BUFFER SHEET COMPOSITION AND BUFFER SHEET
The present invention provides a buffer sheet composition including a thermosetting compound, which buffer sheet composition is used for producing a buffer sheet to be interposed between a heating member and an electronic component, when the electronic component is heated by the heating member so as to mount the electronic component on a substrate, as well as a buffer sheet including a thermosetting composition layer obtained by forming the buffer sheet composition into the form of a sheet.
1 . A buffer sheet composition comprising a thermosetting compound,
wherein the buffer sheet composition is used for producing a buffer sheet to be interposed between a heating member and an electronic component in a case in which the electronic component is heated by the heating member so as to mount the electronic component on a substrate.
2 . The buffer sheet composition according to claim 1 , further comprising a polymerization initiator.
3 . The buffer sheet composition according to claim 1 , further comprising a curing agent.
4 . The buffer sheet composition according to claim 1 , further comprising a solvent.
5 . A buffer sheet comprising a thermosetting composition layer obtained by forming the buffer sheet composition according to claim 1 into a sheet.
6 . The buffer sheet according to claim 5 , comprising a support on or above one surface or both surfaces of the buffer sheet.
7 . The buffer sheet according to claim 5 , wherein the composition layer has an average thickness of 20 μm or more.