Field device with a component for filling potting compound

1. A field device of automation technology, comprising:

a housing including a housing opening;

an electronics part disposed within the housing; and

a fill component attached to the housing such that the fill component is disposed within the housing, the fill component configured for dispensing potting compound into the housing, wherein the fill component includes a trough structured to conduct the potting compound, with targeting, to a location within the housing to be potted, wherein the trough includes a collecting pan, which faces the housing opening, and a channel, the channel offset vertically from the collecting pan as to enable the potting compound to flow from the collecting pan into the channel,

wherein the channel is configured with an incline and cross-section to convey the potting compound from the collecting pan to a gap between the electronics part and an inner surface of the housing without entrapping air in the housing or potting compound, the gap laterally displaced from the housing opening, and

wherein the fill component is further configured to be at least partially trapped within the potting compound in assembly.

2. The field device of claim 1 , wherein the fill component is embodied as a cable holder for at least one cable passing into the housing.

3. The field device of claim 1 , wherein the fill component includes at least one component opening for de-airing the housing.

4. The field device of claim 3 , wherein the collecting pan is arranged beside the at least one component opening.

5. The field device of claim 3 , wherein the collecting pan extends around the at least one component opening.