Switched-capacitor network packaged with load

1. An apparatus comprising a charge pump for use in a power converter, said charge pump being packaged with a load that receives charge provided by said charge pump, said charge pump comprising a plurality of switches that, when connected to a plurality of capacitors, cause said plurality of capacitors to assume a selected configuration, said switches being configured to cause transitions between said configurations of said capacitors, wherein said charge pump comprises a first terminal and a second terminal, and wherein said charge pump transforms a first voltage at said first terminal into a second voltage at said second terminal, wherein the charge pump is configured such that at least some charge that leaves said charge pump passes through an inductor.

2. The apparatus of claim 1 , further comprising a power converter, said power converter comprising a power-converter controller, said charge pump, and a regulator, wherein said power-converter controller comprises a regulator-controller that controls said regulator and a charge-pump controller that controls said charge pump.

3. The apparatus claim 2 , wherein said power converter further comprises a magnetic filter, wherein said regulator is coupled to an input of said charge pump and said magnetic filter is coupled to an output of said charge pump, wherein power that passes through said regulator bypasses said charge pump and said magnetic filter.

4. The apparatus of claim 1 , further comprising a printed-circuit board, a motherboard, solder bumps, and a first die, wherein said printed-circuit board comprises a first face and a second face opposed to said first face, wherein said first die comprises circuitry that consumes power provided by said power converter, wherein said first die protrudes from said first face, wherein said power converter protrudes from said second face, wherein said solder bumps protrude from said second face, wherein an extent to which said power converter protrudes from said second face is less than an extent to which said solder bumps protrude from said second face, whereby, when said printed-circuit board is mounted to said motherboard with said second face facing said motherboard, a gap formed by said solder bumps is sufficient to accommodate said power converter.

5. The apparatus of claim 1 , further comprising a printed-circuit board, a motherboard, a socket layer, and a first die, wherein said printed-circuit board comprises a first face and a second face opposed to said first face, wherein said socket layer is disposed on said motherboard, wherein said socket layer defines a recess, wherein said first die comprises circuitry that consumes power provided by said power converter, wherein said first die protrudes from said first face, wherein said power converter protrudes from said second face, wherein, when said printed-circuit board is mounted to said socket layer with said second face facing said motherboard, said recess defined by said socket layer accommodates said power converter.

6. The apparatus of claim 1 , further comprising a printed-circuit board, a motherboard, and a first die, wherein said motherboard defines an accommodation space, wherein said power converter comprises plural second dies and passive components, wherein said second dies comprise active elements of said power converter, wherein said printed-circuit board comprises a first face and a second face opposed to said first face, wherein said first die comprises circuitry that consumes power provided by said power converter, wherein said first die protrudes from said first face, wherein said second dies protrudes from said first face, wherein said passive components protrude from said second face, wherein, when said printed-circuit board is mounted to said motherboard with said second face facing said motherboard, said accommodation space accommodates said passive components.

7. The apparatus claim 2 , wherein said power converter further comprises a magnetic filter coupled to an output of said charge pump, an input of which couples to said regulator, wherein power that passes through said regulator passes through said charge pump and said magnetic filter.

8. The apparatus of claim 1 , wherein said switches define plural paths along which charge stored in said capacitors is transferred between said first and second terminals.

9. An apparatus comprising a charge pump for use in a power converter, said charge pump being packaged with a load that receives charge provided by said charge pump, said charge pump comprising a plurality of switches that, when connected to a plurality of capacitors, cause said plurality of capacitors to assume a selected configuration, said switches being configured to cause transitions between said configurations of said capacitors, wherein said charge pump comprises a first terminal and a second terminal, and wherein said charge pump transforms a first voltage at said first terminal into a second voltage at said second terminal, said apparatus further comprising a magnetic filter connected to said charge pump thereby causing said charge pump to operate at least partially adiabatically.

10. The apparatus of claim 9 , further comprising a communication link between a controller of said charge pump and said load to receive instructions from said load.

