Light curing molding ink set, and method for manufacturing light cured article
There is provided a light curing molding ink set used for a manufacturing method for light curing molding using an ink-jet scheme, comprising a combination of a resin composition for a modeling material used for shaping the modeling material and a resin composition for a supporting material used for shaping the supporting material, wherein surface tension Mt (mN/m) of the resin composition for a modeling material is greater than surface tension St (mN/m) of the resin composition for a supporting material, and the surface tension Mt and the surface tension St satisfy the [0<Mt −St<5] expression, and this light curing molding ink set can afford a light cured article having the good dimensional accuracy.
1. A light curing molding ink set used for a manufacturing method for light curing molding using an ink-jet scheme, comprising a combination of a resin composition for a modeling material used for shaping the modeling material and a resin composition for a supporting material used for shaping the supporting material,
wherein surface tension Mt (mN/m) of the resin composition for a modeling material is greater than surface tension St (mN/m) of the resin composition for a supporting material, and the surface tension Mt and the surface tension St satisfy the following (i) expression:
0< Mt−St< 5 (i).
2. The light curing molding ink set according to claim 1 , wherein the surface tension Mt is 26.0 to 33.3 mN/m.
3. The light curing molding ink set according to claim 1 , wherein the resin composition for a modeling material contains a water-insoluble monofunctional ethylenic unsaturated monomer (A), a di- or more-functional polyfunctional ethylenic unsaturated monomer (B), a photopolymerization initiator (C), and a surface adjusting agent (D).
4. The light curing molding ink set according to claim 3 , wherein a content of the water-insoluble monofunctional ethylenic unsaturated monomer (A) is 19 to 49 parts by weight, based on 100 parts by weight of the whole resin composition for a modeling material.
5. The light curing molding ink set according to claim 3 , wherein a content of the di- or more-functional polyfunctional ethylenic unsaturated monomer (B) is 15 to 60 parts by weight, based on 100 parts by weight of the whole resin composition for a modeling material.
6. The light curing molding ink set according to claim 3 , wherein a content of the water-insoluble monofunctional ethylenic unsaturated monomer (A) is 19 to 49 parts by weight, based on 100 parts by weight of the whole resin composition for a modeling material, and a content of the di- or more-functional polyfunctional ethylenic unsaturated monomer (B) is 15 to 60 parts by weight, based on 100 parts by weight of the whole resin composition for a modeling material.
7. The light curing molding ink set according to claim 3 , wherein the resin composition for a modeling material further contains an oligomer.
8. The light curing molding ink set according to claim 7 , wherein a content of the oligomer is 10 to 45 parts by weight, based on 100 parts by weight of the whole resin composition for a modeling material.
9. The light curing molding ink set according to claim 1 , wherein the surface tension St is 24.0 to 33.0 mN/m.
10. The light curing molding ink set according to claim 1 , wherein the resin composition for a supporting material contains a water-soluble monofunctional ethylenic unsaturated monomer (E), polyalkylene glycol comprising an oxyethylene group and/or an oxypropylene group (F), a photopolymerization initiator (C), and a surface adjusting agent (D).
11. The light curing molding ink set according to claim 10 , wherein a content of the water-soluble monofunctional ethylenic unsaturated monomer (E) is 20 to 50 parts by weight, based on 100 parts by weight of the whole resin composition for a supporting material.
12. The light curing molding ink set according to claim 10 , wherein a content of the oxyethylene group and/or an oxypropylene group (F) is 20 to 49 parts by weight, based on 100 parts by weight of the whole resin composition for a supporting material.
13. The light curing molding ink set according to claim 10 , wherein a content of the water-soluble monofunctional ethylenic unsaturated monomer (E) is 20 to 50 parts by weight, based on 100 parts by weight of the whole resin composition for a supporting material, and a content of the oxyethylene group and/or an oxypropylene group (F) is 20 to 49 parts by weight, based on 100 parts by weight of the whole resin composition for a supporting material.
14. The light curing molding ink set according to claim 10 , wherein a number average molecular weight Mn of the oxyethylene group and/or an oxypropylene group (F) is 100 to 5,000.
15. A method for manufacturing a light cured article using the light curing molding ink set as defined in claim 1 by a manufacturing method for light curing molding using an ink-jet scheme, comprising:
a step (I) of discharging a resin composition for a modeling material and a resin composition for a supporting material from an ink-jet head, so that a resin composition layer in which a layer composed of the resin composition for a modeling material and a layer composed of the resin composition for a supporting material are arranged contiguously,
a step (II) of photocuring the resin composition for a modeling material and the resin composition for a supporting material constituting the resin composition layer, respectively, thereby, obtaining a modeling material and a supporting material, and
a step (III) of removing the supporting material, thereby, obtaining a light cured article.