Organic optoelectronic component and method for producing an organic optoelectronic component
View Patent ↗In various aspects, an organic optoelectronic component and method for producing an organic optoelectronic component are described. An organic optoelectronic component may include a first electrode, an organic functional layer structure above the first electrode, a second electrode above the organic functional layer structure, an adhesive layer structure, and a protective film. The adhesive layer structure may contain a first adhesive layer above the first adhesive layer, and a second adhesive layer above the first adhesive layer. The first adhesive layer may be cured. The second adhesive layer may be adherent and elastic. The protective film may be above the second adhesive layer. The protective film may contain at least one region that is at least partly separated in a lateral direction.
1. An organic optoelectronic component comprising:
a first electrode;
an insulator configured to insulate the first electrode;
an organic functional layer structure above the first electrode;
a second electrode above the organic functional layer structure;
an encapsulation layer above the second electrode,
wherein the encapsulation layer is configured to protect the organic functional layer structure from moisture;
an adhesive layer structure including
a first adhesive layer above the encapsulation layer and
a second adhesive layer above the first adhesive layer,
wherein the first adhesive layer is cured, and the second adhesive layer is adherent and elastic; and
a protective film above the second adhesive layer,
wherein the protective film includes a region that is partly separated from a further region of the protective film or completely separated from the further region of the protective film, and
wherein the region of the protective film is configured to be completely detached from the second adhesive layer and the further region of the protective film.
2. The organic optoelectronic component of claim 1 ,
wherein the first adhesive layer and the second adhesive layer are integrally formed.
3. The organic optoelectronic component of claim 1 ,
wherein the first adhesive layer and the second adhesive layer have a discrete interface therebetween.
4. The organic optoelectronic component of claim 1 ,
wherein the first adhesive layer comprises a first material and the second adhesive layer comprises a second material, and
wherein the first material and the second material are the same material.
5. The organic optoelectronic component of claim 1 ,
wherein the first adhesive layer comprises a first material and the second adhesive layer comprises a second material, and
wherein the first material and the second material are different materials.
6. The organic optoelectronic component of claim 1 ,
wherein the second adhesive layer has a modulus of elasticity of 1 N/mm 2 to 1000 N/mm 2 .
7. A method for producing an organic optoelectronic component, the method comprising:
forming a first electrode;
forming an insulator,
wherein the insulator is configured to insulate the first electrode;
forming an organic functional layer structure above the first electrode;
forming a second electrode above the organic functional layer structure;
forming an encapsulation layer above the second electrode,
wherein the encapsulation layer is configured to protect the organic functional layer structure from moisture;
forming an adhesive layer structure, the adhesive layer structure including
a first adhesive layer above the encapsulation layer and
a second adhesive layer above the first adhesive layer,
wherein the first adhesive layer is cured, and the second adhesive layer is adherent and elastic; and
arranging a protective film above the second adhesive layer,
wherein the protective film includes a region that is partly separated from a further region of the protective film or completely separated from the further region of the protective film, and
wherein the region of the protective film is configured to be completely detached from the second adhesive layer and from the further region of the protective film.
8. The method of claim 7 ,
wherein forming the adhesive layer structure comprises:
forming the adhesive layer structure, such that the first adhesive layer and the second adhesive layer are integrally formed.
9. The method of claim 7 ,
wherein forming the adhesive layer structure comprises:
forming the adhesive layer structure, such that the first adhesive layer and the second adhesive layer have a discrete interface therebetween.
10. The method of claim 7 ,
wherein the first adhesive layer comprises a first material and the second adhesive layer comprises a second material, and
wherein the first material and the second material are the same material.
11. The method of claim 7 ,
wherein the first adhesive layer comprises a first material and the second adhesive layer comprises a second material, and
wherein the first material and the second material are different materials.
12. The method of claim 7 ,
wherein the first adhesive layer is pre-crosslinked for radiation curing in the ultraviolet wavelength range.
13. The method of claim 7 ,
wherein the second adhesive layer is post-cured.
14. The organic optoelectronic component of claim 6 ,
wherein the second adhesive layer has a modulus of elasticity of 10 N/mm 2 to 100 N/mm 2 .
15. The organic optoelectronic component of claim 1 ,
wherein the region of the protective film is partially separated from the further region of the protective film by a perforation.
16. The method of claim 7 ,
stamping the protective film such that the region of the protective film is partly separated from the further region of the protective film or completely separated from the further region of the protective film.
17. An organic optoelectronic component comprising:
a first electrode;
a first contact section;
an insulation barrier configured to electrically insulate the first electrode from the first contact section;
an organic functional layer structure above the first electrode;
a second electrode above the organic functional layer structure;
an encapsulation layer above the second electrode,
wherein the encapsulation layer is configured to protect the organic functional layer structure from moisture;
an adhesive layer structure including
a first adhesive layer above the encapsulation layer, and
a second adhesive layer directly above the first adhesive layer,
wherein the first adhesive layer is cured, and the second adhesive layer is adherent and elastic; and
a protective film above the second adhesive layer,
wherein the protective film includes a plurality of regions that are partly separated from a further region of the protective film or completely separated from the further region of the protective film, and
wherein the plurality of regions of the protective film are configured to be completely detached from the second adhesive layer and from the further region of the protective film.
18. The organic optoelectronic component of claim 17 ,
wherein the second adhesive layer is configured to adhere, in part, to a surface external to the organic optoelectronic component in response to a region of the plurality of regions of the protective film being detached from the second adhesive layer.
19. The organic optoelectronic component of claim 17 ,
wherein the protective film includes a glass material, and
wherein the glass material includes a metal layer.