IC chip card
An integrated circuit (IC) chip card includes a card body and an integrated IC chip module located in a recess provided by the card body on one side thereof. The IC chip module includes a substrate having outward-facing and inward-facing surfaces, and a first plurality of contact pads supportably interconnected to the outward-facing surface of the substrate. The IC chip module further includes a first IC chip supportably interconnected to the inward-facing surface of the substrate and electrically interconnected to the first plurality of contact pads for processing a signal received therefrom. The IC chip module may also include a second plurality of contact pads supportably interconnected to the outward-facing surface of the substrate. The IC chip module may further include conductive protrusions supportably connected to the inward-facing surface and having protruding ends that extend in to a thickness of corresponding embedded conductive contacts of the card body.
1. A chip card comprising:
a card body, at least a first plurality of conductive contacts that are each at least partially embedded in the card body, and an integrated circuit (IC) chip module located in a recess provided by the card body on one side of the chip card;
wherein said IC chip module includes:
a substrate having outward-facing and inward-facing surfaces;
a first plurality of contact pads supportably interconnected to said outward-facing surface of the substrate for contact engagement with a contact chip card reader;
a first IC chip supportably interconnected to the inward-facing surface of the substrate and electrically interconnected to the first plurality of contact pads for processing contact communication signals to/from a contact chip card reader; and,
at least a first plurality of conductive protrusions supportably interconnected at corresponding first ends to the inward-facing surface of the substrate and electrically interconnected to different corresponding ones of a plurality of electrical contacts of said first IC chip, wherein corresponding, protruding second ends of said first plurality of conductive protrusions extend into a thickness of different corresponding ones of said first plurality of conductive contacts;
wherein the chip card further comprises a second IC chip electrically interconnected to said first plurality of conductive contacts and at least partially embedded in the card body for processing a biometric signal.
2. A chip card as recited in claim 1 , wherein said protruding second ends of said first plurality of conductive protrusions are each surrounded by and physically interconnected to different corresponding ones of said first plurality of conductive contacts.
3. A chip card as recited in claim 2 , wherein said protruding second ends of said first plurality of conductive protrusions and said different corresponding ones of said first plurality of conductive contacts are fused together.
4. A chip card as recited in claim 1 , wherein said first plurality of conductive protrusions are each defined by wire bonding at a corresponding electrical contact supportably interconnected to said inward-facing surface of the substrate.
5. A chip card as recited in claim 1 , wherein said first plurality of conductive protrusions comprise at least one of:
gold;
a gold alloy;
copper;
a copper alloy;
aluminum; and,
an aluminum alloy.
6. A chip card as recited in claim 1 , further comprising:
a first antenna electrically interconnected to the first plurality of conductive contacts and at least partially embedded in the card body for contactless communication with a contactless chip card reader.
7. A chip card as recited in claim 1 , wherein said biometric signal is one of an electrocardiogram signal and fingerprint signal.
8. A chip card as recited in claim 1 , wherein said IC chip module further comprises:
a second plurality of contact pads supportably interconnected to said outward-facing surface of the substrate for contact engagement with at least one appendage of a user for providing said biometric signal to said second IC chip for processing to authenticate a user and thereby enable said first IC chip.
9. A chip card as recited in claim 8 , further comprising:
a second plurality of conductive contacts that are each at least partially embedded in the card body, and electrically interconnected to different corresponding ones of a plurality of electrical contacts of said second IC chip; and,
wherein said IC chip module further comprises:
a second plurality of conductive protrusions supportably interconnected at corresponding first ends to the inward-facing surface of the substrate and electrically interconnected to different ones of said second plurality of contact pads, wherein corresponding, protruding second ends of said second plurality of conductive protrusions extend into a thickness of different corresponding ones of said second plurality of conductive contacts.
10. A chip card as recited in claim 9 , further comprising:
a third plurality of conductive contacts that are each at least partially embedded in the card body;
a first antenna electrically interconnected to the third plurality of conductive contacts and at least partially embedded in the card body for contactless communications with a contactless chip card reader; and,
wherein said IC chip module further comprises:
a third plurality of conductive protrusions supportably interconnected at corresponding first ends to the inward-facing surface of the substrate and electrically interconnected to different corresponding ones of said plurality of electrical contacts of said first IC chip, wherein corresponding, protruding second ends of said third plurality of conductive protrusions extend into a thickness of different corresponding ones of said third plurality of conductive contacts.
