RESIN COMPOSITION FOR MODELING MATERIAL, LIGHT CURING MOLDING INK SET, AND METHOD FOR MANUFACTURING OPTICALLY SHAPED ARTICLE
There is provided a resin composition for a modeling material, used for shaping a modeling material by a manufacturing method for light curing molding using an ink-jet scheme, comprising (A) an ethylenic unsaturated monomer as a photocuring component, (B) a photopolymerization initiator, and (C) a surface adjusting agent, wherein the resin composition for a modeling material has surface tension Mt of 26.0 to 33.0 mN/m, and the resin composition for a modeling material has surface tension Mst represented by the following (i) expression of 33.0 mN/m or more, and this resin composition for a modeling material 4 a can afford a light cured article having the good dimensional accuracy.
1 . A resin composition for a modeling material, used for shaping a modeling material by a manufacturing method for light curing molding using an ink-jet scheme, comprising:
(A) an ethylenic unsaturated monomer as a photocuring component, (B) a photopolymerization initiator, and (C) a surface adjusting agent,
wherein the resin composition for a modeling material has surface tension Mt of 26.0 to 33.0 mN/m, and
the resin composition for a modeling material has surface tension Mst represented by the following (i) expression of 33.0 mN/m or more.
[
Mathematic
1
]
Mst
=
Σ
(
Surface
tension
of
each
photocuring
component
×
content
of
each
photocuring
component
)
Total
content
of
photocuring
components
(
i
)
2 . The resin composition for a modeling material according to claim 1 , wherein the (A) component comprises 70 parts by weight or less of a monofunctional ethylenic unsaturated monomer, based on 100 parts by weight of the whole resin composition for a modeling material.
3 . The resin composition for a modeling material according to claim 2 , wherein the content of the monofunctional ethylenic unsaturated monomer is 5 to 70 parts by weight, based on 100 parts by weight of the whole resin composition for a modeling material.
4 . The resin composition for a modeling material according to claim 1 , wherein the (A) component comprises 70 parts by weight or less of a polyfunctional ethylenic unsaturated monomer, based on 100 parts by weight of the whole resin composition for a modeling material.
5 . The resin composition for a modeling material according to claim 4 , wherein the content of the polyfunctional ethylenic unsaturated monomer is 20 to 70 parts by weight, based on 100 parts by weight of the whole resin composition for a modeling material.
6 . The resin composition for a modeling material according to claim 1 , wherein the content of the (A) component is 80 to 99 parts by weight, based on 100 parts by weight of the whole resin composition for a modeling material.
7 . The resin composition for a modeling material according to claim 1 , wherein the resin composition for a modeling material further contains an oligomer as (D) a photocuring component.
8 . The resin composition for a modeling material according to claim 7 , wherein the content of the (D) component is 10 to 45 parts by weight, based on 100 parts by weight of the whole resin composition for a modeling material.
9 . The resin composition for a modeling material according to claim 1 , wherein the resin composition for a modeling material has the surface tension Mst of 33.0 to 40.0 mN/m.
10 . A light curing molding ink set used for a manufacturing method for light curing molding using an ink-jet scheme, comprising a combination of the resin composition for a modeling material as defined in claim 1 , and a resin composition for a supporting material used for shaping the supporting material,
wherein the resin composition for a supporting material contains (E) a water-soluble monofunctional ethylenic unsaturated monomer, (F) polyalkylene glycol comprising an oxyethylene group and/or an oxypropylene group, (B) a photopolymerization initiator, and (C) a surface adjusting agent.
11 . The light curing molding ink set according to claim 10 , wherein the content of the (E) component is 20 to 50 parts by weight, based on 100 parts by weight of the whole resin composition for a supporting material.
12 . The light curing molding ink set according to claim 10 , wherein the content of the (F) component is 20 to 49 parts by weight, based on 100 parts by weight of the whole resin composition for a supporting material.
13 . The light curing molding ink set according to claim 10 , wherein a number average molecular weight Mn of the (F) component is 100 to 5,000.
14 . The light curing molding ink set according claim 10 , wherein surface tension St of the resin composition for a supporting material is 24.0 to 33.0 mN/m.
15 . A method for manufacturing a light cured article using the light curing molding ink set as defined in claim 10 by a manufacturing method for light curing molding using an ink-jet scheme, comprising:
a step (I) of discharging a resin composition for a modeling material and a resin composition for a supporting material from an ink-jet head, so that a resin composition layer in which a layer composed of the resin composition for a modeling material and a layer composed of the resin composition for a supporting material are arranged contiguously,
a step (II) of photocuring the resin composition for a modeling material and the resin composition for a supporting material constituting the resin composition layer, respectively, thereby, obtaining a modeling material and a supporting material, and
a step (III) of removing the supporting material, thereby, obtaining a light cured article.