11. The apparatus of claim 9 , further comprising a regulator connected to said charge pump.

12. The apparatus of claim 9 , further comprising a printed-circuit board, a motherboard, and a first die, wherein said printed-circuit board comprises a first face and a second face opposed to said first face, wherein said motherboard comprises walls forming a hole therethrough, wherein said first die comprises circuitry that consumes power provided by said power converter, wherein said first die protrudes from said first face, wherein said power converter protrudes from said second face, wherein, when said printed-circuit board is mounted to said motherboard with said second face facing said motherboard, said hole accommodates said power converter.

13. The apparatus of claim 9 , further comprising a printed-circuit board, a motherboard, and a first die, wherein said motherboard defines an accommodation space, wherein said power converter comprises a second die and passive components, wherein said second die comprises active elements of said power converter, wherein said printed-circuit board comprises a first face and a second face opposed to said first face, wherein said first die comprises circuitry that consumes power provided by said power converter, wherein said first die protrudes from said first face, wherein said second die protrudes from said first face, wherein said passive components protrude from said second face, wherein, when said printed-circuit board is mounted to said motherboard with said second face facing said motherboard, said accommodation space accommodates said passive components.

14. The apparatus of claim 13 , further comprising a heat spreader disposed to be in thermal communication with both said first die and said at least one second die.

15. An apparatus comprising a charge pump for use in a power converter, said charge pump being packaged with a load that receives charge provided by said charge pump, said charge pump comprising a plurality of switches that, when connected to a plurality of capacitors, cause said plurality of capacitors to assume a selected configuration, said switches being configured to cause transitions between said configurations of said capacitors, wherein said charge pump comprises a first terminal and a second terminal, and wherein said charge pump transforms a first voltage at said first terminal into a second voltage at said second terminal, said apparatus further comprising a printed-circuit board having opposed first and second faces and a first die protruding from said first face, wherein at least a portion of said power converter protrudes from said second face, wherein said printed-circuit board is mounted to be in electrical communication with said motherboard, wherein said second face faces said motherboard, and wherein an accommodation space receives said at least a portion of said power converter.

16. The apparatus of claim 15 , wherein said power converter comprises a second die, a charge-transfer capacitor, and an inductor, wherein said power converter is controlled by a power-converter controller that comprises circuitry on said second die, wherein said charge-transfer capacitor is a constituent of said charge pump, wherein said inductor is a constituent of a regulator, and wherein said second die, said inductor, and said charge-transfer capacitor are mounted on said first face of said printed-circuit board.

17. The apparatus of claim 15 , wherein said power converter comprises a package, a second die, a charge-transfer capacitor, and an inductor, wherein said package comprises a substrate that defines an upper layer and a lower layer, wherein a power-converter controller that controls said power converter comprises circuitry on said second die, wherein said charge-transfer capacitor is a constituent of said charge pump, wherein said inductor is a constituent of said regulator that is connected to said charge pump, wherein said package is mounted on said first face of said printed-circuit board, wherein said second die is integrated into said lower layer, and wherein said charge-transfer capacitor is integrated into said upper layer.

18. The apparatus of claim 15 , wherein said power converter further comprises a second die, a package, and first and second interconnect layers within said package, wherein said second die has a device face that faces one of said first and second interconnect layers, wherein said first interconnect layer is connected to said printed-circuit board to provide a connection to said second interconnect layer, wherein, when said device face of said second die faces said first interconnect layer, said second interconnect layer connects only to components in said upper layer, and wherein, when said device face of said second die faces said second interconnect layer, said second interconnect layer connects to components in an upper layer of said upper layer and to said second die.

19. The apparatus of claim 15 , wherein said power converter further comprises thermally-conducting bumps or a thermally-conducting pad configured to provide a path for heat to flow to said printed-circuit board.

20. The apparatus of claim 15 , wherein said first die comprises an array of logic gates and a clock, wherein said array is configured to load and execute instructions in synchrony with a clock signal provided by said clock.

21. The apparatus of claim 15 , wherein said first die comprises an array of programmable logic gates.

22. The apparatus of claim 15 , wherein said power converter further comprises a thermally-conducting pad configured to provide a path for heat to flow to said printed-circuit board.