11. A chip card as recited in claim 10 , wherein said first plurality of conductive contacts, said second plurality of conductive contacts and said first antenna are disposed on a substrate of a prelaminated member.
12. A chip card as recited in claim 1 , further comprising one of the following:
a finger print sensor located in another recess provided by the card body, and electrically interconnected to said second IC chip; and,
an electrocardiogram sensor located in another recess provided by the card body, and electrically interconnected to said second IC chip.
13. A chip card as recited in claim 1 , further comprising:
a biometric sensor located in another recess provided by the card body, and electrically interconnected to said second IC chip to provide said biometric signal to the second IC chip for processing to authenticate a user and thereby enable said first IC chip.
14. A chip card as recited in claim 13 , further comprising:
an electrical power storage device embedded in the card body.
15. A chip card as recited in claim 13 , further comprising:
a second plurality of conductive contacts that are each at least partially embedded in the card body;
a first antenna electrically interconnected to the second plurality of conductive contacts and at least partially embedded in the card body for contactless communication with a contactless chip card reader; and
a second plurality of conductive protrusions supportably interconnected at corresponding first ends to the inward-facing surface of the substrate and electrically interconnected to different corresponding ones of the plurality of electrical contacts of said first IC chip, wherein corresponding, protruding second ends of said second plurality of conductive protrusions extend into a thickness of different corresponding ones of said second plurality of conductive contacts.
16. A chip card as recited in claim 15 , wherein said first plurality of conductive contacts, said second plurality of conductive contacts, said biometric sensor and said first antenna are disposed on a substrate of a prelaminated member.
17. A chip card as recited in claim 16 , further comprising:
an electrical power storage device disposed on the substrate, wherein said prelaminated member is disposed between opposing core layers.
18. A chip card as recited in claim 16 , wherein the first antenna has one or more loops that define a continuous electrical pathway.
19. A chip card as recited in claim 18 , wherein said first antenna is disposed on a first side of the substrate, with loop start and loop end locations extended through the substrate to a second side thereof with a bridge therebetween on the second side.
20. A chip card as recited in claim 15 , wherein the protruding second ends of different ones of the first plurality of conductive protrusions are fused to said different corresponding ones of said first plurality of conductive contacts, and wherein the protruding second ends of different ones of the second plurality of conductive protrusions are fused to said different corresponding ones of said second plurality of conductive contacts.
21. A method of providing a chip card, comprising:
defining a recess on one side of a card body having at least a first plurality of conductive contacts that are each at least partially embedded therein;
providing an integrated circuit (IC) chip module that includes:
a substrate having outward-facing and inward-facing surfaces;
a first plurality of contact pads supportably interconnected to said outward-facing surface of the substrate for contact engagement with a contact chip card reader;
a first IC chip supportably interconnected to the inward-facing surface of the substrate and electrically interconnected to the first plurality of contact pads for processing contact communication signals to/from a contact chip card reader; and,
at least a first plurality of conductive protrusions having corresponding first ends supportably interconnected to the inward-facing surface of the substrate and electrically interconnected to different corresponding ones of a plurality of electrical contacts of said first IC chip, wherein corresponding, protruding second ends of said first plurality of conductive protrusions protrude away from the inward-facing surface of the substrate and extend into a thickness of different corresponding ones of said first plurality of conductive contacts; and,
positioning the IC chip module within the recess of the card body, wherein during said positioning the protruding second ends of said first plurality of conductive protrusions are driven into the thickness of the different corresponding ones of said first plurality of conductive contacts, and wherein said positioning further comprises applying heat and pressure to an outward-facing surface of the IC chip module.
22. A method as recited in claim 21 , wherein during said positioning said protruding second ends of said first plurality of conductive protrusions are each surrounded by and physically interconnected to said to different corresponding ones of said first plurality of conductive contacts.
23. A method as recited in claim 22 , wherein during said positioning said protruding second ends of said first plurality of conductive protrusions and said different corresponding ones of said first plurality of conductive contacts are fused together.
24. A method as recited in claim 21 , wherein said defining further comprises:
milling said recess to include an outer first portion having a first depth and an inner second portion having a second depth that is greater than the first depth, wherein a ring-shaped landing is defined by the card body to support said IC chip module, and wherein an adhesive is utilized in said second portion of the recess to secure the IC chip module to the card body in said positioning.
