Power semiconductor device
Provided is a power semiconductor device which is able to have improved connection reliability between a wiring line and an electrode of a power semiconductor element in comparison to conventional power semiconductor devices. This power semiconductor device is provided with: a semiconductor element; an insulating substrate having an electrode layer to which the semiconductor element is bonded; an external wiring line which is solder bonded to an upper surface electrode of the semiconductor element and has an end portion for external connection, said end portion being bent toward the upper surface; and a frame member which is affixed to the electrode layer of the insulating substrate. The frame member has a fitting portion that is fitted with the end portion for external connection; and the external wiring line has at least two projected portions that protrude toward the semiconductor element.
1. A power semiconductor device comprising:
an insulating substrate configured to include a first conductor layer and a second conductor layer provided respectively on opposite surfaces in a thickness direction of an insulating layer;
a plurality of semiconductor elements joined to the first conductor layer via a first anchoring layer;
an external connecting member having an element coupler and an external connection end, wherein the external connecting member is bent between the external connection end and the element coupler in the thickness direction, the element coupler extending along the first conductor layer with the semiconductor elements positioned between the external connecting member and the first conductor layer, and joined to the semiconductor elements via a second anchoring layer; and
a frame member surrounding the plurality of semiconductor elements on the first conductor layer and joined to the first conductor layer via a third anchoring layer; wherein
the frame member includes a fitting portion fitted to the external connection end,
the external connecting member includes at least two projections extending toward the semiconductor elements, and
the first conductor layer is positioned above the insulating layer, and the frame member is positioned entirely above the first conductor layer.
2. The power semiconductor device according to claim 1 , wherein the element coupler includes a recess provided in a contact surface contacting with the second anchoring layer.
3. The power semiconductor device according to claim 1 , wherein the frame member further includes a convex extending toward the first conductor layer, the convex being provided on a contact surface contacting with the third anchoring layer.
4. The power semiconductor device according to claim 1 , wherein the frame member further includes a recess provided in the contact surface contacting with the third anchoring layer.
5. The power semiconductor device according to claim 1 , wherein the external connecting member has a linear expansion coefficient less than a linear expansion coefficient of a Cu alloy and more than a linear expansion coefficient of the semiconductor elements.