Infrared emitter
An infrared emitter is provided. The infrared emitter includes a substrate made of an electrically insulating material. The substrate includes a surface that contacts a printed conductor made of a resistor material that is electrically conducting and generates heat when current flows through it. The electrically insulating material includes an amorphous matrix component into which an additional component is embedded that absorbs in the spectral range of infrared radiation. At least a part of the surface is configured with a cover layer made of porous glass, whereby the printed conductor is embedded, at least in part, in the cover layer.
1. An infrared emitter, comprising:
a substrate made of an electrically insulating material, the substrate including a surface that contacts a printed conductor made of a resistor material that is electrically conducting and generates heat when current flows through it, wherein the electrically insulating material includes an amorphous matrix component into which an additional component is embedded that absorbs in the spectral range of infrared radiation, and wherein at least a part of the surface is configured with a cover layer made of porous glass, whereby the printed conductor is embedded, at least in part, in the cover layer, wherein a type and an amount of the additional component are present such as to effect, in the electrically insulating material at a temperature of 600° C., an emissivity ε of at least 0.6 for wavelengths between 2 and 8 μm.
2. The infrared emitter according to claim 1 wherein the amorphous matrix component is quartz glass.
3. The infrared emitter according to claim 1 , wherein a weight fraction of the additional component is in the range of 0.1 to 5%.
4. The infrared emitter according to claim 1 , wherein the additional component is present as a separate additional component phase and comprises a non-spherical morphology with maximal mean dimensions of less than 20 μm, but preferably of more than 3 μm.
5. The infrared emitter according to claim 1 , wherein the additional component contains a semiconducting material in elemental form.
6. The infrared emitter according to claim 1 , wherein the electrically insulating material exhibits a closed porosity of less than 0.5% and has a specific density of at least 2.19 g/cm 3 .
7. The infrared emitter according to claim 1 , wherein the printed conductor is provided as a burnt-in cover film layer.
8. The infrared emitter according to claim 1 , wherein the printed conductor is provided as a line pattern covering a surface of the substrate such that an intervening space of at least 1 mm remains between neighbouring sections of the printed conductor.
9. The infrared emitter according to claim 1 , wherein the printed conductor is covered by an electrically insulating, gas-tight layer.
10. The infrared emitter according to claim 1 , wherein the infrared emitter is designed as a panel infrared emitter, whereby the substrate comprises a planar emission surface that faces away from the printed conductor and emits infrared radiation, whereby the infrared radiation generates an irradiation intensity at a distance of 10 mm from the emission surface, which measured at ten measuring sites spaced 5 mm from each other deviates by no more than +/−10% from a maximum value of the irradiation intensity at any of the measuring sites.
11. The infrared emitter according to claim 1 wherein a type and an amount of the additional component are present such as to effect, in the electrically insulating material at a temperature of 1000° C., an emissivity c of at least 0.75 for wavelengths between 2 and 8 μm.
12. The infrared emitter according to claim 2 wherein the quartz glass has a chemical purity of at least 99.99% SiO 2 and a cristobalite content of at most 1%.
13. The infrared emitter according to claim 4 wherein the separate additional component phase comprises a non-spherical morphology with maximal mean dimensions of more than 3 μm and less than 20 μm.
14. The infrared emitter according to claim 5 wherein the additional component contains silicon in elemental form.
15. The infrared emitter according to claim 1 wherein the printed conductor is provided as a line pattern covering a surface of the substrate such that an intervening space of at least 2 mm remains between neighbouring sections of the printed conductor.
16. An infrared emitter, comprising:
a substrate made of an electrically insulating material, the substrate including a surface that contacts a printed conductor made of a resistor material that is electrically conducting and generates heat when current flows through it, wherein the electrically insulating material includes an amorphous matrix component into which an additional component is embedded that absorbs in the spectral range of infrared radiation, and wherein at least a part of the surface is configured with a cover layer made of porous glass, whereby the printed conductor is embedded, at least in part, in the cover layer, wherein a type and an amount of the additional component are present such as to effect, in the electrically insulating material at a temperature of 1000° C., an emissivity ε of at least 0.75 for wavelengths between 2 and 8 μm.
17. The infrared emitter according to claim 16 , wherein a weight fraction of the additional component is in the range of 0.1 to 5%.
18. The infrared emitter according to claim 16 , wherein the additional component contains a semiconducting material in elemental form.
19. The infrared emitter according to claim 16 , wherein the infrared emitter is designed as a panel infrared emitter, whereby the substrate comprises a planar emission surface that faces away from the printed conductor and emits the infrared radiation, whereby the infrared radiation generates an irradiation intensity at a distance of 10 mm from the emission surface, which measured at ten measuring sites spaced 5 mm from each other deviates by no more than +/−10% from a maximum value of the irradiation intensity at any of the measuring sites.
20. The infrared emitter according to claim 1 , wherein the amorphous matrix component is quartz glass and the additional component contains silicon in elemental form.