25. A method as recited in claim 24 , wherein said first plurality of conductive contacts are located at said landing of said card body.
26. A method as recited in claim 21 , wherein said positioning further comprises:
successively applying heat and pressure for time periods of 1.5 seconds or less to an outward-facing surface of the IC chip module.
27. A method as recited in claim 26 , wherein said heat and pressure is applied to the outward-facing surface of the IC chip module at locations aligned with the first plurality of conductive protrusions.
28. A method as recited in claim 26 , wherein said heat and pressure is applied to at least a portion of the first plurality of contact pads in regions substantially aligned with the first plurality of conductive protrusions.
29. A method as recited in claim 21 , wherein one of a first antenna and a second IC chip is electrically interconnected to said first plurality of conductive contacts and at least partially embedded in the card body.
30. A method as recited in claim 29 , wherein said card body further includes a second plurality of conductive contacts that are each at least partially embedded in the card body, wherein the IC chip module further includes a second plurality of conductive protrusions each having a corresponding first end interconnected to the inward-facing surface of the substrate and a second end protruding away from the inward-facing surface of the substrate, and wherein during said positioning the protruding second ends of said second plurality of conductive protrusions are driven into a thickness of and fused together with different corresponding ones of said second plurality of conductive contacts.
31. A method as recited in claim 30 , wherein said heat and pressure is applied to at least a portion of the first plurality of contact pads in regions substantially aligned with the first plurality of conductive protrusions and with the second plurality of conductive protrusions.
32. A method as recited in claim 30 , wherein the other one of a first antenna and a second IC chip is electrically interconnected to said second plurality of conductive contacts and at least partially embedded in the card body.
33. A method as recited in claim 32 , wherein said card body further includes a third plurality of conductive contacts that are each at least partially embedded in the card body, and wherein the IC chip module further includes:
a second plurality of contact pads supportably interconnected to said outward-facing surface of the substrate for contact engagement with at least one appendage of a user for providing a biometric signal to said second IC chip for processing to authenticate a user and thereby enable said first IC chip; and,
a third plurality of conductive protrusions each having a corresponding first end supportably interconnected to the inward-facing surface of the substrate and electrically interconnected to different ones of said second plurality of contact pads, and each having a second end protruding away from the inward-facing surface of the substrate, wherein during said positioning the protruding second ends of said third plurality of conductive protrusions are driven into a thickness of and fused together with different corresponding ones of said third plurality of conductive contacts.
34. A method as recited in claim 32 , wherein a biometric sensor is located in another recess provided by the card body and electrically interconnected to said second IC chip to provide said biometric signal to the second IC chip for processing to authenticate a user and thereby enable said first IC chip.
35. A method of providing a chip card, comprising:
defining a recess on one side of a card body having at least a first plurality of conductive contacts that are each at least partially embedded therein, wherein said defining comprises milling said recess to include an outer first portion having a first depth and an inner second portion having a second depth that is greater than the first depth, wherein a ring-shaped landing is defined by the card body;
providing an integrated circuit (IC) chip module that includes:
a substrate having outward-facing and inward-facing surfaces;
a first plurality of contact pads supportably interconnected to said outward-facing surface of the substrate for contact engagement with a contact chip card reader;
a first IC chip supportably interconnected to the inward-facing surface of the substrate and electrically interconnected to the first plurality of contact pads for processing contact communication signals to/from a contact chip card reader; and,
at least a first plurality of conductive protrusions having corresponding first ends supportably interconnected to the inward-facing surface of the substrate and electrically interconnected to different corresponding ones of a plurality of electrical contacts of said first IC chip, wherein corresponding, protruding second ends of said first plurality of conductive protrusions protrude away from the inward-facing surface of the substrate and extend into a thickness of different corresponding ones of said first plurality of conductive contacts; and,
positioning the IC chip module within the recess of the card body so that the IC chip module is supported by the ring-shaped landing, wherein an adhesive is utilized in said second portion of the recess to secure the IC chip module to the card body in said positioning, and wherein during said positioning the protruding second ends of said first plurality of conductive protrusions are driven into the thickness of the different corresponding ones of said first plurality of conductive contacts.
36. A method as recited in claim 35 , wherein said first plurality of conductive contacts are located at said landing of said card body.