LED metal pad configuration for optimized thermal resistance
View Patent ↗An electronic device is described. The electronic device includes a body having a first surface and a second surface opposite the first surface. The first surface of the body is a first surface of the electronic the device. The electronic device also has a second surface opposite the first surface. A metal pattern is disposed on the second surface of the electronic device. The metal pattern includes a first electrode, a second electrode, and at least two thermal pads. The at least two thermal pads are electrically isolated from the first electrode and the second electrode, are located along opposite sides of the second surface of the electronic device, and have substantially identical shapes.
1. An electronic device comprising:
a body having a first surface and a second surface opposite the first surface, the first surface being a first surface of the electronic device, the electronic device having a second surface opposite the first surface; and
a metal pattern disposed on the second surface of the electronic device, the metal pattern comprising:
a first electrode,
a second electrode, and
at least two thermal pads, electrically isolated from the first electrode and second electrode, the at least two thermal pads being located along opposite sides of the second surface of the electronic device and having substantially identical shapes.
2. The electronic device of claim 1 , wherein: the second surface of the electronic device is a surface of the body that is opposite the first surface of the body, and the first electrode, the second electrode and the at least two thermal pads are directly coupled to the second surface of the body.
3. The electronic device of claim 1 , wherein: the body is a semiconductor die that is mounted on a first surface of a submount, and the second surface of the electronic device is a second surface of the submount that is opposite the first surface of the submount.
4. The electronic device of claim 1 , wherein: the body is a semiconductor die, and the second surface of the electronic device is second surface of the body.
5. The electronic device of claim 1 , wherein: the body comprises a plurality of dies mounted on a first surface of a submount, and the second surface of the electronic device is a second surface of the submount that is opposite the first surface of the submount.
6. The electronic device of claim 1 , wherein: the first electrode and the second electrode are located along a center line of the second surface of the electronic device, and the thermal pads are each located on opposite sides of the center line.
7. The electronic device of claim 1 , wherein each of the thermal pads is larger than each of the first electrode and second electrode.
8. The electronic device of claim 1 , wherein: the thermal pads are rectangular and are located diagonal from one another on opposite sides of a center line of the second surface of the electronic device, and the first electrode and second electrode are rectangular and located diagonal from one another on opposite sides of the center line in different locations than the thermal pads.
9. The electronic device of claim 1 , wherein: the thermal pads are triangular and are located opposite one another on opposite sides of a first center line of the second surface of the electronic device, and the first electrode and second electrode are triangular and located opposite one another on opposite sides of a second center line of the second surface of the electronic device that crosses the first center line.
10. The electronic device of claim 1 , wherein the body further comprises a transparent substrate.
11. The electronic device of claim 1 , wherein each of the thermal pads has a surface area larger than a surface area of each of the cathode electrode and the anode electrode.
12. The electronic device of claim 1 , wherein surface areas of each of the thermal pads, the cathode electrode and the anode electrode are equal.