Solid electrolytic capacitor with improved leakage current
A capacitor assembly that is capable of exhibiting good electrical properties even under a variety of conditions is provided. More particularly, the capacitor contains a capacitor element that includes a sintered porous anode body, a dielectric that overlies the anode body, and a solid electrolyte that overlies the dielectric. The solid electrolyte contains an adhesion layer that is positioned between an inner conductive polymer layer and an outer conductive polymer layer. The adhesion layer is formed from an organometallic compound and the outer layer is formed from pre-polymerized conductive polymer particles.
1. A capacitor assembly comprising a capacitor element, the capacitor element comprising:
a sintered porous anode body;
a dielectric that overlies the anode body;
a solid electrolyte that overlies the dielectric and contains an adhesion layer positioned between an inner conductive polymer layer and an outer conductive polymer layer, wherein the adhesion layer is formed from an organometallic compound, wherein the outer conductive polymer layer is formed from a dispersion of pre-polymerized conductive polymer particles that contain a polymeric counterion and an extrinsically conductive polymer, wherein the extrinsically conductive polymer is poly(3,4-ethylenedioxythiophene), and wherein 70 wt. % or more of the outer conductive polymer layer is formed from the pre-polymerized conductive polymer particles.
2. The capacitor assembly of claim 1 , wherein the anode body includes tantalum and the dielectric includes tantalum pentoxide.
3. The capacitor assembly of claim 1 , wherein the organometallic compound has the following general formula:
wherein,
M is an organometallic atom;
R 1 , R 2 , and R 3 are independently an alkyl or a hydroxyalkyl, wherein at least one of R 1 , R 2 , and R 3 is a hydroxyalkyl;
n is an integer from 0 to 8; and
X is an organic or inorganic functional group.
4. The capacitor assembly of claim 3 , wherein M is silicon.
5. The capacitor assembly of claim 4 , wherein the hydroxyalkyl is OCH 3 .
6. The capacitor assembly of claim 3 , wherein R 1 , R 2 , and R 3 are a hydroxyalkyl.
7. The capacitor assembly of claim 1 , wherein the organometallic compound is 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-aminopropylmethyldimethoxysilane, 3-aminopropylmethyldiethoxysilane, 3-(2-aminoethyl)aminopropyltrimethoxysilane, 3-mercaptopropyltrimethoxysilane, 3-mercaptopropyltriethoxysilane, 3-mercaptopropylmethyldimethoxysilane, 3-mercaptopropylmethyldiethoxysilane, glycidoxymethyltrimethoxysilane, glycidoxymethyltriethoxysilane, glycidoxymethyl-tripropoxysilane, glycidoxymethyltributoxysilane, β-glycidoxyethyltrimethoxysilane, β-glycidoxyethyltriethoxysilane, β-glycidoxyethyl-tripropoxysilane, β-glycidoxyethyl-tributoxysilane, β-glycidoxyethyltrimethoxysilane, α-glycidoxyethyltriethoxysilane, α-glycidoxyethyltripropoxysilane, α-glycidoxyethyltributoxysilane, γ-glycidoxypropyl-trimethoxysilane, γ-glycidoxypropyltriethoxysilane, γ-glycidoxypropyl-tripropoxysilane, γ-glycidoxypropyltributoxysilane, β-glycidoxypropyltrimethoxysilane, β-glycidoxypropyl-triethoxysilane, β-glycidoxypropyltripropoxysilane, α-glycidoxypropyltributoxysilane, α-glycidoxypropyltrimethoxysilane, α-glycidoxypropyltriethoxysilane, α-glycidoxypropyl-tripropoxysilane, α-glycidoxypropyltributoxysilane, γ-glycidoxybutyltrimethoxysilane, δ-glycidoxybutyltriethoxysilane, δ-glycidoxybutyltripropoxysilane, δ-glycidoxybutyl-tributoxysilane, δ-glycidoxybutyltrimethoxysilane, γ-glycidoxybutyltriethoxysilane, γ-glycidoxybutyltripropoxysilane, γ-propoxybutyltributoxysilane, δ-glycidoxybutyl-trimethoxysilane, δ-glycidoxybutyltriethoxysilane, δ-glycidoxybutyltripropoxysilane, α-glycidoxybutyltrimethoxysilane, α-glycidoxybutyltriethoxysilane, α-glycidoxybutyl-tripropoxysilane, α-glycidoxybutyltributoxysilane, or a combination thereof.
