Antimony-free radiation curable compositions for additive fabrication, and applications thereof in investment casting processes
Radiation curable compositions for additive fabrication are described and claimed. Such compositions are particularly suited for investment casting applications, and include a cationically polymerizable component, a radically polymerizable component, a certain type of prescribed antimony-free, sulfonium salt-based cationic photoinitiator, and a free-radical photoinitiator. In other embodiments, the composition may also include a photosensitizer and/or a UV/absorber. Also described and claimed is a method for using a liquid radiation curable resin for additive fabrication with a certain type of prescribed antimony-free, sulfonium salt-based cationic photoinitiator and a certain type of prescribed photosensitizer in an investment casting process.
1. A method of using a component photocured via additive fabrication in an investment casting process, the method comprising the steps of:
(a) arranging one or more components photocured via an additive fabrication process into a desired configuration to form a configuration pattern;
(b) coating said configuration pattern with a refractory material to create an investment;
(c) heating said investment sufficiently to burn off the configuration pattern, thereby forming an investment mold with at least one void;
(d) directing a molten material to flow into the void of the investment mold, thereby filling said void;
(e) cooling the molten material, such that it crystallizes or solidifies; and
(f) removing said investment mold to create an investment casting;
wherein the one or more components contain, prior to photocuring via an additive fabrication process, a first antimony-free photoinitiator with
an anion selected from the group consisting of PF 6 − , BF 4 − , ((CF 3 ) 2 C 6 H 3 ) 4 B − , (C 6 F 5 ) 4 Ga − , ((CF 3 ) 2 C 6 H 3 ) 4 Ga − , trifluoromethanesulfonates, nonafluorobutanesulfonates, methanesulfonates, butanesulfonates, benzenesulfonates, p-toluenesulfonates, and PF α (R f ) β , wherein α and β are the same or different and are integers from 1-8, and R f contains a carbon atom and a halogen atom, and
a cation of the following general formula:
wherein R 2 , R 3 , R 5 and R 6 each independently represent an alkyl group, a hydroxy group, an alkoxy group, an alkylcarbonyl group, an arylcarbonyl group, an alkoxycarbonyl group, an aryloxycarbonyl group, an arylthiocarbonyl group, an acyloxy group, an arylthio group, an alkylthio group, an aryl group, a heterocyclic hydrocarbon group, an aryloxy group, an alkylsulfinyl group, an arylsulfinyl group, an alkylsulfonyl group, an arylsulfonyl group, a hydroxy(poly)alkyleneoxy group, an optionally substituted amino group, a cyano group, a nitro group, or a halogen atom, R 4 represents an alkyl group, a hydroxy group, an alkoxy group, an alkylcarbonyl group, an alkoxycarbonyl group, an acyloxy group, an alkylthio group, a heterocyclic hydrocarbon group, an alkylsulfinyl group, an alkylsulfonyl group, a hydroxy(poly)alkyleneoxy group, an optionally substituted amino group, a cyano group, a nitro group, or a halogen atom, m 1 to m 6 each represent the number of occurrences of each of R 1 to R 6 , m 1 , m 4 , and m 6 each represent an integer of 0 to 5, and m 2 , m 3 , and m 5 each represent an integer of 0 to 4.
2. The method of claim 1 , wherein the one or more components additionally contain, prior to photocuring via an additive fabrication process, an antimony-free photosensitizer, said antimony-free photosensitizer possessing the following structure:
wherein R 1 -R 14 are independently H or a C 1 -C 8 saturated or unsaturated, branched or unbranched, substituted, or unsubstituted hydrocarbyl.
3. The method of claim 2 , wherein the one or more components further optionally comprises, prior to photocuring via an additive fabrication process, a hydroxy-substituted benzophenone compound.
4. The method of claim 3 , wherein the benzophenone compound comprises 2-hydroxy-4-methoxybenzophenone, 2,4-dihydroxybenzophenone, or 2-hydroxy-4-n-octoxybenzophenone.
5. The method of claim 4 , wherein the one or more components possess an ash content, after the heating step, of less than 0.1%.
6. The method of claim 5 , wherein the configuration pattern, after the heating step wherein the configuration has been burned off, possesses an ash content of less than 0.1%.
7. The method of claim 5 , wherein the one or more components possess an ash content, after the heating step, of less than 0.01%.
8. The method of claim 7 , wherein the one or more components possess an ash content, after the heating step, of less than 0.005%.
9. The method of claim 6 , wherein the configuration pattern, after the heating step wherein the configuration has been burned off, possesses an ash content of less than 0.01%.
10. The method of claim 9 , wherein the configuration pattern, after the heating step wherein the configuration has been burned off, possesses an ash content of less than 0.005%.