 ,
wherein the carrier element contains a material composed of aluminum oxide or aluminum nitride or combinations thereof, and
wherein the resistance layer comprises a calcined metal oxide.