Frictionless forged aluminum alloy sputtering target with improved properties
A sputtering target comprising a forged aluminum material having an average grain size between about 15 and 55 microns. The aluminum material has at least one of the following: a homogeneous texture with minimal texture banding as measured by banding factor B below about 0.01; a texture gradient H of less than 0.2; or either weak (200) texture or near random texture characterized by maximum intensity of inverse pole figure less than 3 times random in multiple directions.
1. A sputtering target comprising:
a forged aluminum or aluminum alloy material having an average grain size between 15 and 55 microns, the aluminum or aluminum alloy material having:
a homogeneous texture with minimal texture banding as measured by a banding factor B below 0.005;
a texture gradient H of less than 0.2; and
a weak (200) texture characterized by a maximum intensity of inverse pole figure less than 3 times random in multiple directions.
2. The sputtering target of claim 1 , wherein the aluminum or aluminum alloy material has the weak (200) texture in multiple directions, along planes parallel to a top surface of the target and thickness planes perpendicular to the top surface.
3. The sputtering target of claim 1 , wherein the aluminum or aluminum alloy material has a maximum pole figure intensity below 3.5 times random.
4. The sputtering target of claim 1 , wherein the aluminum or aluminum alloy material has a maximum pole figure intensity below 3.0 times random and an inverse pole figure intensity below 3.0 times random.
5. The sputtering target of claim 1 , wherein the aluminum or aluminum alloy material has a texture gradient H less than 0.12.
6. The sputtering target of claim 1 , wherein the aluminum or aluminum alloy material has a uniform average grain size distribution between 20 microns and 45 microns.
7. The sputtering target of claim 1 , wherein the aluminum or aluminum alloy material has a homogeneous texture with minimal texture banding as measured by a banding factor B below 0.0025.