8. The capacitor assembly of claim 1 , wherein the inner conductive polymer layer is formed from an in situ-polymerized conductive polymer.
9. The capacitor assembly of claim 8 , wherein the inner conductive polymer layer is formed by reacting 3,4-ethylenedioxythiophene with an oxidative catalyst, wherein the catalyst includes an iron (III) salt of an aromatic sulfonic acid.
10. The capacitor assembly of claim 1 , wherein at least a portion of the pre-polymerized conductive polymer particles in the outer conductive polymer layer have an average size of from about 1 to about 80 nanometers.
11. The capacitor assembly of claim 1 , further comprising a pre-coat layer that overlies the dielectric and contains an organometallic compound.
12. The capacitor assembly of claim 1 , further comprising an external polymer coating that overlies the solid electrolyte and contains a second plurality of pre-polymerized conductive polymer particles and a cross-linking agent.
13. The capacitor assembly of claim 12 , wherein at least a portion of the second plurality of pre-polymerized conductive polymer particles in the external polymer coating have an average size of from about 80 to about 500 nanometers.
14. The capacitor assembly of claim 1 , further comprising:
an anode termination that is in electrical connection with the anode body;
a cathode termination that is in electrical connection with the solid electrolyte; and
a housing that encloses the capacitor element and leaves exposed at least a portion of the anode termination and the cathode termination.
15. The capacitor assembly of claim 14 , wherein the housing is formed from a resinous material that encapsulates the capacitor element.
16. The capacitor assembly of claim 14 , wherein the housing defines an interior cavity within which the capacitor element is positioned, wherein the interior cavity has a gaseous atmosphere that includes an inert gas.
17. The capacitor assembly of claim 1 , wherein after being subjected to an applied voltage for 90 seconds, the capacitor assembly exhibits a leakage current of about 50 microamps or less.
18. The capacitor assembly of claim 1 , wherein after being subjected to an applied voltage for 180 seconds, the capacitor assembly exhibits a leakage current that is greater than 50% of the leakage current exhibited after being subjected to the applied voltage for 90 seconds.
19. The capacitor assembly of claim 18 , wherein the capacitor assembly exhibits a leakage current of about 20 microamps or less after being subjected to the applied voltage for 180 seconds.
20. The capacitor assembly of claim 1 , wherein the outer conductive polymer layer is generally free of in situ-polymerized conductive polymers.
21. A method for forming a capacitor assembly, the method comprising:
anodically oxidizing a sintered porous anode body to form a dielectric that overlies the sintered porous anode body;
polymerizing a conductive polymer precursor monomer in the presence of an oxidative catalyst to form an inner solid electrolyte layer that overlies the dielectric;
applying a solution that includes an organometallic compound to form an adhesion layer that overlies the inner solid electrolyte layer, wherein the organometallic compound has the following general formula:
wherein,
M is an organometallic atom;
R 1 , R 2 , and R 3 are independently an alkyl or a hydroxyalkyl, wherein at least one of R 1 , R 2 , and R 3 is a hydroxyalkyl;
n is an integer from 0 to 8; and
X is an organic or inorganic functional group; and
applying a dispersion of conductive polymer particles to form an outer solid electrolyte layer that overlies the adhesion layer, and wherein the outer solid electrolyte layer is formed from a dispersion of pre-polymerized conductive polymer particles that contain a polymeric counterion and an extrinsically conductive polymer, wherein the extrinsically conductive polymer is poly(3,4-ethylenedioxythiophene), and wherein 70 wt. % or more of the outer solid electrolyte layer is formed from the conductive polymer particles.
22. The method of claim 21 , wherein the solution includes an organic solvent.
23. The method of claim 22 , further comprising drying the solution after application to the anode.
24. The method of claim 21 , wherein the precursor monomer and oxidative catalyst are sequentially applied.
25. The method of claim 21 , wherein at least a portion of the conductive polymer particles have an average size of from about 1 to about 80 nanometers.