IP Library Granted Patent US 10,591,331
Granted Patent B2
US 10,591,331 · App. 15/741,554 · Granted Mar 17, 2020

Intake temperature detection device and maximum heat generating amount components mounted on a single circuit board

Inventors: Takahiro Yamamoto (Hitachinaka, JP); Hiroaki Hoshika (Hitachinaka, JP); Takayuki Yogo (Hitachinaka, JP); Takahiro Miki (Hitachinaka, JP); Takeo Hosokawa (Hitachinaka, JP); Yuki Isoya (Hitachinaka, JP)
Assignee: Hitachi Automotive Systems, Ltd.
G01F1/6842F02D41/18G01F1/68G01F1/684G01F1/688G01F5/00G01K1/16G01K13/02G01N25/56G01N27/121F02D2200/0418G01K2205/02
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Quick Facts
Patent No.
US 10,591,331
App. No.
15/741,554
Granted
Mar 17, 2020
Kind
B2
Abstract

The present invention reduces, by optimizing disposition of components on an electronic circuit board, heat transfer from other components mounted on the same board, and improves measurement accuracy of an intake air temperature detection element. A physical quantity detection device of the present invention has an electronic circuit board, which is provided with one or more intake air temperature detection elements (elements having intake air temperature detection function), and which processes electric signals. Furthermore, the physical quantity detection device has a configuration wherein the intake air temperature detection elements, and a power supply regulator having the maximum heat generation quantity are mounted on the same electronic circuit board. The physical quantity detection device is characterized in that the intake air temperature detection elements are disposed on the air flow upstream side of the power supply regulator.

Claims (10)

1. A physical quantity detection device comprising one or more intake temperature detection elements and an electronic circuit board processing an electric signal,

wherein the one or more intake temperature amount detection elements and a component having a maximum heat generation amount are configured to be mounted on the same electronic circuit board,

the one or more intake temperature detection elements are arranged on a surface of a first side of the electronic circuit board, and the component having the maximum heat generation amount is arranged on a surface of a second side of the electronic circuit board different from the first side, and

the one or more intake temperature detection elements are arranged at an air flow upstream portion with respect to the component having the maximum heat generation amount.

2. The physical quantity detection device according to claim 1 , further comprising other components having a heat generation amount mounted on the electronic circuit board, wherein, of the component having the maximum heat generation amount and other components having heat generation amounts, three components having the first to third highest heat generation amounts are arranged, from air flow downstream, in a descending order of the heat generation amount.

3. The physical quantity detection device according to claim 2 , wherein the three components having the first to third highest heat generation amounts are a power supply regulator, an LSI, and a microcomputer, in the descending order of the heat generation amount.

4. The physical quantity detection device according to claim 1 , wherein at least one of the one or more intake temperature detection elements has a humidity detection function.

5. The physical quantity detection device according to claim 1 , wherein a board main body of the electronic circuit board is made of a material made of glass epoxy resin.

6. The physical quantity detection device according to claim 1 , wherein an independent sub-passage for taking in a measurement target gas passing through a main passage is formed on the surface of the first side where the one or more intake temperature detection elements of the electronic circuit board are mounted, and

an entire or a part of the component having the maximum heat generation amount is arranged at a position on an opposite side of the sub-passage with the electronic circuit board interposed therebetween.

Assignments (2)
CHANGE OF NAME Recorded Mar 25, 2021
From: HITACHI AUTOMOTIVE SYSTEMS, LTD.
To: HITACHI ASTEMO, LTD.
Reel/Frame 056299/0447 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 3, 2018
From: YAMAMOTO, TAKAHIRO; HOSHIKA, HIROAKI; YOGO, TAKAYUKI; MIKI, TAKAHIRO; HOSOKAWA, TAKEO; ISOYA, YUKI
To: HITACHI AUTOMOTIVE SYSTEMS, LTD.
Reel/Frame 044522/0997 →
Priority Claims (1)
JP 2015-192505 · Sep 30, 2015 · national
Continuity (1)
Related Publication 20180372520A1 · Dec 27, 2018