IP Library Granted Patent US 10,907,999
Granted Patent B2
US 10,907,999 · App. 15/741,943 · Granted Feb 2, 2021

Gas sensor device

Inventors: Hiroshi Nakano (Tokyo, JP); Masahiro Matsumoto (Tokyo, JP); Yasuo Onose (Hitachinaka, JP); Yoshimitsu Yanagawa (Tokyo, JP)
Assignee: Hitachi Automotive Systems, Ltd.
G01D11/245G01F1/696G01N25/18G01N27/18F02M35/1038
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Quick Facts
Patent No.
US 10,907,999
App. No.
15/741,943
Granted
Feb 2, 2021
Kind
B2
Abstract

To provide a gas sensor device having improved measurement accuracy. This gas sensor device is provided with: a sensor element that detects the concentration of a gas by means of heat dissipation from a heat generating body; and a cover with which the sensor element is covered. The cover has a plurality of ventilation sections, which are disposed by being separated with each other in the direction perpendicular to the flowing direction of the gas, and the sensor element is disposed between the ventilation sections.

Claims (22)

1. A gas sensor device comprising:

a sensor element that detects a concentration of gas by heat dissipation of a heating element;

a cover that covers the sensor element, wherein

the cover has a plurality of ventilation portions,

the plurality of ventilation portions are arranged while being apart from each other in a direction perpendicular to a flow direction of the gas,

the sensor element is arranged at a position opposing an inner surface of the cover, the inner surface is arranged between the plurality of ventilation portions,

a gap between the sensor element and the inner surface of the cover is smaller than a height of an inner space covered by the cover, and

a guide member that rectifies a flow direction of the cover surface in which the plurality of ventilation portions are formed; and

throttle members which are disposed between the plurality of ventilation portions, to thereby increase ventilation resistance between the plurality of ventilation portion, and to suppress flow between the plurality of ventilation portions, wherein

a shape of the guide member is a passage structure formed by additional guide members and a plurality of shielding members, which penetrate in the flow direction.

2. The gas sensor device according to claim 1 , wherein a distance between the sensor element and the cover is narrower than a size of the ventilation portion.

3. The gas sensor device according to claim 2 , wherein a perpendicular distance of the ventilation portion is larger than a flow direction diameter of the ventilation portion,

the height of the inner space is larger than the diameter of the ventilation portion, and

the diameter of the ventilation portion is larger than the gap between the sensor element and the inner surface of a corner.

4. The gas sensor device according to claim 1 , wherein a rectifying member that rectifies a flow of gas is provided outside the cover.

5. The gas sensor device according to claim 1 , wherein a throttle portion is provided in an internal space between the plurality of ventilation portions.

6. The gas sensor device according to claim 1 , wherein the plurality of ventilation portions each further includes an aggregate of a plurality of ventilation holes.

7. The gas sensor device according to claim 6 , wherein the plurality of ventilation portions each further includes an aggregate of a plurality of ventilation holes, and

one or more ventilation holes constituting the ventilation portions are horizontally elongated in a direction perpendicular to or intersecting a flow direction.

8. The gas sensor device according to claim 7 , wherein an opening area on an upstream side of the plurality of ventilation portions is more expanded than an opening area on a downstream side of the plurality of ventilation portions.

9. The gas sensor device according to claim 1 , further comprising a net-like mesh member covering the plurality of ventilation portions.

10. The gas sensor device according to claim 1 , wherein the substrate is formed of single crystal silicon, a hollow portion is formed in the substrate, and the heating element and a second heating element are disposed in the hollow portion.

Assignments (2)
CHANGE OF NAME Recorded Nov 30, 2021
From: HITACHI AUTOMOTIVE SYSTEMS, LTD.
To: HITACHI ASTEMO, LTD.
Reel/Frame 058481/0935 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 5, 2018
From: NAKANO, HIROSHI; MATSUMOTO, MASAHIRO; ONOSE, YASUO; YANAGAWA, YOSHIMITSU
To: HITACHI AUTOMOTIVE SYSTEMS, LTD.
Reel/Frame 044547/0240 →
Priority Claims (1)
JP 2015-169976 · Aug 31, 2015 · national
Continuity (1)
Related Publication 20180188088A1 · Jul 5, 2018