Transfer head and transfer system for semiconductor light-emitting device and method for transferring semiconductor light-emitting device

1. A transfer head of a semiconductor light-emitting device, the transfer head comprising:

a base substrate; and

an electrode unit disposed on the base substrate to generate an electrostatic force by electrifying an undoped semiconductor layer of the semiconductor light-emitting device,

wherein the base substrate and the electrode unit are each provided to have light transmissivity so that at least a portion of the semiconductor light-emitting device is visible by sequentially passing through the base substrate and the electrode unit.

2. The transfer head of claim 1 , wherein a protrusion protrudes from one surface of the base substrate, and the electrode unit is disposed in the protrusion.

3. The transfer head of claim 1 , wherein the electrode unit is externally exposed to contact the undoped semiconductor layer.

4. The transfer head of claim 1 , further comprising a metal block unit disposed in one end of the electrode unit.

5. The transfer head of claim 4 , wherein the electrode unit comprises a first electrode and a second electrode spaced apart from each other, and the metal block unit comprises a first metal block disposed in an end of the first electrode and a second metal block disposed in an end of the second electrode.

6. The transfer head of claim 5 , wherein the first metal block and the second metal block are formed of metal having light non-transmissivity.

7. The transfer head of claim 4 , wherein the electrode unit is disposed on one surface of the base substrate, and the metal block protrudes from an end of the electrode unit in a direction passing through one surface of the base substrate.

8. The transfer head of claim 1 , wherein a via hole electrically connected to the electrode unit is provided in the base substrate.

9. The transfer head of claim 1 , wherein the electrode unit comprises a plurality of electrodes sequentially disposed at predetermined intervals on one surface of the base substrate.

10. A method of transferring a semiconductor light-emitting device including an undoped semiconductor layer disposed on a carrier substrate, the method comprising:

bringing a transfer head, including a base substrate and an electrode unit disposed on the base substrate, in adjacency to an undoped semiconductor layer of the semiconductor light-emitting device;

applying a voltage to the electrode unit in order for an adhesive force to be applied to the undoped semiconductor layer with an electrostatic force; and picking up, by the transfer head, the semiconductor light-emitting device to transfer the semiconductor light-emitting device,

wherein in the bringing of the transfer head in adjacency to the undoped semiconductor layer, the base substrate and the electrode unit are each provided to have light transmissivity so that the transfer head and the semiconductor light-emitting device are aligned.

11. A transfer head of a semiconductor light-emitting device, the transfer head comprising:

a base substrate including a plane; and

an electrode unit disposed on the plane of the base substrate to generate an electrostatic force by electrifying an undoped semiconductor layer of the semiconductor light-emitting device, the electrode unit including a first electrode lead and a second electrode lead disposed in parallel,

wherein a plurality of protrusion electrodes are provided in each of the first electrode lead and the second electrode lead to selectively pick up a plurality of semiconductor light-emitting devices with the electrostatic force.

12. The transfer head of claim 11 , wherein a plurality of first protrusion electrodes are sequentially arranged at predetermined intervals in the first electrode lead, and a plurality of second protrusion electrodes are sequentially arranged at predetermined intervals in the second electrode lead.

13. The transfer head of claim 12 , wherein the first protrusion electrodes protrude from the first electrode lead to the second electrode lead, and the second protrusion electrodes protrude from the second electrode lead to the first electrode lead.

14. The transfer head of claim 13 , wherein a metal block unit is coupled to the first protrusion electrodes and the second protrusion electrodes.

15. The transfer head of claim 11 , wherein the first electrode lead and the second electrode lead each extend in one direction on the plane and are sequentially disposed in another direction vertical to the one direction.

16. The transfer head of claim 15 , wherein at least one of the first electrode lead and the second electrode lead extends to a side surface of the base substrate.

17. The transfer head of claim 11 , wherein each of the first electrode lead and the second electrode lead is a metal thin film including at least one of Au, Ti, Pt, Ni, Cu, and Ag, or is a transparent thin film including at least one of InSnO and ZnO.

18. The transfer head of claim 11 , wherein the base substrate is formed of a light-transmitting material.

19. A transfer system for transferring a semiconductor light-emitting device disposed on a carrier substrate by using a transfer head, the transfer head comprising:

a base substrate including a plane; and

an electrode unit disposed on the plane of the base substrate to generate an electrostatic force by electrifying an undoped semiconductor layer of the semiconductor light-emitting device, the electrode unit including a first electrode lead and a second electrode lead disposed in parallel,

wherein a plurality of protrusion electrodes are provided in each of the first electrode lead and the second electrode lead to selectively pick up a plurality of semiconductor light-emitting devices with the electrostatic force.

20. The transfer system of claim 19 , wherein a positioning member where the semiconductor light-emitting device is positioned is mounted on one surface of the carrier substrate.

21. The transfer system of claim 20 , wherein the positioning member comprises: a base part overlapping the one surface of the carrier substrate; and a plurality of positioning projections protruding from the base part, the plurality of positioning projections being sequentially arranged at predetermined intervals.