Component mounter and component mounting system for mounting stacked components
During mounting of an upper component on a lower component, after mounting the lower component on a board, the Z-axis position of a suction nozzle tip is detected during mounting of the lower component on the board and memorized as a lower component height, and when mounting the upper component PU, the suction nozzle is lowered at relatively high speed until reaching a specified position that is a distance above the lower component height, and the suction nozzle is lowered at a speed that is slower than the speed after arriving at the specified position until contact with the lower component.
1. A component mounter for mounting multiple components in a stack on a board, the component mounter comprising:
a head including a nozzle configured to hold a component of the multiple components;
a raising and lowering device configured to raise and lower the nozzle, the raising and lowering device including at least one motor;
a raising and lowering position sensor configured to detect a raising and lowering position of the nozzle;
a contact sensor configured to detect that the component held by the nozzle has contacted a mounting target object; and
a controller configured to
control the head and the raising and lowering device to lower a first component among the multiple components to the board,
acquire position information of the first component identified based on the raising and lowering position of the nozzle detected by the raising and lowering position sensor when the contact sensor determines that the first component contacts the board, and
control the head and the raising and lowering device so as to, when mounting a second component among the multiple components to be stacked on the board, mount the second component on the first component based on the position information of the first component.
2. The component mounter according to claim 1 , wherein
the controller is configured to, when mounting the second component, after lowering the nozzle that is holding the second component to a specified position, lower the nozzle at a low speed until it is detected that the second component has contacted the first component, and
the specified position is set based on the position information of the first component.
3. The component mounter according to claim 1 , wherein
the contact sensor includes a pressure sensor configured to detect pressure applied to the nozzle, and is configured to detect that the component held by the nozzle has contacted the mounting target object by using the pressure sensor to detect that the pressure is a specified value or greater.
4. The component mounter according to claim 1 , wherein
the raising and lowering device includes
a first raising and lowering device configured to raise and lower the nozzle within a specified range, and
a second raising and lowering device configured to raise and lower the nozzle within a range shorter than the specified range and to be raisable and lowerable together with the nozzle via the first raising and lowering device.