Tin-plated product and method for producing same
A tin-plated product contains: a substrate 10 of copper or a copper alloy; an underlying layer 12 of nickel which is formed on the surface of the substrate 10 ; and an outermost layer 14 containing tin, the outermost layer 14 being formed on the surface of the underlying layer 12 , the outermost layer 14 being composed of a copper-tin alloy layer 14 a of a large number of crystal grains of a copper-tin alloy, tin layers 14 b of tin having an average thickness of 0.01 to 0.20 micrometers, and a plurality of copper-nickel-tin alloy layers 14 c of a copper-nickel-tin alloy, each of the tin layers 14 b being formed in a corresponding one of recessed portions between adjacent two of the crystal grains of the copper-tin alloy on the outermost surface of the copper-tin alloy layer, the copper-nickel-tin alloy layers 14 c being arranged on the side of the underlying layer 12 in the copper-tin alloy layer 14 a so as to be apart from each other.
1. A tin-plated product comprising:
a substrate of copper or a copper alloy;
an underlying layer of nickel or a copper-nickel alloy which is formed on a surface of the substrate; and
an outermost layer containing tin, the outermost layer being formed on a surface of the underlying layer,
wherein the outermost layer is composed of a copper-tin alloy layer of a copper-tin alloy, tin layers of tin, and copper-nickel-tin alloy layers of a copper-nickel-tin alloy, each of the tin layers being formed in a corresponding one of recessed portions on an outermost surface of the copper-tin alloy layer, the copper-nickel-tin alloy layers being arranged on the side of the underlying layer in the copper-tin alloy layer, the tin layers having an average thickness of 0.01 to 0.20 micrometers.
2. A tin-plated product as set forth in claim 1 , wherein said copper-tin alloy layer is formed of crystal grains of the copper-tin alloy, and each of said recessed portions is formed between adjacent two of said crystal grains of the copper-tin alloy on said outermost surface.
3. A tin-plated product as set forth in claim 1 , wherein said copper-nickel-tin alloy layers are composed of a plurality of layers which are arranged so as to be apart from each other.
4. A tin-plated product as set forth in claim 1 , wherein an area ratio occupied by said tin layers on the outermost surface of the tin-plated product is 10 to 80%.
5. A tin-plated product as set forth in claim 1 , wherein said tin layers have a maximum thickness of 1.5 micrometers or less.
6. A tin-plated product as set forth in claim 1 , wherein said copper-tin alloy layer has an average thickness of 0.5 to 1.5 micrometers.
7. A tin-plated product as set forth in claim 1 , wherein said underlying layer has an average thickness of 0.05 to 0.5 micrometers.
8. A tin-plated product as set forth in claim 1 , wherein said outermost surface has an arithmetic mean waviness Wa of 0.06 micrometers or less in such a state that said tin layers are removed.
9. An electrical element which uses a tin-plated product as set forth in claim 1 , as a material thereof.
10. A tin-plated product as set forth in claim 1 , wherein the copper-nickel-tin alloy layers are composed of a plurality of layers which are arranged so as to be apart from each other.