IP Library Granted Patent US 11,093,087
Granted Patent B2
US 11,093,087 · App. 15/741,489 · Granted Aug 17, 2021

Glass substrates with touchscreen technology

Inventors: Patrick J Harris (Calgary, CA); Rastislav Seffer (Okotoks, CA)
Assignee: DIRTT ENVIRONMENTAL SOLUTIONS LTD.
G06F3/044E04B2/7433E04F13/074E04F13/08E04F13/0862E04B2002/7461E04B2002/7488E04F2290/02
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Quick Facts
Patent No.
US 11,093,087
App. No.
15/741,489
Granted
Aug 17, 2021
Kind
B2
Abstract

Embodiments are generally directed to modular wall systems. Such modular wall systems include a modular frame, one or more tiles attached to the modular frame, a decorative panel positioned between at least one of the tiles and an inter-connected conductive plate, and conductive plates that are configured to hold an electrical potential and detect an electrical capacitance through the decorative panel at an identified position on the conductive plate when touched. In another embodiment, a modular wall system includes a modular frame, tiles attached to the modular frame, conductive plates that have pockets formed therein, and an inductive plate disposed in the pocket of the conductive plate. As such, the inductive plate provides a hidden switching location that, when activated, triggers transmission of a signal to a specified destination.

Claims (33)

1. A modular wall system, comprising:

a modular frame;

one or more tiles attached to the modular frame, the one or more tiles comprising an inside surface, and an outside surface positioned to be touched by an end-user;

at least one decorative panel positioned between the inside surface of at least one of the tiles and one or more interconnected conductive plates; and

the one or more conductive plates, wherein the conductive plates are configured to hold an electrical potential, and to detect an electrical capacitance through the decorative panel at an identified position on the conductive plate when the outside surface of an adjacent one of the one or more tiles is touched.

2. The modular wall system of claim 1 , wherein at least one of the conductive plates comprises a steel plate.

3. The modular wall system of claim 1 , further comprising a control unit, wherein the control unit is configured to provide power to the conductive plates and receive signals from the conductive plates.

4. The modular wall system of claim 1 , wherein the decorative panel positioned between at least one of the tiles and one or more interconnected conductive plates includes an ink layer, and is opaque, thereby concealing the adjacent conductive plate.

5. The modular wall system of claim 1 , further comprising an upper bar and a lower bar that are attached to the modular frame of the modular wall system and hold the conductive plates against the tiles.

6. The modular wall system of claim 1 , wherein the conductive plates are removable from the modular wall system, providing flexibility to change an ordering, an orientation, or a height of the conductive plates.

7. The modular wall system of claim 1 , wherein an entire tile and accompanying conductive plates and modular frame are removed and repositioned at a different location within the modular wall system.

8. A modular wall system, comprising:

a modular frame;

one or more tiles attached to the modular frame;

one or more conductive plates, wherein the conductive plates are configured to hold an electrical potential and detect an electrical capacitance at an identified position on the conductive plate when touched, and wherein at least one of the conductive plates has a pocket formed therein; and

an inductive plate disposed in the pocket of the at least one conductive plate, the inductive plate providing a hidden switching location that, when activated, triggers transmission of a signal to a specified destination.

9. The modular wall system of claim 8 , further comprising a microcontroller configured to control one or more electronically actuatable devices.

10. The modular wall system of claim 9 , wherein the inductive plate is connected to the microcontroller via a wired connection.

11. The modular wall system of claim 9 , wherein at least one of the tiles comprises a glass tile, and wherein the microcontroller is laminated to the glass tile.

12. The modular wall system of claim 8 , wherein the inductive plate operates in a neutral state and an inductive state, allowing low-voltage operation of the inductive plate.

13. The modular wall system of claim 8 , further comprising at least one decorative panel positioned between at least one of the one or more tiles and one or more of the conductive plates.

14. The modular wall system of claim 8 , wherein the transmitted signal initializes execution of a computer command.

15. The modular wall system of claim 8 , wherein the modular wall system includes a plurality of hidden switching locations disposed in a specified pattern behind a plurality of the tiles.

16. A modular wall system, comprising:

a modular frame;

one or more tiles attached to the modular frame;

one or more conductive plates, wherein the conductive plates are configured to hold an electrical potential and detect an electrical capacitance at an identified position on the conductive plate when touched, and wherein at least one of the conductive plates has a pocket formed therein;

an inductive plate disposed in the pocket of the at least one conductive plate, the inductive plate providing a hidden switching location that, when activated, triggers transmission of a signal to a specified destination; and

a microcontroller configured to control one or more electronically actuatable devices that are communicatively connected to the microcontroller via a wired or wireless connection.

17. The modular wall system of claim 16 , wherein a plurality of the conductive plates are disposed in a row within the modular frame.

18. The modular wall system of claim 17 , wherein at least two of the conductive plates in the row of plates are of different sizes.

19. The modular wall system of claim 17 , wherein at least two of the conductive plates in the row of plates are oriented differently.

20. The modular wall system of claim 16 , wherein the conductive plates are disposed such that the conductive plates surround the inductive plate.

Assignments (4)
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE NAME TO REMOVE THE COMMA PREVIOUSLY RECORDED AT REEL: 048486 FRAME: 0351. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT . Recorded May 26, 2021
From: DIRTT ENVIRONMENTAL SOLUTIONS INC.
To: DIRTT ENVIRONMENTAL SOLUTIONS LTD.
Reel/Frame 057729/0920 →
SECURITY INTEREST Recorded Jul 24, 2019
From: DIRTT ENVIRONMENTAL SOLUTIONS LTD
To: ROYAL BANK OF CANADA
Reel/Frame 049855/0258 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 2, 2019
From: DIRTT ENVIRONMENTAL SOLUTIONS, INC.
To: DIRTT ENVIRONMENTAL SOLUTIONS, LTD
Reel/Frame 048486/0351 →
CORRECTIVE ASSIGNMENT TO CORRECT THE APPLICATION NUMBER PREVIOUSLY RECORDED AT REEL: 045926 FRAME: 0138. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Mar 1, 2019
From: HARRIS, PATRICK; SEFFER, RATISLAV
To: DIRTT ENVIRONMENTAL SOLUTIONS, INC.
Reel/Frame 048481/0926 →
Continuity (2)
Provisional Application 62348718 · Jun 10, 2016
Related Publication 20180195290A1 · Jul 12, 2018