Method for producing a composite conductive material and composite material obtained in this way
The present invention relates to a method for producing a conductive composite material, as well as the composite material capable of being obtained by said method. The conductive material is obtained from a composite polymer matrix, which is formed by aggregation of composite conductive particles consisting of particles of a polymer matrix, having a diamter d50 of between 1 and 4000 μm, coated with a layer of electrically conductive material consisting of at least one metal. The ratio of the thickness of the conductive layer to the diameter d50 of the polymer matrix particles is between 0.0025:100 and 1.5:100, said thickness being less than 300 nm.
1. A process for manufacturing a conductive composite material consisting of:
(a) coating particles of a polymer matrix, having a diameter (d50) of between 1 and 4000 μm, with a layer of an electrically conductive material having a thickness of less than 300 nm where the layer consists of at least one metal to form a plurality of conductive composite particles, where the ratio of the thickness of the metal layer to the diameter (d50) of the polymer matrix particles is 0.1:100 to 0.5:100 and the conductive composite particles are not dispersed in a second polymer matrix; and
(b) aggregating the plurality of conductive composite particles to form a composite polymer matrix, wherein aggregating the conductive composite particles is carried out by bringing said conductive composite particles into contact under low shear conditions at a temperature at which the polymer matrix of the conductive composite particles is at least partially molten and coalescing the conductive composite particles.
2. The process according to claim 1 , wherein aggregating the conductive composite particles is achieved using laser sintering, mask sintering, or compression molding of the conductive composite particles.
3. The process according to claim 1 , wherein the substrate is coated with the conductive composite particles before or at the same time as the aggregation step to form an impregnated substrate.
4. The process according to claim 1 , wherein coating and aggregating are carried out simultaneously by dip-coating in a fluidized bed.
5. The process according to claim 1 , wherein coating comprises dry impregnating the substrate with the conductive composite particles and aggregating comprises heat treating the impregnated substrate.
6. The process according to claim 1 , wherein the polymer matrix comprises one or more thermoplastic polymers.
7. The process according to claim 1 , wherein coating particles of a polymer matrix comprises vapor depositing of at least one metal on the surface of said particles of a polymer matrix.
8. A process for manufacturing a conductive composite material consisting of:
(a) coating particles of a polymer matrix, having a diameter (d50) of between 1 and 4000 μm, with a layer of an electrically conductive material having a thickness of less than 300 nm where the layer consists of at least one metal to form a plurality of conductive composite particles, where the ratio of the thickness of the metal layer to the diameter (d50) of the polymer matrix particles is 0.1:100 to 0.5:100 and the conductive composite particles are not dispersed in a second polymer matrix;
(b) aggregating the plurality of conductive composite particles to form a composite polymer matrix, wherein aggregating the conductive composite particles is carried out by bringing said conductive composite particles into contact under low shear conditions at a temperature at which the polymer matrix of the conductive composite particles is at least partially molten and coalescing the conductive composite particles; and
(c) shaping the composite polymer matrix after step (b), so as to form a conductive composite material in the form of a film in which said composite polymer matrix contains a three-dimensional metallic network forming a continuous conductive pathway.
9. A process for manufacturing a conductive composite material consisting of:
(a) coating particles of a polymer matrix, having a diameter (d50) of between 1 and 4000 μm, with a layer of an electrically conductive material having a thickness of less than 300 nm where the layer consists of at least one metal to form a plurality of conductive composite particles, where the ratio of the thickness of the metal layer to the diameter (d50) of the polymer matrix particles is 0.1:100 to 0.5:100 and the conductive composite particles are not dispersed in a second polymer matrix;
(b) aggregating the plurality of conductive composite particles to form a composite polymer matrix, wherein aggregating the conductive composite particles is carried out by bringing said conductive composite particles into contact under low shear conditions at a temperature at which the polymer matrix of the conductive composite particles is at least partially molten and coalescing the conductive composite particles; and
(c) coating a substrate with the conductive composite particles before or at the same time as the aggregating, so as to form a conductive composite material in the form of a film in which said composite polymer matrix contains a three-dimensional metallic network forming a continuous conductive pathway.