Work allocation device
A CPU of a management computer, when a work allocation processing routine is started, first, acquires a specified accuracy of each mounter, then acquires required accuracies of component types for components from a first to a last component to be mounted on a single board. Next, the CPU of the management computer performs allocation of mounting work of components from the first to the last component, and then ends the routine. Specifically, the CPU, for each component, allocates the mounting work of a given component to a mounter with a specified accuracy that satisfies the required accuracy for that component type.
1. A work allocating device for allocating mounting work of components to each of multiple mounters that configure a component mounting line, the work allocating device comprising:
a memory that stores a determined specified component mounting accuracy of each of the respective mounters determined based upon both a level of accuracy of a pickup section of the respective mounter and a level of accuracy of a tool exchangeably provided to a mounting head of the pickup section of the respective mounter; and
processing circuitry configured to
acquire from the memory the specified component mounting accuracy of each of the respective mounters;
acquire from the memory a required component mounting accuracy of respective components to be mounted, the required component mounting accuracy based on at least one of a type of the component to be mounted or a mounting position on a board of the component to be mounted; and
allocate the mounting work of the components to each of the mounters based on the required component mounting accuracies and the specified component mounting accuracies.
2. The work allocating device according to claim 1 , wherein the processing circuitry is configured to automatically set the required component mounting accuracy based on at least one of the type of the component to be mounted or the mounting position on the board of the component to be mounted.
3. The work allocating device according to claim 2 , wherein when automatically setting the required component mounting accuracy based on the mounting position on the board of the component to be mounted, the processing circuitry automatically sets the required component mounting accuracy to be a higher accuracy as a distance between the mounting position on the board of the component to be mounted and a component already mounted or to be mounted nearby the component to be mounted is reduced.
4. The work allocating device according to claim 1 , wherein
at least one of the multiple mounters includes multiple work modes with different accuracies, and
the processing circuitry is configured to, when allocating the mounting work of the components to each of the mounters, allocate mounting work of the components considering a tact during each of the work modes for the mounters that have the multiple work modes.
5. The work allocating device according to claim 1 , wherein
the tools include a first tool including a plurality of nozzles and a second tool including a single nozzle, and
a level of accuracy of the second tool including the single nozzle is greater than a level of accuracy of the first tool including the plurality of nozzles.
6. The work allocating device according to claim 1 , wherein the specified component mounting accuracy is a rank.
7. The work allocating device according to claim 1 , wherein a specified component mounting accuracy of a first one of the mounters with movement guided using a bearing is greater than a specified component mounting accuracy of a second one of the mounters with movement guided without using a bearing.
8. The work allocating device according to claim 1 , wherein a specified component mounting accuracy of a first one of the mounters with fewer moving sections is greater than a specified component mounting accuracy of a second one of the mounters with more moving sections that the first one.