Organic optoelectronic component and method of preventing the analysis of the material composition of an organic optoelectronic component
View Patent ↗A method of preventing an analysis of the material composition of an organic optoelectronic component includes: A) providing an organic optoelectronic component having a functional component part and a camouflage layer, and B) determining an overall analysis spectrum of the organic optoelectronic component by IR or X-ray radiation, wherein the overall analysis spectrum is composed of a first analysis spectrum of the functional component part and a second analysis spectrum of the camouflage layer, and determination of the first and/or second analysis spectrum from the overall analysis spectrum is made more difficult or prevented so that, due to the camouflage layer, determination of the material composition of the functional component part is made difficult or prevented.
1. A method of preventing an analysis of the material composition of an organic optoelectronic component comprising:
A) providing an organic optoelectronic component comprising a functional component part and a camouflage layer, and
B) determining an overall analysis spectrum of the organic optoelectronic component by IR or X-ray radiation,
wherein the overall analysis spectrum is composed of a first analysis spectrum of the functional component part and a second analysis spectrum of the camouflage layer, and
determination of the first and/or second analysis spectrum from the overall analysis spectrum is prevented so that, due to the camouflage layer, determination of the material composition of the functional component part is prevented.
2. The method according to claim 1 , wherein the first and second analysis spectra are each an IR or Raman spectrum.
3. The method according to claim 1 , wherein the first and second analysis spectra are each an EDX spectrum.
4. The method according to claim 1 , wherein the camouflage layer is arranged between a second electrode and an encapsulation, and the second electrode is arranged downstream of a first electrode.
5. The method according to claim 1 , wherein the camouflage layer is arranged between a substrate and a first electrode.
6. The method according to claim 1 , wherein the camouflage layer is arranged outside a beam path of electromagnetic radiation of the functional component part.
7. The method according to claim 1 , wherein the camouflage layer has a thickness of 20 nm to 5000 nm.
8. The method according to claim 1 , wherein an encapsulation has a layer structure comprising a protective layer and an adhesive layer, and the camouflage layer is arranged between the protective layer and the adhesive layer.
9. The method according to claim 8 , further comprising another camouflage layer, wherein the another camouflage layer has a different material composition compared to the camouflage layer, and the another camouflage layer is arranged between the organic functional layer stack and the adhesive layer.
10. The method according to claim 1 , wherein an encapsulation has a layer structure comprising a protective layer and an adhesive layer, the adhesive layer forms the camouflage layer, and the adhesive layer has IR-active materials that impedes or prevents an analysis of the material composition of the functional component part.
11. The method according to claim 1 , wherein the camouflage layer contains materials not present in the functional component part.
12. The method according to claim 1 , wherein the camouflage layer contains an inorganic material or an oxide of the inorganic material selected from the group consisting of Si, In, Al, Ag, Cu, Pt, Ti, Ir, Sn and Zn.
13. The method according to claim 1 , wherein the camouflage layer contains an organic polymeric material selected from the group consisting of polyimide, poly (p-phenylene), poly (p-phenylene-vinylene), acrylate, epoxide, silicone and polyurethane.
14. The method according to claim 1 , wherein the camouflage layer is arranged at a side of the organic functional layer stack facing away from an emission surface.
15. The method according to claim 1 , wherein the camouflage layer contains an inorganic material or an oxide of the inorganic material selected from the group consisting of In, Al, Ag, Cu, Pt, Ti, Ir, Sn and Zn.
16. An organic optoelectronic component, comprising a functional component part and a camouflage layer, wherein the functional component part comprises
a substrate,
a first electrode on the substrate,
an organic functional layer stack on the first electrode,
a second electrode arranged at least in regions on the organic functional layer stack, and
an encapsulation on the second electrode,
wherein the functional component part emits electromagnetic radiation and has a first analysis spectrum,
the camouflage layer has a second analysis spectrum,
the first analysis spectrum and the second analysis spectrum are different from one another, overlap at least in some regions, and form an overall analysis spectrum of the organic optoelectronic component such that, due to the camouflage layer, an analysis of the material composition of the functional component part is prevented.
17. The method according to claim 16 , wherein the encapsulation comprises a plurality of layers.